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公开(公告)号:TWI669764B
公开(公告)日:2019-08-21
申请号:TW107126394
申请日:2018-07-30
Inventor: 吳志偉 , WU, CHIH-WEI , 林俊成 , LIN, JING-CHENG , 李隆華 , LEE, LONG-HUA , 盧思維 , LU, SZU-WEI , 施應慶 , SHIH, YING-CHING
IPC: H01L21/60 , H01L23/485
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公开(公告)号:TWI512913B
公开(公告)日:2015-12-11
申请号:TW102136460
申请日:2013-10-09
Inventor: 蔡宗甫 , TSAI, TSUNG FU , 林育漳 , LIN, YU CHANG , 施應慶 , SHIH, YING CHING , 吳韋民 , WU, WEI MIN , 郭彥良 , KUO, YIAN LIANG , 杜家瑋 , TU, CHIA WEI
CPC classification number: H01L21/563 , H01L23/13 , H01L23/3128 , H01L23/3135 , H01L23/49827 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05009 , H01L2224/0557 , H01L2224/06181 , H01L2224/13025 , H01L2224/131 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16235 , H01L2224/26145 , H01L2224/26175 , H01L2224/27013 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/81 , H01L2224/83 , H01L2924/014 , H01L2224/05552
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公开(公告)号:TWI437679B
公开(公告)日:2014-05-11
申请号:TW099136436
申请日:2010-10-26
Inventor: 沈文維 , SHEN, WEN WEI , 施應慶 , SHIH, YING CHING , 陳承先 , CHEN, CHEN SHIEN , 陳明發 , CHEN, MING FA
IPC: H01L23/52 , H01L21/768
CPC classification number: H01L25/0657 , H01L21/486 , H01L23/3114 , H01L23/3192 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L23/5384 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L25/50 , H01L2224/0345 , H01L2224/03452 , H01L2224/0381 , H01L2224/03831 , H01L2224/0401 , H01L2224/0557 , H01L2224/05572 , H01L2224/05647 , H01L2224/05666 , H01L2224/05681 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/1162 , H01L2224/11622 , H01L2224/1181 , H01L2224/11849 , H01L2224/11903 , H01L2224/13016 , H01L2224/13025 , H01L2224/13084 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13155 , H01L2224/13169 , H01L2224/1354 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/81193 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06568 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15788 , H01L2224/05552 , H01L2924/00
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公开(公告)号:TW202018899A
公开(公告)日:2020-05-16
申请号:TW108102516
申请日:2019-01-23
Inventor: 余振華 , YU, CHEN-HUA , 吳志偉 , WU, CHIH-WEI , 盧思維 , LU, SZU-WEI , 施應慶 , SHIH, YING-CHING
IPC: H01L23/538 , H01L23/31
Abstract: 一種積體電路封裝體及其形成方法。一種方法包括:將多個積體電路晶粒堆疊於晶圓上以形成晶粒堆疊。對所述晶粒堆疊執行接合製程。所述接合製程將所述晶粒堆疊的多個相鄰的積體電路晶粒機械性及電性連接至彼此。在所述晶圓之上形成擋壩結構。所述擋壩結構環繞所述晶粒堆疊。在所述晶圓之上且在所述晶粒堆疊與所述擋壩結構之間形成第一包封體。所述第一包封體填充所述晶粒堆疊的所述多個相鄰的積體電路晶粒之間的多個間隙。在所述晶圓之上形成第二包封體。所述第二包封體環繞所述晶粒堆疊、所述第一包封體及所述擋壩結構。
Abstract in simplified Chinese: 一种集成电路封装体及其形成方法。一种方法包括:将多个集成电路晶粒堆栈于晶圆上以形成晶粒堆栈。对所述晶粒堆栈运行接合制程。所述接合制程将所述晶粒堆栈的多个相邻的集成电路晶粒机械性及电性连接至彼此。在所述晶圆之上形成挡坝结构。所述挡坝结构环绕所述晶粒堆栈。在所述晶圆之上且在所述晶粒堆栈与所述挡坝结构之间形成第一包封体。所述第一包封体填充所述晶粒堆栈的所述多个相邻的集成电路晶粒之间的多个间隙。在所述晶圆之上形成第二包封体。所述第二包封体环绕所述晶粒堆栈、所述第一包封体及所述挡坝结构。
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公开(公告)号:TW201834086A
公开(公告)日:2018-09-16
申请号:TW106135867
申请日:2017-10-19
Inventor: 余振華 , YU, CHEN-HUA , 胡憲斌 , HU, HSIEN-PIN , 林俊成 , LIN, CHUN-CHENG , 盧思維 , LU, SZU-WEI , 侯上勇 , HOU, SHANG-YUN , 魏文信 , WEI, WEN-HSIN , 施應慶 , SHIH, YING-CHING , 吳集錫 , WU, CHI-HSI
IPC: H01L21/56 , H01L25/065
Abstract: 實施例是一種方法,所述方法包括:使用第一電性連接件將第一晶粒貼合至第一組件的第一側;使用第二電性連接件將第二晶粒的第一側貼合至所述第一組件的所述第一側;將虛擬晶粒在所述第一組件的切割道區中貼合至所述第一組件的所述第一側;將蓋體結構黏著至所述第二晶粒的第二側;以及將所述第一組件及所述虛擬晶粒單體化,以形成封裝結構。
Abstract in simplified Chinese: 实施例是一种方法,所述方法包括:使用第一电性连接件将第一晶粒贴合至第一组件的第一侧;使用第二电性连接件将第二晶粒的第一侧贴合至所述第一组件的所述第一侧;将虚拟晶粒在所述第一组件的切割道区中贴合至所述第一组件的所述第一侧;将盖体结构黏着至所述第二晶粒的第二侧;以及将所述第一组件及所述虚拟晶粒单体化,以形成封装结构。
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公开(公告)号:TWI511240B
