公开(公告)号：US08715836B2

公开(公告)日：2014-05-06

申请号：US12282231

申请日：2007-03-09

申请人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Junshi Yoshioka ,  Jo Nishikawa ,  Takeo Taguchi

发明人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Junshi Yoshioka ,  Jo Nishikawa ,  Takeo Taguchi

IPC分类号： H01L27/108 ,  H01L29/76 ,  H01L29/94

CPC分类号： H05K3/384 ,  C25D1/04 ,  C25D3/38 ,  C25D5/16 ,  C25D5/18 ,  C25D5/48 ,  C25D7/06 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1476 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/12993 ,  Y10T428/24355 ,  Y10T428/24917

摘要： It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 μm to 0.7 μm, the maximum peak to valley height (PV) to be 0.05 to 1.5 μm, and the surface roughness (Rzjis) to be 0.1 μm to 1.0 μm. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density.

摘要翻译： 本发明的目的是提供一种表面处理的电沉积铜箔，其具有等于或优于传统上被供应到市场的低轮廓表面处理的电沉积铜箔的等级或优异的水平， 其中影响布线直线性能的波纹小，及其制造方法。 为了实现这个目的，在表面处理的电解铜箔中，与绝缘层构成材料接合的接合面的最大波纹高度（Wmax）为0.05μm〜0.7μm，最大峰值 谷值（PV）为0.05〜1.5μm，表面粗糙度（Rzjis）为0.1μm〜1.0μm。 用于制造该表面处理的电解铜箔的电沉积铜箔通过使用通过加入3-巯基-1-丙磺酸或双（3-磺丙基）二硫化物得到的硫酸基铜电解液制备 ，具有环状结构的季铵盐聚合物和氯，并且在电解条件下使用具有小表面粗糙度的阴极，在连续的第一步电解下进行两步或更多不同电流水平的n步电解 密度。

公开(公告)号：US06183880B2

公开(公告)日：2001-02-06

申请号：US09131160

申请日：1998-08-07

申请人： Junshi Yoshioka ,  Shinichi Obata ,  Makoto Dobashi ,  Takashi Kataoka

发明人： Junshi Yoshioka ,  Shinichi Obata ,  Makoto Dobashi ,  Takashi Kataoka

IPC分类号： B21C3702

CPC分类号： H05K3/025 ,  C25D1/04 ,  C25D5/10 ,  Y10S428/901 ,  Y10S428/926 ,  Y10S428/935 ,  Y10T156/11 ,  Y10T428/12438 ,  Y10T428/12479 ,  Y10T428/12646 ,  Y10T428/12715 ,  Y10T428/1275 ,  Y10T428/12792 ,  Y10T428/12847 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/31678

摘要： This invention provides a composite foil comprising an aluminum carrier layer and an ultra-thin copper foil having a protective layer disposed between them comprising a porous copper layer and an interpenetrating zinc layer. A process for producing such composite foils comprises the steps of preparing the surface of the aluminum carrier, electrodepositing a porous copper layer on the aluminum carrier layer followed by electrodepositing a zinc layer, and then electrodepositing two layers of copper to form the ultra-thin copper foil. The composite foil provides a uniform bond strength between the aluminum carrier and the protective layer which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.

摘要翻译： 本发明提供了一种复合箔，其包括铝载体层和超薄铜箔，其具有设置在其间的保护层，包括多孔铜层和互穿锌层。 制造这种复合箔的方法包括以下步骤：制备铝载体的表面，在铝载体层上电沉积多孔铜层，然后电沉积锌层，然后电沉积两层铜以形成超薄铜 挫败。 复合箔在铝载体和保护层之间提供均匀的粘合强度，其足以防止载体和超薄铜箔在处理和层压期间分离，但是明显低于铜/基材的剥离强度 使得能够在将复合箔层压到绝缘基板上之后容易地去除载体。 本发明还包括由这种复合箔制成的层压板和由这种层压板制成的印刷线路板。

公开(公告)号：US06610418B1

公开(公告)日：2003-08-26

申请号：US10031279

申请日：2001-11-07

申请人： Junshi Yoshioka ,  Akiko Sugimoto ,  Makoto Dobashi ,  Ken-ichiro Iwakiri ,  Yutaka Hirasawa

发明人： Junshi Yoshioka ,  Akiko Sugimoto ,  Makoto Dobashi ,  Ken-ichiro Iwakiri ,  Yutaka Hirasawa

IPC分类号： B32B1508

CPC分类号： H05K3/025 ,  C25D1/04 ,  C25D1/22 ,  Y10S428/935 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/254 ,  Y10T428/31678

摘要： The present invention provides electrodeposited copper foil with carrier which has an organic adhesive interface layer permitting control of the lower limit of peel strength between a carrier foil and an electrodeposited copper foil and to a method for producing the electrodeposited copper foil with carrier. In the electrodeposited copper foil with carrier including a carrier foil, an adhesive interface layer formed on the carrier foil, and an electrodeposited copper foil formed on the adhesive interface layer, the carrier foil is formed of a copper foil and the adhesive interface layer contains an organic agent and metallic particles, the organic agent and the metallic particles being in an intermingled state.

