Patent search ap:("台灣積體電路製造股份有限公司" OR "TAIWAN SEMICONDUCTOR MANUFACTURING CO. Page LTD.") AND inv:"黃文濬"

1.

发明专利
製造半導體封裝體的方法有权
Simplified title: 制造半导体封装体的方法

公开(公告)号：TWI563614B

公开(公告)日：2016-12-21

申请号：TW103145294

申请日：2014-12-24

Applicant: 台灣積體電路製造股份有限公司 , TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： 黃文濬 , HUANG, WENCHUN , 李建成 , LI, CHIENCHEN , 劉國洲 , LIU, KUOCHIO , 薛瑞雲 , SHIUE, RUEYYUN , 鄭錫圭 , CHENG, HSIKUEI , 林志賢 , LIN, CHIHHSIEN , 林俊成 , LIN, JINGCHENG , 陸湘台 , LU, HSIANGTAI , 謝子逸 , SHIEH, TZIYI

IPC: H01L23/28 , H01L21/56

CPC classification number: H01L21/565 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L23/145 , H01L23/147 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/3135 , H01L23/36 , H01L23/49816 , H01L23/49827 , H01L23/5329 , H01L23/5384 , H01L23/60 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/0345 , H01L2224/03452 , H01L2224/0401 , H01L2224/0557 , H01L2224/05573 , H01L2224/05583 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/06181 , H01L2224/11002 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81192 , H01L2224/81815 , H01L2224/81895 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/10252 , H01L2924/10253 , H01L2924/10254 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/10333 , H01L2924/10335 , H01L2924/10342 , H01L2924/12042 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2224/11 , H01L2224/03 , H01L2924/00012

2.

发明专利
製造半導體封裝體的方法审中-公开
Simplified title: 制造半导体封装体的方法

公开(公告)号：TW201608653A

公开(公告)日：2016-03-01

申请号：TW104114915

申请日：2015-05-11

Applicant: 台灣積體電路製造股份有限公司 , TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： 黃文濬 , HUANG, WENCHUN , 李建成 , LI, CHIENCHEN , 劉國洲 , LIU, KUOCHIO , 薛瑞雲 , SHIUE, RUEYYUN , 鄭錫圭 , CHENG, HSIKUEI , 林志賢 , LIN, CHIHHSIEN , 林俊成 , LIN, JINGCHENG , 陸湘台 , LU, HSIANGTAI , 謝子逸 , SHIEH, TZIYI

IPC: H01L21/56 , H01L23/28

CPC classification number: H01L21/565 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L23/145 , H01L23/147 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/3135 , H01L23/36 , H01L23/49816 , H01L23/49827 , H01L23/5329 , H01L23/5384 , H01L23/60 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/0345 , H01L2224/03452 , H01L2224/0401 , H01L2224/0557 , H01L2224/05573 , H01L2224/05583 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/06181 , H01L2224/11002 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81192 , H01L2224/81815 , H01L2224/81895 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/10252 , H01L2924/10253 , H01L2924/10254 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/10333 , H01L2924/10335 , H01L2924/10342 , H01L2924/12042 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2224/11 , H01L2224/03 , H01L2924/00012

Abstract: 本揭露的實施例包含半導體封裝體及其製造方法。一實施例為方法，包含安裝一晶粒至一基板的頂表面，以形成一元件，密封晶粒及基板的頂表面於一模塑化合物內，此模塑化合物於晶粒上具有一第一厚度，以及移除模塑化合物於晶粒上的厚度的一部分，而非全部。此方法更包含對元件進行進一步的處理，以及移除模塑化合物於晶粒上的剩餘厚度。

Abstract in simplified Chinese: 本揭露的实施例包含半导体封装体及其制造方法。一实施例为方法，包含安装一晶粒至一基板的顶表面，以形成一组件，密封晶粒及基板的顶表面于一模塑化合物内，此模塑化合物于晶粒上具有一第一厚度，以及移除模塑化合物于晶粒上的厚度的一部分，而非全部。此方法更包含对组件进行进一步的处理，以及移除模塑化合物于晶粒上的剩余厚度。

3.

发明专利
製造半導體封裝體的方法审中-公开
Simplified title: 制造半导体封装体的方法

公开(公告)号：TW201533861A

公开(公告)日：2015-09-01

申请号：TW103145294

申请日：2014-12-24

Applicant: 台灣積體電路製造股份有限公司 , TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： 黃文濬 , HUANG, WENCHUN , 李建成 , LI, CHIENCHEN , 劉國洲 , LIU, KUOCHIO , 薛瑞雲 , SHIUE, RUEYYUN , 鄭錫圭 , CHENG, HSIKUEI , 林志賢 , LIN, CHIHHSIEN , 林俊成 , LIN, JINGCHENG , 陸湘台 , LU, HSIANGTAI , 謝子逸 , SHIEH, TZIYI

IPC: H01L23/28 , H01L21/56

CPC classification number: H01L21/565 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L23/145 , H01L23/147 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/3135 , H01L23/36 , H01L23/49816 , H01L23/49827 , H01L23/5329 , H01L23/5384 , H01L23/60 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/0345 , H01L2224/03452 , H01L2224/0401 , H01L2224/0557 , H01L2224/05573 , H01L2224/05583 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/06181 , H01L2224/11002 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81192 , H01L2224/81815 , H01L2224/81895 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/10252 , H01L2924/10253 , H01L2924/10254 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/10333 , H01L2924/10335 , H01L2924/10342 , H01L2924/12042 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2224/11 , H01L2224/03 , H01L2924/00012

Abstract: 本揭露的實施例包含半導體封裝體及其製造方法。一實施例為方法，包含安裝一晶粒至一基板的頂表面，以形成一元件，密封晶粒及基板的頂表面於一模塑化合物內，此模塑化合物於晶粒上具有一第一厚度，以及移除模塑化合物於晶粒上的厚度的一部分，而非全部。此方法更包含對元件進行進一步的處理，以及移除模塑化合物於晶粒上的剩餘厚度。

Abstract in simplified Chinese: 本揭露的实施例包含半导体封装体及其制造方法。一实施例为方法，包含安装一晶粒至一基板的顶表面，以形成一组件，密封晶粒及基板的顶表面于一模塑化合物内，此模塑化合物于晶粒上具有一第一厚度，以及移除模塑化合物于晶粒上的厚度的一部分，而非全部。此方法更包含对组件进行进一步的处理，以及移除模塑化合物于晶粒上的剩余厚度。

Patent Agency Ranking