公开(公告)号：US20110006862A1

公开(公告)日：2011-01-13

申请号：US12920125

申请日：2009-03-05

Applicant: Kousuke Yasooka

Inventor： Kousuke Yasooka

IPC: H01P7/06

CPC classification number: H01L23/66 ,  H01L23/055 ,  H01L23/12 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01P1/162 ,  H01P3/02 ,  H01P5/08 ,  H05K1/16 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A multilayer dielectric substrate includes a first cavity-resonance suppressing circuit that suppresses cavity resonance of a first signal wave and a second cavity-resonance suppressing circuit that suppresses cavity resonance of a second signal wave, a frequency thereof being different from that of the first signal wave. These cavity-resonance suppressing circuits respectively include openings formed in a surface-layer ground conductor, an impedance transformer with a length of an odd multiple of about ¼ of in-substrate effective wavelength of a signal wave, a tip-short-circuited dielectric transmission line with a length of an odd multiple of about ¼, of in-substrate effective wavelength of a signal wave, a coupling aperture formed in an inner-layer ground conductor, and a resistor formed in the coupling aperture. The multilayer dielectric substrate that suppresses cavity resonance of signal waves of a plurality of frequencies.

Abstract translation: 多层电介质基板包括抑制第一信号波的空腔共振的第一空腔共振抑制电路和抑制第二信号波的空腔谐振的第二空腔共振抑制电路，其频率与第一信号的频率不同 波。 这些空腔谐振抑制电路分别包括形成在表层接地导体中的开口，信号波的衬底内有效波长的大约1/4的奇数倍的阻抗变换器，尖端短路介电传输 线的长度为信号波的衬底内有效波长约1/4的奇数倍，形成在内层接地导体中的耦合孔和形成在耦合孔中的​​电阻。 抑制多个频率的信号波的空腔谐振的多层电介质基板。

公开(公告)号：US08130513B2

公开(公告)日：2012-03-06

申请号：US12519861

申请日：2008-02-26

Applicant: Kousuke Yasooka

Inventor： Kousuke Yasooka

IPC: H05K1/11

CPC classification number: H01L23/043 ,  H01L23/49822 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01P1/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A radio-frequency package includes a radio-frequency device, a multilayer dielectric substrate, and an electromagnetic shield member. The multilayer dielectric substrate includes an internal conductor pad, a first signal via-hole connected to the internal conductor pad, an external conductor pad, a second signal via-hole connected to the external conductor pad, and an inner-layer signal line that connects between the first signal via-hole and the second signal via-hole. The internal conductor pad includes a leading-end open line having a length of substantially a quarter of a wavelength of a radio-frequency signal used in the radio-frequency device.

Abstract translation: 射频封装包括射频器件，多层电介质基片和电磁屏蔽元件。 所述多层介质基板包括内部导体焊盘，连接到所述内部导体焊盘的第一信号通孔，外部导体焊盘，连接到所述外部导体焊盘的第二信号通孔以及连接到所述外部导体焊盘的内层信号线 在第一信号通孔和第二信号通孔之间。 内部导体焊盘包括前端开口线，其具有在射频设备中使用的射频信号的波长的基本上四分之一的长度。

公开(公告)号：US07795729B2

公开(公告)日：2010-09-14

申请号：US11911770

申请日：2007-02-15

Applicant: Kousuke Yasooka

Inventor： Kousuke Yasooka

IPC: H01L23/10 ,  H01L23/34

CPC classification number: H04B1/38 ,  H01L23/10 ,  H01L23/552 ,  H01L23/66 ,  H01L25/165 ,  H01L2924/0002 ,  H01L2924/1423 ,  H01L2924/16195 ,  H01P1/208 ,  H01P1/30 ,  H01L2924/00

Abstract: A transceiver device includes a dielectric substrate, a ring member that is welded onto the dielectric substrate thereby forming a plurality of cavities, a cover that is welded onto the ring member, and at least one semiconductor device that is arranged in each of the cavities. The ring member has at least one passage that communicates between adjacent cavities. The passage is provided at a position shifted by substantially λg/4 or substantially n×λg/2+λg/4 from a center axis of the cavities. If there are two or more passages, the passages are arranged at a λg/2 interval, and one of the passages closest to the center axis is at a position shifted by substantially λg/4 from the center axis.

