公开(公告)号：US20120196075A1

公开(公告)日：2012-08-02

申请号：US13502002

申请日：2010-10-14

申请人： Toyosei Takahashi ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Hirohisa Dejima ,  Fumihiro Shiraishi ,  Toshihiro Sato

发明人： Toyosei Takahashi ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Hirohisa Dejima ,  Fumihiro Shiraishi ,  Toshihiro Sato

IPC分类号： B32B3/02 ,  C09J163/00

CPC分类号： H01L23/3114 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/15311 ,  Y10T428/21 ,  H01L2924/00

摘要： A resin composition of the present invention is used for providing a spacer 104 having a grid-like shape at a planar view thereof between a semiconductor wafer 101′ and a transparent substrate 102. The resin composition includes a constituent material containing an alkali soluble resin, a thermosetting resin and a photo initiator. In the case where a semiconductor wafer 101′ and a transparent substrate 102 are bonded together through a spacer 104 formed on a substantially overall surface thereof to obtain a bonded body 2000, and then the semiconductor wafer makes one-fifth thickness, a warpage of the bonded body 2000 is 3,000 μm or less. Further, it is preferred that the warpage of the bonded body 2000 before the process thereof is 500 μm or less, and an increasing ratio of the warpage of the bonded body 2000 after the process thereof is 600% or less.

摘要翻译： 本发明的树脂组合物用于在半导体晶片101'和透明基板102之间的平面视图中提供具有格子状的间隔物104.树脂组合物包括含有碱溶性树脂的构成材料， 热固性树脂和光引发剂。 在半导体晶片101'和透明基板102通过形成在其基本上整个表面上的间隔件104结合在一起以获得粘合体2000的情况下，然后半导体晶片形成五分之一厚度， 粘结体2000为3000μm以下。 此外，优选在其加工前的粘合体2000的翘曲为500μm以下，并且其加工后的粘合体2000的翘曲比例增加为600％以下。

公开(公告)号：US08034651B2

公开(公告)日：2011-10-11

申请号：US12668341

申请日：2008-02-19

申请人： Toyosei Takahashi ,  Rie Takayama ,  Mitsuo Sugino ,  Masakazu Kawata

发明人： Toyosei Takahashi ,  Rie Takayama ,  Mitsuo Sugino ,  Masakazu Kawata

IPC分类号： H01L21/00 ,  H01L21/02

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/10253 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light receiving device 1 includes a support substrate 12 provided thereon with a photodetector 11 including a photodetecting portion 111 and a base substrate 112 on which the photodetecting portion 111 is placed; and a transparent substrate 13 disposed so as to oppose the face of the support substrate 12 on which the photodetector 11 is provided. Between the support substrate 12 and the transparent substrate 13, a frame portion 14 is provided so as to surround the photodetector 11. The frame portion 14 is a photo-curing adhesive, and directly adhered to the transparent substrate 13 and the support substrate 12. Such structure provides a light receiving device capable of exhibiting the desired performance, and a method of manufacturing such light receiving device can also be provided.

摘要翻译： 光接收装置1包括设置有光电检测器11的支撑基板12，该光检测器11包括受光部分111和放置有光电检测部分111的基板112; 以及设置成与设置有光电检测器11的支撑基板12的表面相对的透明基板13。 在支撑基板12和透明基板13之间设置有围绕光电检测器11的框架部分14.框架部分14是光固化粘合剂，并且直接粘附到透明基板13和支撑基板12上。 这种结构提供能够表现出期望性能的光接收装置，并且还可以提供制造这种光接收装置的方法。

公开(公告)号：US07768089B2

公开(公告)日：2010-08-03

申请号：US12213485

申请日：2008-06-19

申请人： Takashi Hirano ,  Toyosei Takahashi ,  Toshihiro Sato ,  Masakazu Kawata

发明人： Takashi Hirano ,  Toyosei Takahashi ,  Toshihiro Sato ,  Masakazu Kawata

IPC分类号： G09B1/00

CPC分类号： H01L27/14618 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A semiconductor device comprises a semiconductor substrate comprised of an interposer having one surface and a semiconductor element provided on the one surface of the interposer, the semiconductor element including a light receiving portion for receiving light thereon; a transparent substrate having light-transmitting property and one surface facing the light receiving portion, the transparent substrate arranged in a spaced-apart relationship with the one surface of the interposer through a gap formed between the one surface of the interposer and the one surface of the transparent substrate; and a spacer formed in a shape of a frame, the spacer positioned between the one surface of the interposer and the one surface of the transparent substrate for regulating the gap, and the spacer having an inner surface and an outer surface, wherein the one surface of the interposer, the one surface of the transparent substrate and the inner surface of the spacer form a space which is hermetically sealed, and wherein the spacer has a wall including at least one thin wall portion and a thick wall portion other than the at least one thin wall portion, and a vapor permeability of the at least one thin wall portion is greater than a vapor permeability of the thick wall portion, wherein a vapor allowed to flow into the space through the wall of the spacer from an outside preferentially permeates from the space to the outside through the thin wall portion.

