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公开(公告)号：TWI424543B
公开(公告)日：2014-01-21
申请号：TW100100454
申请日：2011-01-06
Inventor： 沈文維 , SHEN, WEN WEI , 莊曜群 , CHUANG, YAO CHUN , 陳承先 , CHEN, CHEN SHIEN , 陳明發 , CHEN, MING FA
IPC: H01L23/488 , H01L21/60
CPC classification number: H01L24/13 , H01L23/3114 , H01L23/3192 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/023 , H01L2224/0239 , H01L2224/0345 , H01L2224/03462 , H01L2224/0401 , H01L2224/05008 , H01L2224/05022 , H01L2224/05073 , H01L2224/05083 , H01L2224/05124 , H01L2224/05139 , H01L2224/05147 , H01L2224/05166 , H01L2224/05184 , H01L2224/05582 , H01L2224/05647 , H01L2224/05666 , H01L2224/05681 , H01L2224/10126 , H01L2224/10156 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11474 , H01L2224/11849 , H01L2224/11903 , H01L2224/1308 , H01L2224/13099 , H01L2224/13111 , H01L2224/13116 , H01L2224/13564 , H01L2224/13566 , H01L2224/1357 , H01L2224/13582 , H01L2224/13583 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13669 , H01L2224/13684 , H01L2224/16148 , H01L2224/81193 , H01L2224/81898 , H01L2225/06513 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15788 , H01L2924/01007 , H01L2224/13655 , H01L2224/13664 , H01L2924/00
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公开(公告)号：TWI437679B
公开(公告)日：2014-05-11
申请号：TW099136436
申请日：2010-10-26
Inventor： 沈文維 , SHEN, WEN WEI , 施應慶 , SHIH, YING CHING , 陳承先 , CHEN, CHEN SHIEN , 陳明發 , CHEN, MING FA
IPC: H01L23/52 , H01L21/768
CPC classification number: H01L25/0657 , H01L21/486 , H01L23/3114 , H01L23/3192 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L23/5384 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L25/50 , H01L2224/0345 , H01L2224/03452 , H01L2224/0381 , H01L2224/03831 , H01L2224/0401 , H01L2224/0557 , H01L2224/05572 , H01L2224/05647 , H01L2224/05666 , H01L2224/05681 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/1162 , H01L2224/11622 , H01L2224/1181 , H01L2224/11849 , H01L2224/11903 , H01L2224/13016 , H01L2224/13025 , H01L2224/13084 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13155 , H01L2224/13169 , H01L2224/1354 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/81193 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06568 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15788 , H01L2224/05552 , H01L2924/00
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公开(公告)号：TWI543321B
公开(公告)日：2016-07-21
申请号：TW099136672
申请日：2010-10-27
Inventor： 沈文維 , SHEN, WEN WEI , 陳承先 , CHEN, CHEN SHIEN , 郭正錚 , KUO, CHEN CHENG , 陳明發 , CHEN, MING FA , 王榮德 , WANG, RUNG DE
IPC: H01L23/488
CPC classification number: H01L24/16 , H01L23/3157 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/03614 , H01L2224/0401 , H01L2224/05017 , H01L2224/05023 , H01L2224/05124 , H01L2224/05139 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05572 , H01L2224/05647 , H01L2224/05666 , H01L2224/1146 , H01L2224/11823 , H01L2224/11831 , H01L2224/1191 , H01L2224/13005 , H01L2224/13018 , H01L2224/13019 , H01L2224/13076 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13565 , H01L2224/1357 , H01L2224/1369 , H01L2224/16145 , H01L2224/16148 , H01L2224/16238 , H01L2224/81193 , H01L2224/81345 , H01L2224/81801 , H01L2224/81815 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/01322 , H01L2924/05042 , H01L2924/10253 , H01L2924/14 , H01L2924/35 , Y10T428/12361 , Y10T428/12396 , H01L2924/00 , H01L2924/00012 , H01L2924/01047 , H01L2924/206 , H01L2224/05552