Abstract translation: 收发器装置包括介电基片，焊接在电介质基片上的环形构件，从而形成多个空腔，焊接在环形构件上的盖子和布置在每个空腔中的至少一个半导体装置。 环构件具有至少一个在相邻空腔之间连通的通道。 该通道设置在从空腔的中心轴线大致为λg/ 4或基本上为n×λg/ 2 +λg/ 4的位置。 如果有两个或更多个通道，则通道以λg/ 2间隔布置，最靠近中心轴的通道中的一个处于从中心轴线偏移大致λg/ 4的位置。

公开(公告)号：US06615047B1

公开(公告)日：2003-09-02

申请号：US09288013

申请日：1999-04-08

Applicant: Kousuke Yasooka ,  Yoshiyuki Chatani ,  Nobuyuki Shibata

Inventor： Kousuke Yasooka ,  Yoshiyuki Chatani ,  Nobuyuki Shibata

IPC: H04Q720

CPC classification number: H04W16/12 ,  H04W4/08 ,  H04W16/02 ,  H04W16/24 ,  H04W28/16 ,  H04W76/10

Abstract: A cell group is formed from three cells, each of which has a site equipped with antennas. The antennas differ from one another in terms of horizontal orientation and cover all horizontal directions. The cell groups are arranged in a repeating pattern such that a cell having a site assigned different frequency is interposed between cell groups assigned the same frequency, thereby constituting a minimum unit area to be repeated.

Abstract translation: 一个单元组由三个单元形成，每个单元具有配备有天线的位置。 天线在水平方向上彼此不同，并覆盖所有水平方向。 单元组以重复图案排列，使得具有不同频率的位置的单元被插入指定相同频率的单元组之间，从而构成要重复的最小单位面积。

公开(公告)号：US08222976B2

公开(公告)日：2012-07-17

申请号：US12920125

申请日：2009-03-05

Applicant: Kousuke Yasooka

Inventor： Kousuke Yasooka

IPC: H01L29/00

CPC classification number: H01L23/66 ,  H01L23/055 ,  H01L23/12 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01P1/162 ,  H01P3/02 ,  H01P5/08 ,  H05K1/16 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A multilayer dielectric substrate includes a first cavity-resonance suppressing circuit that suppresses cavity resonance of a first signal wave and a second cavity-resonance suppressing circuit that suppresses cavity resonance of a second signal wave, a frequency thereof being different from that of the first signal wave. These cavity-resonance suppressing circuits respectively include openings formed in a surface-layer ground conductor, an impedance transformer with a length of an odd multiple of about ¼ of in-substrate effective wavelength of a signal wave, a tip-short-circuited dielectric transmission line with a length of an odd multiple of about ¼, of in-substrate effective wavelength of a signal wave, a coupling aperture formed in an inner-layer ground conductor, and a resistor formed in the coupling aperture. The multilayer dielectric substrate that suppresses cavity resonance of signal waves of a plurality of frequencies.

Abstract translation: 多层电介质基板包括抑制第一信号波的空腔共振的第一空腔共振抑制电路和抑制第二信号波的空腔谐振的第二空腔共振抑制电路，其频率与第一信号的频率不同 波。 这些空腔谐振抑制电路分别包括形成在表层接地导体中的开口，信号波的衬底内有效波长的大约1/4的奇数倍的阻抗变换器，尖端短路介电传输 线的长度为信号波的衬底内有效波长约1/4的奇数倍，形成在内层接地导体中的耦合孔和形成在耦合孔中的​​电阻。 抑制多个频率的信号波的空腔谐振的多层电介质基板。

公开(公告)号：US08040286B2

公开(公告)日：2011-10-18

申请号：US12158088

申请日：2007-02-01

Applicant: Koichi Matsuo ,  Kazuyoshi Inami ,  Mamoru Yoshida ,  Takeshi Sueda ,  Shigeo Udagawa ,  Susumu Sato ,  Tsutomu Tamaki ,  Takuya Suzuki ,  Kousuke Yasooka ,  Minoru Hashimoto

Inventor： Koichi Matsuo ,  Kazuyoshi Inami ,  Mamoru Yoshida ,  Takeshi Sueda ,  Shigeo Udagawa ,  Susumu Sato ,  Tsutomu Tamaki ,  Takuya Suzuki ,  Kousuke Yasooka ,  Minoru Hashimoto

IPC: H01Q13/10

CPC classification number: H01P1/2135 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01P5/02 ,  H01P5/1007 ,  H01Q21/0068 ,  H01Q21/0087 ,  H01Q21/064 ,  H01L2924/00014

Abstract: A high-frequency module has an antenna configured by integrally connecting a slot plate laid out with radiation slots to a plate having plural thin plates formed with a waveguide for supplying power to the slot plate, using a diffusion bonding. The waveguide of the antenna is connected to a dielectric waveguide of a high-frequency package via a waveguide provided on a resin substrate, thereby configuring a slot antenna at low cost, and connecting a power-supply slot of the slot antenna to a waveguide terminal of the high-frequency package with low loss.