公开(公告)日:2015-12-01
申请号:TW103115921
申请日:2014-05-05
Inventor: 王卜 , WANG, PU , 施應慶 , SHIH, YING CHING , 盧思維 , LU, SZU WEI , 林俊成 , LIN, JING CHENG
CPC classification number: H01L24/05 , H01L21/56 , H01L21/76801 , H01L21/76805 , H01L21/76895 , H01L23/3114 , H01L23/3171 , H01L23/3192 , H01L23/5226 , H01L23/525 , H01L23/528 , H01L23/53223 , H01L23/53238 , H01L23/53252 , H01L24/03 , H01L24/13 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/96 , H01L2224/0345 , H01L2224/0346 , H01L2224/0401 , H01L2224/04105 , H01L2224/05124 , H01L2224/05548 , H01L2224/05567 , H01L2224/05647 , H01L2224/05666 , H01L2224/08113 , H01L2224/08235 , H01L2224/11334 , H01L2224/1134 , H01L2224/12105 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/16235 , H01L2224/2405 , H01L2224/24137 , H01L2224/821 , H01L2224/96 , H01L2924/0002 , H01L2924/00 , H01L2924/00014 , H01L2224/82 , H01L2224/03 , H01L2224/11 , H01L2924/014
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公开(公告)号:TWI413233B
公开(公告)日:2013-10-21
申请号:TW099144709
申请日:2010-12-20
Inventor: 吳文進 , WU, WENG JIN , 施應慶 , SHIH, YING CHING , 邱文智 , CHIOU, WEN CHIH , 鄭心圃 , JENG, SHIN PUU , 余振華 , YU, CHEN HUA
IPC: H01L25/065 , H01L23/488 , H01L21/60
CPC classification number: H01L21/768 , H01L21/56 , H01L21/563 , H01L21/6835 , H01L23/147 , H01L23/293 , H01L23/3107 , H01L23/3128 , H01L23/3157 , H01L23/481 , H01L23/5384 , H01L24/11 , H01L24/14 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L2224/0401 , H01L2224/06181 , H01L2224/13022 , H01L2224/13025 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13184 , H01L2224/1403 , H01L2224/14181 , H01L2224/16147 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16237 , H01L2224/73204 , H01L2224/81005 , H01L2224/81192 , H01L2224/81801 , H01L2224/81895 , H01L2224/83102 , H01L2224/92125 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/14 , H01L2924/15321 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2224/81805
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公开(公告)号:TWI697090B
公开(公告)日:2020-06-21
申请号:TW108102516
申请日:2019-01-23
Inventor: 余振華 , YU, CHEN-HUA , 吳志偉 , WU, CHIH-WEI , 盧思維 , LU, SZU-WEI , 施應慶 , SHIH, YING-CHING
IPC: H01L23/538 , H01L23/31
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公开(公告)号:TWI688074B
公开(公告)日:2020-03-11
申请号:TW107125992
申请日:2018-07-27
Inventor: 鄒賢儒 , TSOU, HSIEN-JU , 吳志偉 , WU, CHIH-WEI , 林俊成 , LIN, JING-CHENG , 王卜 , WANG, PU , 盧思維 , LU, SZU-WEI , 施應慶 , SHIH, YING-CHING
IPC: H01L23/538 , H01L23/31
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公开(公告)号:TWI536537B
公开(公告)日:2016-06-01
申请号:TW103128046
申请日:2014-08-15
Inventor: 吳志偉 , WU, CHIH WEI , 施應慶 , SHIH, YING CHING , 盧思維 , LU, SZU WEI , 林俊成 , LIN, JING CHENG
CPC classification number: H01L23/562 , H01L23/145 , H01L23/147 , H01L23/3171 , H01L23/3192 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/10135 , H01L2224/11464 , H01L2224/13012 , H01L2224/13017 , H01L2224/13022 , H01L2224/13025 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/13562 , H01L2224/13582 , H01L2224/13644 , H01L2224/13664 , H01L2224/1403 , H01L2224/14181 , H01L2224/16146 , H01L2224/16235 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81007 , H01L2224/81139 , H01L2224/81203 , H01L2224/81815 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06555 , H01L2225/06572 , H01L2225/06582 , H01L2924/10253 , H01L2924/10271 , H01L2924/1305 , H01L2924/13091 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/1437 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/3511 , H01L2924/3512 , H01L2924/37001 , H01L2924/014 , H01L2924/00012
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