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Patent Agency Ranking
公开(公告)号：TWI404183B
公开(公告)日：2013-08-01
申请号：TW099110782
申请日：2010-04-07
Inventor： 沈文維 , SHEN, WENWEI , 陳承先 , CHEN, CHENSHIEN , 郭正錚 , KUO, CHENCHENG , 陳志華 , CHEN, CHIHHUA , 蕭景文 , HSIAO, CHINGWEN
IPC: H01L23/488 , H01L23/52
CPC classification number: H01L24/16 , H01L24/13 , H01L24/81 , H01L2224/13005 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16 , H01L2224/81191 , H01L2224/812 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/10329 , H01L2924/10336 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/381 , H01L2924/00014 , H01L2924/01083 , H01L2224/13099 , H01L2924/00 , H01L2924/206 , H01L2924/207
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5.发明专利半導體裝置及其製造方法 SUBSTRATE INTERCONNECTIONS HAVING DIFFERENT SIZES 审中-公开半导体设备及其制造方法 SUBSTRATE INTERCONNECTIONS HAVING DIFFERENT SIZES
公开(公告)号：TW201143007A
公开(公告)日：2011-12-01
申请号：TW099136436
申请日：2010-10-26
Applicant: 台灣積體電路製造股份有限公司
IPC: H01L
CPC classification number: H01L25/0657 , H01L21/486 , H01L23/3114 , H01L23/3192 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L23/5384 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L25/50 , H01L2224/0345 , H01L2224/03452 , H01L2224/0381 , H01L2224/03831 , H01L2224/0401 , H01L2224/0557 , H01L2224/05572 , H01L2224/05647 , H01L2224/05666 , H01L2224/05681 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/1162 , H01L2224/11622 , H01L2224/1181 , H01L2224/11849 , H01L2224/11903 , H01L2224/13016 , H01L2224/13025 , H01L2224/13084 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13155 , H01L2224/13169 , H01L2224/1354 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/81193 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06568 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15788 , H01L2224/05552 , H01L2924/00
Abstract: 本發明係提供一種用於使一基材與另一基材接合之凸塊結構。一導電柱體形成於第一基材上,以使此導電柱體具有與一第二基材之接觸表面不同的寬度。在一實施例中,第一基材之導電柱體為梯形或具有錐形側壁,因而提供底部部分較頂部部分寬的導電柱體。所述基材皆可為積體電路晶片、轉接板、印刷電路板、高密度內連線或其類似物。
Abstract in simplified Chinese: 本发明系提供一种用于使一基材与另一基材接合之凸块结构。一导电柱体形成于第一基材上,以使此导电柱体具有与一第二基材之接触表面不同的宽度。在一实施例中,第一基材之导电柱体为梯形或具有锥形侧壁,因而提供底部部分较顶部部分宽的导电柱体。所述基材皆可为集成电路芯片、转接板、印刷电路板、高密度内连接或其类似物。
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公开(公告)号：TW201143003A
公开(公告)日：2011-12-01
申请号：TW099136672
申请日：2010-10-27
Applicant: 台灣積體電路製造股份有限公司
IPC: H01L
CPC classification number: H01L24/16 , H01L23/3157 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/03614 , H01L2224/0401 , H01L2224/05017 , H01L2224/05023 , H01L2224/05124 , H01L2224/05139 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05572 , H01L2224/05647 , H01L2224/05666 , H01L2224/1146 , H01L2224/11823 , H01L2224/11831 , H01L2224/1191 , H01L2224/13005 , H01L2224/13018 , H01L2224/13019 , H01L2224/13076 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13565 , H01L2224/1357 , H01L2224/1369 , H01L2224/16145 , H01L2224/16148 , H01L2224/16238 , H01L2224/81193 , H01L2224/81345 , H01L2224/81801 , H01L2224/81815 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/01322 , H01L2924/05042 , H01L2924/10253 , H01L2924/14 , H01L2924/35 , Y10T428/12361 , Y10T428/12396 , H01L2924/00 , H01L2924/00012 , H01L2924/01047 , H01L2924/206 , H01L2224/05552
