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22 条记录 (耗时 0.015 秒)

    Electron gun with resistor and capacitor
    4.
    发明授权
    Electron gun with resistor and capacitor 失效
    电子枪带电阻和电容

    公开(公告)号：US06690123B1

    公开(公告)日：2004-02-10

    申请号：US09561540

    申请日：2000-04-28

    申请人： George Herbert Needham Riddle ,  Roger Casanova Alig ,  Aly Fathy ,  Attiganal Narayanaswamy Sreeram ,  Barry Jay Thaler ,  Michael James Liberatore

    发明人： George Herbert Needham Riddle ,  Roger Casanova Alig ,  Aly Fathy ,  Attiganal Narayanaswamy Sreeram ,  Barry Jay Thaler ,  Michael James Liberatore

    IPC分类号： G09G104

    CPC分类号： H01J3/02 ,  H01J29/48 ,  H01J2229/4834

    摘要： An electron gun as for a cathode ray tube includes a plurality of electrodes biased at different potentials to electrostatically shape and focus the one or more electron beams produced thereby. A dynamic focus grid is driven by a substantial ac voltage signal at the horizontal line rate, which signal is undesirably coupled through parasitic capacitance to an intermediate grid located between the dynamic focus grid and the gun anode. A resistive biasing network includes a high value resistance to divide the anode potential to develop bias potential for the intermediate grid and a capacitance to ac couple the intermediate grid to ground potential. The resistance is formed in a single layer ceramic circuit and the capacitance is formed on the single layer ceramic circuit or on the tube neck. The ceramic circuit may be located in the tube neck on or with the electron gun.

    摘要翻译： 阴极射线管的电子枪包括以不同电位偏置的多个电极，以静电形成和聚焦由此产生的一个或多个电子束。 动态聚焦网格由水平线速率的基本交流电压信号驱动，该信号不期望地通过寄生电容耦合到位于动态聚焦栅格和枪阳极之间的中间栅格。 电阻偏置网络包括高电阻值以分割阳极电位以产生用于中间电网的偏置电位，以及将中间电网耦合到地电位的电容。 电阻形成在单层陶瓷电路中，电容形成在单层陶瓷电路上或管颈上。 陶瓷电路可以位于电子枪上或与电子枪的管颈中。

    Method of forming metal contact pads on a metal support substrate
    7.
    发明授权
    Method of forming metal contact pads on a metal support substrate 有权
    在金属支撑基板上形成金属接触垫的方法

    公开(公告)号：US06471805B1

    公开(公告)日：2002-10-29

    申请号：US09434058

    申请日：1999-11-04

    申请人： Barry Jay Thaler ,  Ashok Narayan Prabhu

    发明人： Barry Jay Thaler ,  Ashok Narayan Prabhu

    IPC分类号： C03B2900

    CPC分类号： H05K1/053 ,  Y10T29/49126 ,  Y10T29/49155

    摘要： A method of forming low resistance contact pads on a metal support substrate for a multilayer ceramic printed circuit board comprising forming a patterned layer of a conductive metal on the metal support substrate made of the same metal as that used to form the circuitry on the ceramic circuit board, and firing the support substrate. The patterned conductive metal can be formed by electroplating, by screen printing from a fritless conductor ink or by screen printing from a glass frit-containing conductor ink that includes a reducing agent.

    摘要翻译： 一种在用于多层陶瓷印刷电路板的金属支撑基板上形成低电阻接触焊盘的方法，包括在由用于在陶瓷电路上形成电路的相同金属制成的金属支撑基板上形成导电金属的图案化层 板，并且烧制支撑衬底。 图案化导电金属可以通过电镀，通过丝网印刷从无熔丝导体油墨或通过丝网印刷从含有还原剂的含玻璃料的导体油墨形成。

    Electronic circuit chip package
    10.
    发明授权
    Electronic circuit chip package 失效
    电子电路芯片封装

    公开(公告)号：US5847935A

    公开(公告)日：1998-12-08

    申请号：US768062

    申请日：1996-12-16

    申请人： Barry Jay Thaler ,  Ashok Narayan Prabhu ,  Ananda Hosakere Kumar ,  Bernard Dov Geller

    发明人： Barry Jay Thaler ,  Ashok Narayan Prabhu ,  Ananda Hosakere Kumar ,  Bernard Dov Geller

    IPC分类号： H01L23/049 ,  H01L25/065 ,  H05K1/14

    CPC分类号： H01L23/049 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/854 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195

    摘要： A package for an electronic component includes a metal base plate and a body of an insulating material, such as glass or ceramic, on and bonded to a surface of the base plate. The body is formed of a plurality of layers of the insulating material stacked and bonded to each other and has at least one opening extending therethrough to the base plate. Strips of a conductive material, such as a metal, are on the surface of various layers of the body. An electronic component is mounted in the opening in the body and has terminals which are electrically connected to the conductive strips on the body, preferably by wires. Vias of a conductive material may extend through some of the layers of the body to connect the conductive strips to terminals on the surface of the body. A cover plate of an insulating material may extend over the body and the opening therein to enclose the electronic component in the body.

    摘要翻译： 用于电子部件的封装包括金属基板和诸如玻璃或陶瓷之类的绝缘材料体，并且粘合到基板的表面上。 主体由层叠并彼此结合的多个绝缘材料层形成，并且具有至少一个贯穿其延伸到基板的开口。 诸如金属的导电材料的条纹在身体各层的表面上。 电子部件安装在主体的开口中，并且具有优选地通过电线电连接到主体上的导电条的端子。 导电材料的通孔可以延伸穿过主体的一些层，以将导电条连接到主体表面上的端子。 绝缘材料的盖板可以在主体和其上的开口中延伸以将电子部件封闭在主体中。