摘要翻译： 半导体器件包括由具有一个表面的插入件和设置在插入件的一个表面上的半导体元件组成的半导体衬底，该半导体元件包括用于在其上接收光的光接收部分; 具有透光性的透明基板和面对光接收部分的一个表面，透明基板通过形成在插入件的一个表面之间的间隙与插入件的一个表面间隔开地布置， 透明基板; 以及形成为框架形状的间隔件，所述间隔件位于所述插入件的所述一个表面和所述透明基板的用于调节所述间隙的一个表面之间，并且所述间隔件具有内表面和外表面，其中所述一个表面 所述透明基板的一个表面和所述间隔件的内表面形成密封的空间，并且其中所述间隔件具有壁，所述壁包括至少一个薄壁部分和至少一个以上的厚壁部分 一个薄壁部分和至少一个薄壁部分的蒸汽渗透性大于厚壁部分的蒸汽渗透性，其中允许从外部通过间隔物的壁流入空间的蒸气优先渗透从 通过薄壁部分到外部的空间。

公开(公告)号：US20090294887A1

公开(公告)日：2009-12-03

申请号：US12213485

申请日：2008-06-19

申请人： Takashi Hirano ,  Toyosei Takahashi ,  Toshihiro Sato ,  Masakazu Kawata

发明人： Takashi Hirano ,  Toyosei Takahashi ,  Toshihiro Sato ,  Masakazu Kawata

IPC分类号： H01L31/0203

CPC分类号： H01L27/14618 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A semiconductor device comprises a semiconductor substrate comprised of an interposer having one surface and a semiconductor element provided on the one surface of the interposer, the semiconductor element including a light receiving portion for receiving light thereon; a transparent substrate having light-transmitting property and one surface facing the light receiving portion, the transparent substrate arranged in a spaced-apart relationship with the one surface of the interposer through a gap formed between the one surface of the interposer and the one surface of the transparent substrate; and a spacer formed in a shape of a frame, the spacer positioned between the one surface of the interposer and the one surface of the transparent substrate for regulating the gap, and the spacer having an inner surface and an outer surface, wherein the one surface of the interposer, the one surface of the transparent substrate and the inner surface of the spacer form a space which is hermetically sealed, and wherein the spacer has a wall including at least one thin wall portion and a thick wall portion other than the at least one thin wall portion, and a vapor permeability of the at least one thin wall portion is greater than a vapor permeability of the thick wall portion, wherein a vapor allowed to flow into the space through the wall of the spacer from an outside preferentially permeates from the space to the outside through the thin wall portion. The semiconductor device is capable of reliably preventing dust from infiltrating into the semiconductor device and capable of reliably preventing occurrence of dew condensation in an inner wall of the semiconductor device, particularly on an inner surface of a transparent substrate.

摘要翻译： 半导体器件包括由具有一个表面的插入件和设置在插入件的一个表面上的半导体元件组成的半导体衬底，该半导体元件包括用于在其上接收光的光接收部分; 具有透光性的透明基板和面对光接收部分的一个表面，透明基板通过形成在插入件的一个表面之间的间隙与插入件的一个表面间隔开地布置， 透明基板; 以及形成为框架形状的间隔件，所述间隔件位于所述插入件的所述一个表面和所述透明基板的用于调节所述间隙的一个表面之间，并且所述间隔件具有内表面和外表面，其中所述一个表面 所述透明基板的一个表面和所述间隔件的内表面形成密封的空间，并且其中所述间隔件具有壁，所述壁包括至少一个薄壁部分和至少一个以上的厚壁部分 一个薄壁部分和至少一个薄壁部分的蒸汽渗透性大于厚壁部分的蒸汽渗透性，其中允许从外部通过间隔物的壁流入空间的蒸气优先渗透从 通过薄壁部分到外部的空间。 半导体装置能够可靠地防止灰尘渗透到半导体装置中，能够可靠地防止在半导体装置的内壁，特别是在透明基板的内表面上发生结露。