Abstract translation: 高频模块具有通过使用扩散接合将布置有辐射狭缝的槽板一体地连接到具有形成有多个形成有用于向槽板供电的波导的薄板的板的天线。 天线的波导通过设置在树脂基板上的波导与高频封装的介质波导连接，从而以低成本配置缝隙天线，并将缝隙天线的电源槽连接到波导端子 的高频封装具有低损耗。

公开(公告)号：US20100046184A1

公开(公告)日：2010-02-25

申请号：US12519861

申请日：2008-02-26

Applicant: Kousuke Yasooka

Inventor： Kousuke Yasooka

IPC: H05K7/02

CPC classification number: H01L23/043 ,  H01L23/49822 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01P1/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A radio-frequency package includes a radio-frequency device, a multilayer dielectric substrate, and an electromagnetic shield member. The multilayer dielectric substrate includes an internal conductor pad, a first signal via-hole connected to the internal conductor pad, an external conductor pad, a second signal via-hole connected to the external conductor pad, and an inner-layer signal line that connects between the first signal via-hole and the second signal via-hole. The internal conductor pad includes a leading-end open line having a length of substantially a quarter of a wavelength of a radio-frequency signal used in the radio-frequency device.

Abstract translation: 射频封装包括射频器件，多层电介质基片和电磁屏蔽元件。 所述多层介质基板包括内部导体焊盘，连接到所述内部导体焊盘的第一信号通孔，外部导体焊盘，连接到所述外部导体焊盘的第二信号通孔以及连接到所述外部导体焊盘的内层信号线 在第一信号通孔和第二信号通孔之间。 内部导体焊盘包括前端开口线，其具有在射频设备中使用的射频信号的波长的基本上四分之一的长度。

公开(公告)号：US20090079648A1

公开(公告)日：2009-03-26

申请号：US12158088

申请日：2007-02-01

Applicant: Koichi Matsuo ,  Kazuyoshi Inami ,  Mamoru Yoshida ,  Takeshi Sueda ,  Shigeo Udagawa ,  Susumu Sato ,  Tsutomu Tamaki ,  Takuya Suzuki ,  Kousuke Yasooka ,  Minoru Hashimoto

Inventor： Koichi Matsuo ,  Kazuyoshi Inami ,  Mamoru Yoshida ,  Takeshi Sueda ,  Shigeo Udagawa ,  Susumu Sato ,  Tsutomu Tamaki ,  Takuya Suzuki ,  Kousuke Yasooka ,  Minoru Hashimoto

IPC: H01Q13/10

CPC classification number: H01P1/2135 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01P5/02 ,  H01P5/1007 ,  H01Q21/0068 ,  H01Q21/0087 ,  H01Q21/064 ,  H01L2924/00014

Abstract: To provide a high-frequency module having an antenna configured by integrally connecting a slot plate laid out with radiation slots to a plate having plural thin plates formed with a waveguide for supplying power to the slot plate, using a diffusion bonding. The waveguide of the antenna is connected to a dielectric waveguide of a high-frequency package via a waveguide provided on a resin substrate, thereby configuring a slot antenna at low cost, and connecting a power-supply slot of the slot antenna to a waveguide terminal of the high-frequency package with low loss.

Abstract translation: 为了提供一种高频模块，其具有通过使用扩散接合将通过将布置有辐射狭缝的槽板整体连接到具有多个形成有用于向槽板供电的波导的薄板的板构成的天线。 天线的波导通过设置在树脂基板上的波导与高频封装的介质波导连接，从而以低成本配置缝隙天线，并将缝隙天线的电源槽连接到波导端子 的高频封装具有低损耗。

公开(公告)号：US20080150129A1

公开(公告)日：2008-06-26

申请号：US11911770

申请日：2007-02-15

Applicant: Kousuke Yasooka

Inventor： Kousuke Yasooka

IPC: H01L23/10 ,  H01L23/58

CPC classification number: H04B1/38 ,  H01L23/10 ,  H01L23/552 ,  H01L23/66 ,  H01L25/165 ,  H01L2924/0002 ,  H01L2924/1423 ,  H01L2924/16195 ,  H01P1/208 ,  H01P1/30 ,  H01L2924/00

Abstract: A transceiver device includes a dielectric substrate, a ring member that is welded onto the dielectric substrate thereby forming a plurality of cavities, a cover that is welded onto the ring member, and at least one semiconductor device that is arranged in each of the cavities. The ring member has at least one passage that communicates between adjacent cavities. The passage is provided at a position shifted by substantially λg/4 or substantially nxλg/2+λg/4 from a center axis of the cavities. If there are two or more passages, the passages are arranged at a λg/2 interval, and one of the passages closest to the center axis is at a position shifted by substantially λg/4 from the center axis.

Abstract translation: 收发器装置包括介电基片，焊接在电介质基片上的环形构件，从而形成多个空腔，焊接在环形构件上的盖子和布置在每个空腔中的至少一个半导体装置。 环构件具有至少一个在相邻空腔之间连通的通道。 该通道设置在从空腔的中心轴线移位的基本上是兰伯格/ 4或基本上n×lambdag / 2 + lambdag / 4的位置处。 如果有两个或更多个通道，则通道以兰布/ 2间隔布置，并且最靠近中心轴线的通道中的一个位于从中心轴线偏移大体上的兰布达/ 4的位置。