摘要翻译： 本发明提供具有载体的电沉积铜箔，其具有允许控制载体箔和电解铜箔之间的剥离强度的下限的有机粘合界面层以及用载体制造电沉积铜箔的方法。 在具有载体箔的载体的电沉积铜箔中，形成在载体箔上的粘合界面层和形成在粘合界面层上的电沉积铜箔，载体箔由铜箔形成，粘合界面层包含 有机试剂和金属颗粒，有机试剂和金属颗粒处于混合状态。

公开(公告)号：US08419920B2

公开(公告)日：2013-04-16

申请号：US12444020

申请日：2007-10-02

申请人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

发明人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

IPC分类号： C25D3/38

CPC分类号： C25D3/38

摘要： An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.

摘要翻译： 本发明的目的是提供一种制备用于形成电沉积铜膜的硫酸基铜电解液的方法，该方法包括当刚制备后使用溶液形成时制备的平滑度和光泽度优异的表面，并且被制备 通过使用单硫化物。 为了实现该目的，制备硫酸基铜电解液以含有磺化活性硫化合物，推荐用于形成光滑电沉积铜膜的双（3-磺丙基）二硫化物。 通过氧化反应在3-巯基-1-丙磺酸的水溶液中将3-巯基-1-丙磺酸转化成双（3-磺丙基）二硫化物，得到所含的双（3-磺丙基）二硫化物 。 在氧化反应中，优选使用空气鼓泡法来防止3-巯基-1-丙磺酸的氧化分解。

公开(公告)号：US07217464B2

公开(公告)日：2007-05-15

申请号：US10483612

申请日：2003-05-12

申请人： Akitoshi Takanashi ,  Kenichiro Iwakiri ,  Akiko Sugimoto ,  Junshi Yoshioka ,  Shinichi Obata ,  Makoto Dobashi

发明人： Akitoshi Takanashi ,  Kenichiro Iwakiri ,  Akiko Sugimoto ,  Junshi Yoshioka ,  Shinichi Obata ,  Makoto Dobashi

IPC分类号： B32B15/04 ,  B32B15/20 ,  B05D1/18 ,  B05D3/10 ,  C23G1/02

CPC分类号： B32B15/08 ,  C25D1/04 ,  C25D7/0614 ,  H05K3/025 ,  Y10T428/12438 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/31678

摘要： The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200°C. For this purpose are adopted “a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which an organic adhesive interface layer is formed on a surface of carrier foil by use of an organic agent, and an electrodeposited copper foil layer is formed on the organic adhesive interface layer, characterized in that the formation of the organic adhesive interface layer on the surface of the carrier foil is performed by acid pickling the surface of the carrier foil by use of an acid pickling solution containing 50 ppm to 2000 ppm of organic agent used in the formation of the adhesive interface layer and by simultaneously causing the organic agent to be adsorbed whereby an acid pickled and adsorbed organic film is formed” and others.

摘要翻译： 本发明提供一种制造具有用于高温耐热性的载体箔的电沉积铜箔的方法，其中即使在不低于200℃的温度下进行压制加工，载体箔的剥离也容易。 为此，采用“使用有机试剂在载体箔的表面上形成有机粘合界面层的电解铜箔的高温耐热性的电解铜箔的制造方法和电沉积铜 在有机粘合剂界面层上形成箔层，其特征在于，通过使用含有50ppm的酸洗液对载体箔的表面酸洗，在载体箔的表面上形成有机粘合界面层 到2000ppm的用于形成粘合界面层的有机试剂，同时使有机试剂吸附，由此形成酸洗和吸附的有机膜“等。