公开(公告)号：US20120228782A1

公开(公告)日：2012-09-13

申请号：US13510744

申请日：2010-11-19

申请人： Masakazu Kawata ,  Etsu Takeuchi ,  Junya Kusunoki ,  Hiromichi Sugiyama

发明人： Masakazu Kawata ,  Etsu Takeuchi ,  Junya Kusunoki ,  Hiromichi Sugiyama

IPC分类号： H01L21/56 ,  H01L23/28

CPC分类号： H01L25/105 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a method for manufacturing an electronic device, the method including: placing an electronic component on a substrate 11; forming standing portions 13 on the surface of the substrate 11 on which the electronic component 10 is placed, the standing portions 13 comprising a thermally decomposable resin; applying an encapsulating material 14 so as to encapsulate the electronic component 10 and cover around the standing portions 13 while exposing a portion of each of the standing portions 13 from the surface of the encapsulating material 14; heating the standing portions 13 to decompose and remove the standing portions 13, thereby forming holes 141 through the encapsulating material 14; and placing a conductive material 15 in the holes 141.

摘要翻译： 公开了一种电子设备的制造方法，该方法包括：将电子部件放置在基板11上; 在其上放置电子部件10的基板11的表面上形成立起部13，立起部13包括可热分解树脂; 施加封装材料14以便将电子部件10封装并且围绕立起部13覆盖，同时使每个竖直部分13的一部分暴露于封装材料14的表面; 加热立起部分13以分解和取出竖立部分13，从而通过封装材料14形成孔141; 并将导电材料15放置在孔141中。

公开(公告)号：US20120187553A1

公开(公告)日：2012-07-26

申请号：US13394993

申请日：2010-09-08

申请人： Masahiro Yoneyama ,  Masakazu Kawata ,  Toyosei Takahashi ,  Hirohisa Dejima ,  Fumihiro Shiraishi ,  Toshihiro Sato

发明人： Masahiro Yoneyama ,  Masakazu Kawata ,  Toyosei Takahashi ,  Hirohisa Dejima ,  Fumihiro Shiraishi ,  Toshihiro Sato

IPC分类号： H01L23/04 ,  H01L21/50

CPC分类号： H01L23/16 ,  H01L23/3114 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor wafer bonding product according to the present invention includes: a step of preparing a spacer formation film including a support base having a sheet-like shape and a spacer formation layer provided on the support base and having photosensitivity; a step of attaching the spacer formation layer to a semiconductor wafer having one surface from a side of the one surface; a step of forming a spacer by subjecting the spacer formation layer to exposure and development to be patterned and removing the support base; and a step of bonding a transparent substrate to a region of the spacer where the removed support base was provided so that transparent substrate is included within the region. This makes it possible to manufacture a semiconductor wafer bonding product in which the semiconductor wafer and the transparent substrate are bonded together through the spacer uniformly and reliably.

摘要翻译： 根据本发明的制造半导体晶片接合产品的方法包括：制备包括具有片状形状的支撑基底和设置在支撑基底上并具有光敏性的间隔物形成层的间隔物形成膜的步骤; 将间隔物形成层从一个表面的一侧附着到具有一个表面的半导体晶片的步骤; 通过对间隔物形成层进行曝光和显影以图案化并去除支撑基底来形成间隔物的步骤; 以及将透明基板粘合到设置有去除的支撑基底的间隔件的区域，使得在该区域内包含透明基板的步骤。 这使得可以制造半导体晶片接合产品，其中半导体晶片和透明基板通过间隔件均匀可靠地结合在一起。

公开(公告)号：US20120032284A1

公开(公告)日：2012-02-09

申请号：US13262127

申请日：2010-03-25

申请人： Hirohisa Dejima ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Fumihiro Shiraishi ,  Toshihiro Sato

发明人： Hirohisa Dejima ,  Masakazu Kawata ,  Masahiro Yoneyama ,  Toyosei Takahashi ,  Fumihiro Shiraishi ,  Toshihiro Sato

IPC分类号： H01L29/84 ,  C09J167/06 ,  H01L21/00 ,  H01L31/0203 ,  H01L31/18 ,  C09J161/10 ,  C09J177/00

CPC分类号： C09J163/10 ,  C08L79/08 ,  H01L31/0203

摘要： According to one aspect of the present invention, a film for a resin spacer (10) comprises an adhesive layer (12) made of a resin composition and a cover film (14) covering a surface of the adhesive layer (12). In the above-described film for a resin spacer (10), an adhesion force C1 between the adhesive layer (12) and the cover film (14) and an adhesion force D between the adhesive layer (12) and a silicone resin are set so as to satisfy the condition C1>D. Consequently, it is possible to reduce resin adherence to a cutting table at the time of cutting the film for a resin spacer (10).