Abstract: 本發明提供一種微凸塊接合裝置,包括一工件,其包括一金屬凸塊;以及一介電層,其具有位於上述金屬凸塊正上方的一部分。上述金屬凸塊和上述介電層的上述部分的一表面係形成一介面。一金屬表面處理物係形成於上述金屬凸塊的上方且接觸上述金屬凸塊。上述金屬表面處理物係從上述介電層的上方延伸上述介面的下方。
Abstract in simplified Chinese: 本发明提供一种微凸块接合设备,包括一工件,其包括一金属凸块;以及一介电层,其具有位于上述金属凸块正上方的一部分。上述金属凸块和上述介电层的上述部分的一表面系形成一界面。一金属表面处理物系形成于上述金属凸块的上方且接触上述金属凸块。上述金属表面处理物系从上述介电层的上方延伸上述界面的下方。
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7.发明专利電子元件及其製作方法 RECESSED PILLAR STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开电子组件及其制作方法 RECESSED PILLAR STRUCTURE AND MANUFACTURING METHOD THEREOF
公开(公告)号：TW201203483A
公开(公告)日：2012-01-16
申请号：TW100100454
申请日：2011-01-06
Applicant: 台灣積體電路製造股份有限公司
IPC: H01L
CPC classification number: H01L24/13 , H01L23/3114 , H01L23/3192 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/023 , H01L2224/0239 , H01L2224/0345 , H01L2224/03462 , H01L2224/0401 , H01L2224/05008 , H01L2224/05022 , H01L2224/05073 , H01L2224/05083 , H01L2224/05124 , H01L2224/05139 , H01L2224/05147 , H01L2224/05166 , H01L2224/05184 , H01L2224/05582 , H01L2224/05647 , H01L2224/05666 , H01L2224/05681 , H01L2224/10126 , H01L2224/10156 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11474 , H01L2224/11849 , H01L2224/11903 , H01L2224/1308 , H01L2224/13099 , H01L2224/13111 , H01L2224/13116 , H01L2224/13564 , H01L2224/13566 , H01L2224/1357 , H01L2224/13582 , H01L2224/13583 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13669 , H01L2224/13684 , H01L2224/16148 , H01L2224/81193 , H01L2224/81898 , H01L2225/06513 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15788 , H01L2924/01007 , H01L2224/13655 , H01L2224/13664 , H01L2924/00
Abstract: 本發明一實施例提供一種電子元件，包括一第一基板，具有一接點；一凸塊底部金屬結構，電性接觸接點；以及一凹陷的導電柱，位於凸塊底部金屬結構上並電性接觸凸塊底部金屬結構，凹陷的導電柱具有一形成於其中的凹槽，凹槽具有大體上垂直的側壁。
Abstract in simplified Chinese: 本发明一实施例提供一种电子组件，包括一第一基板，具有一接点；一凸块底部金属结构，电性接触接点；以及一凹陷的导电柱，位于凸块底部金属结构上并电性接触凸块底部金属结构，凹陷的导电柱具有一形成于其中的凹槽，凹槽具有大体上垂直的侧壁。
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8.发明专利封裝組合與應用此封裝組合之積體電路裝置 PACKAGING ASSEMBLY AND INTERATED CIRCUIT DEVICE USING THE SAME 审中-公开封装组合与应用此封装组合之集成电路设备 PACKAGING ASSEMBLY AND INTERATED CIRCUIT DEVICE USING THE SAME
公开(公告)号：TW201112369A
公开(公告)日：2011-04-01
申请号：TW099110782
申请日：2010-04-07
Applicant: 台灣積體電路製造股份有限公司
IPC: H01L
CPC classification number: H01L24/16 , H01L24/13 , H01L24/81 , H01L2224/13005 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16 , H01L2224/81191 , H01L2224/812 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/10329 , H01L2924/10336 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/381 , H01L2924/00014 , H01L2924/01083 , H01L2224/13099 , H01L2924/00 , H01L2924/206 , H01L2924/207
Abstract: 一種封裝組合與應用此封裝組合之積體電路裝置。例示性的封裝組合包含第一基材、第二基材以及設置於第一基材與第二基材間的連接結構。每一連接結構包含位於第一基材和第二基材間之內連接柱體以及位於此內連接柱體與第二基材間之焊料,其中內連接柱體具有一寬度和一第一高度。每兩相鄰之連接結構間的距離係以間隙來表示。前述之第一高度係小於此間隙的一半。
Abstract in simplified Chinese: 一种封装组合与应用此封装组合之集成电路设备。例示性的封装组合包含第一基材、第二基材以及设置于第一基材与第二基材间的连接结构。每一连接结构包含位于第一基材和第二基材间之内连接柱体以及位于此内连接柱体与第二基材间之焊料,其中内连接柱体具有一宽度和一第一高度。每两相邻之连接结构间的距离系以间隙来表示。前述之第一高度系小于此间隙的一半。
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