公开(公告)号：US06984453B2

公开(公告)日：2006-01-10

申请号：US10467670

申请日：2002-12-12

申请人： Akiko Sugimoto ,  Junshi Yoshioka ,  Makoto Dobashi

发明人： Akiko Sugimoto ,  Junshi Yoshioka ,  Makoto Dobashi

IPC分类号： B32B15/04 ,  C25D3/38

CPC分类号： C25D1/04 ,  B32B7/06 ,  B32B15/08 ,  B32B15/20 ,  H05K3/025 ,  Y10S428/926 ,  Y10S428/935 ,  Y10S428/938 ,  Y10T428/12903 ,  Y10T428/265 ,  Y10T428/31678

摘要： An object is the provision of a peelable electrodeposited copper foil with carrier foil that stabilizes the peel strength between the carrier foil and the electrodeposited copper foil layer even when used in manufacture of the printed wiring boards that requires pressing at the temperatures of 200° C. or higher. For the purpose of achieving the object, the electrodeposited copper foil with carrier foil 1, which includes an adhesive interface layer 4 arranged on one face of the carrier foil 2 and an electrodeposited copper foil layer 3 arranged on the adhesive interface layer 4, characterized in that the adhesive interface layer 4 is composed of a metal oxide layer ML and an organic material layer OL, and the like are used.

摘要翻译： 目的是提供具有载体箔的可剥离的电沉积铜箔，其即使在需要在200℃的温度下压制的印刷线路板的制造中也能稳定载体箔和电沉积铜箔层之间的剥离强度。 或更高。 为了实现该目的，具有载体箔1的电沉积铜箔包括布置在载体箔2的一个表面上的粘合界面层4和布置在粘合界面层4上的电沉积铜箔层3，其特征在于 粘合界面层4由金属氧化物层ML和有机材料层OL构成。

公开(公告)号：US6071629A

公开(公告)日：2000-06-06

申请号：US785688

申请日：1997-01-17

申请人： Toshiko Yokota ,  Makoto Dobashi ,  Hiroshi Hata ,  Hisao Sakai ,  Susumu Takahashi ,  Junshi Yoshioka

发明人： Toshiko Yokota ,  Makoto Dobashi ,  Hiroshi Hata ,  Hisao Sakai ,  Susumu Takahashi ,  Junshi Yoshioka

IPC分类号： C25D5/48 ,  C23C22/83 ,  C23F11/00 ,  C23F11/14 ,  C23F17/00 ,  C25D7/06 ,  H05K3/02 ,  H05K3/28 ,  H05K3/38 ,  B21D39/00 ,  C03C27/02 ,  C23C27/82

CPC分类号： C23F11/149 ,  C23C22/83 ,  H05K3/282 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0591 ,  H05K3/022 ,  Y10T428/12535 ,  Y10T428/12542 ,  Y10T428/12549 ,  Y10T428/12556 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/12903

摘要： An organic rust-roof treated copper foil characterized in that it has a metallic rust-proof layer formed on the non-adhesive side of the original copper foil and has an organic rust-proof layer formed on said metallic rust-proof layer, the organic rust-proof layer comprising a mixture of at least two kinds of chemicals selected from the group consisting of benzotriazole, its derivatives, aminotriazole and its isomers and derivatives is provided with on said metallic rust-proof layer, or it further has a chromate-treated layer formed between said metallic rust-proof layer and said organic rust-proof layer.

摘要翻译： 一种有机防锈屋顶处理铜箔，其特征在于，其具有形成在原始铜箔的非粘合侧上的金属防锈层，并且在所述金属防锈层上形成有机防锈层，有机 在所述金属防锈层上设置包含选自苯并三唑，其衍生物，氨基三唑及其异构体和衍生物的至少两种化学物质的混合物的防锈层，或者还具有铬酸盐处理 在所述金属防锈层和所述有机防锈层之间形成的层。

公开(公告)号：US20100089758A1

公开(公告)日：2010-04-15

申请号：US12444020

申请日：2007-10-02

申请人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

发明人： Sakiko Tomonaga ,  Makoto Dobashi ,  Junshi Yoshioka ,  Ayumu Tateoka ,  Mitsuyoshi Matsuda ,  Hisao Sakai

IPC分类号： C25D3/38 ,  C25D7/00

CPC分类号： C25D3/38

摘要： An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.

摘要翻译： 本发明的目的是提供一种制备用于形成电沉积铜膜的硫酸基铜电解液的方法，该方法包括当刚制备后使用溶液形成时制备的平滑度和光泽度优异的表面，并且被制备 通过使用单硫化物。 为了实现该目的，制备硫酸基铜电解液以含有磺化活性硫化合物，推荐用于形成光滑电沉积铜膜的双（3-磺丙基）二硫化物。 通过氧化反应在3-巯基-1-丙磺酸的水溶液中将3-巯基-1-丙磺酸转化成双（3-磺丙基）二硫化物，得到所含的双（3-磺丙基）二硫化物 。 在氧化反应中，优选使用空气鼓泡法来防止3-巯基-1-丙磺酸的氧化分解。

公开(公告)号：US06541126B1

公开(公告)日：2003-04-01

申请号：US09830122

申请日：2001-04-23

申请人： Junshi Yoshioka ,  Akiko Sugimoto ,  Sakiko Taenaka ,  Makoto Dobashi ,  Tsutomu Higuchi ,  Takuya Yamamoto ,  Ken-ichiro Iwakiri

发明人： Junshi Yoshioka ,  Akiko Sugimoto ,  Sakiko Taenaka ,  Makoto Dobashi ,  Tsutomu Higuchi ,  Takuya Yamamoto ,  Ken-ichiro Iwakiri

IPC分类号： B32B1504

CPC分类号： H05K3/025 ,  C25D1/04 ,  C25D1/22 ,  Y10T428/12556 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/24851 ,  Y10T428/2495 ,  Y10T428/31678

摘要： To provide an electrodeposited copper foil with carrier, in which electrical connection holes such as through holes (PTH), interstitial via holes (IVH), and blind via holes (BVH) can be readily formed. The invention provides an electrodeposited copper foil with carrier comprising a carrier foil, an organic release interface layer formed on a surface of the carrier foil, and an electrodeposited copper foil layer deposited on the release interface layer, wherein copper microparticles are deposited on the surface of the carrier foil onto which the organic release interface layer and the electrodeposited copper layer are formed.

摘要翻译： 为了提供具有载体的电沉积铜箔，其中可以容易地形成诸如通孔（PTH），间隙通孔（IVH）和盲孔（BVH）的电连接孔。 本发明提供了一种电沉积铜箔，其载体包括载体箔，形成在载体箔表面上的有机释放界面层和沉积在释放界面层上的电沉积铜箔层，其中铜微粒沉积在 其上形成有机释放界面层和电沉积铜层的载体箔。

公开(公告)号：US20090166213A1

公开(公告)日：2009-07-02

申请号：US12089671

申请日：2006-10-31

申请人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Ayumu Tateoka ,  Hiroshi Hata ,  Satoshi Mogi ,  Takeo Taguchi ,  Junshi Yoshioka

发明人： Makoto Dobashi ,  Mitsuyoshi Matsuda ,  Sakiko Tomonaga ,  Hisao Sakai ,  Tomohiro Sakata ,  Ayumu Tateoka ,  Hiroshi Hata ,  Satoshi Mogi ,  Takeo Taguchi ,  Junshi Yoshioka

IPC分类号： C25D3/38 ,  B32B15/04

CPC分类号： C25D3/38 ,  C25D1/04 ,  H05K1/09

摘要： An object of the present invention is to provide a production method which enables efficient production of an electro-deposited copper foil with further lower profile when compared to the low-profile electro-deposited copper foils which have been supplied to the market and is excellent in mechanical strength. For the purpose of achieving the object, a production method adopted obtains the electro-deposited copper foil by electrolyzing a sulfuric acid based copper electrolytic solution which contains a quaternary ammonium salt polymer having cyclic structure and chlorine, wherein for the quaternary ammonium salt polymer contained in the sulfuric acid based copper electrolytic solution, a DDAC dimer or higher polymer is used. For the quaternary ammonium salt polymer, a diallyl dimethyl ammonium chloride polymer having a number average molecular weight of 300 to 10000 is preferably used. The sulfuric acid based copper electrolytic solution preferably contains bis(3-sulfopropyl) disulfide or 3-mercapto-1-propanesulfonic acid that is a compound having a mercapto group.

摘要翻译： 本发明的一个目的是提供一种制造方法，该方法能够与已经供应到市场上的薄型电镀铜箔相比具有更低的轮廓的电解铜箔的有效生产 机械强度。 为了实现该目的，所采用的制造方法是通过电解含有具有环状结构和氯的季铵盐聚合物的硫酸系铜电解液得到电解铜箔，其中，对于 使用硫酸类铜电解液，DDAC二聚体或更高级聚合物。 对于季铵盐聚合物，优选使用数均分子量为300〜10000的二烯丙基二甲基氯化铵聚合物。 硫酸系铜电解液优选含有作为具有巯基的化合物的双（3-磺丙基）二硫化物或3-巯基-1-丙磺酸。