摘要翻译： 根据本发明的一个方面，用于树脂间隔物（10）的膜包括由树脂组合物制成的粘合剂层（12）和覆盖粘合剂层（12）的表面的覆盖膜（14）。 在上述用于树脂间隔件（10）的膜中，设置粘合剂层（12）和覆盖膜（14）之间的粘附力C1和粘合剂层（12）和硅树脂之间的粘附力D 以满足条件C1> D。 因此，在切割用于树脂间隔物（10）的膜时，可以减少对切割台的树脂粘附性。

公开(公告)号：US20110263095A1

公开(公告)日：2011-10-27

申请号：US13126934

申请日：2010-06-15

申请人： Etsu Takeuchi ,  Junya Kusunoki ,  Hiromichi Sugiyama ,  Toshiharu Kuboyama ,  Masakazu Kawata

发明人： Etsu Takeuchi ,  Junya Kusunoki ,  Hiromichi Sugiyama ,  Toshiharu Kuboyama ,  Masakazu Kawata

IPC分类号： H01L21/762 ,  C09J155/00

CPC分类号： C09J169/00 ,  C08L2203/206 ,  C09J123/24 ,  C09J145/00 ,  H01L21/6836 ,  H01L2221/68327

摘要： To provide a temporary bonding adhesive for a semiconductor wafer that can reduce damage to the semiconductor wafer, is easily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using the same.A temporary bonding adhesive for a semiconductor device is provided, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition such that the difference between the 95% weight loss temperature and the 5% weight loss temperature is 1 degree Celsius≦(95% weight loss temperature)−(5% weight loss temperature)≦300 degrees Celsius.

摘要翻译： 为了提供能够减少对半导体晶片的损伤的半导体晶片的临时粘合剂，易于拆卸，并且可以缩短热分解所需的时间，以及使用其的半导体器件的制造方法。 提供了一种用于半导体器件的临时粘合粘合剂，其是用于将半导体晶片临时接合到支撑衬底上以便处理半导体晶片的临时粘结粘合剂，并且用于通过加工后的加热从支撑衬底分离半导体晶片， 含有95重量％失重温度和5重量％失重温度之间的差异为1摄氏度/℃（95重量％失重温度） - （5重量％失重温度）＆amp; NlE; 300摄氏度的树脂组合物。

公开(公告)号：US08268540B2

公开(公告)日：2012-09-18

申请号：US11886262

申请日：2007-05-30

申请人： Toyosei Takahashi ,  Junya Kusunoki ,  Kazuto Oonami ,  Mitsuo Sugino ,  Masakazu Kawata ,  Rie Takayama ,  Seiji Oohashi

发明人： Toyosei Takahashi ,  Junya Kusunoki ,  Kazuto Oonami ,  Mitsuo Sugino ,  Masakazu Kawata ,  Rie Takayama ,  Seiji Oohashi

IPC分类号： G03F7/20

CPC分类号： H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2924/16235 ,  H01L2924/00014

摘要： A method of manufacturing a light receiving device 1 includes: providing a resin layer 14 containing a photo curing resin on a transparent substrate 13 where a plurality of transparent substrate portions 13A are integrated so that the resin layer covers the transparent substrate 13; selectively irradiating the resin layer 14 with light, followed by a developing process, so that the resin layer 14 remains in regions of the transparent substrate 13 which surround portions corresponding to regions facing light receiving portions 11 in the transparent substrate portions 13A; dividing the transparent substrate 13 into units of transparent substrate portions 13A so that a plurality of transparent substrate portions 13A are obtained; dividing the base substrate 12 into units of base substrate portions 12A so that a plurality of base substrate portions 12A are obtained; and joining the base substrate portions 12A and the transparent substrate portions 13A via the resin layer 14.

摘要翻译： 制造光接收装置1的方法包括：在透明基板13上设置含有光固化树脂的树脂层14，其中多个透明基板部分13A被一体化，使得树脂层覆盖透明基板13; 选择性地照射树脂层14，然后进行显影处理，使得树脂层14保留在透明基板13的围绕部分对应于透明基板部分13A中的光接收部分11的区域的区域中; 将透明基板13分割为透明基板部13A的单位，得到多个透明基板部13A; 将基底基板12分割为基底部分12A的单元，从而获得多个基底部分12A; 并且经由树脂层14与基板部分12A和透明基板部分13A接合。

公开(公告)号：US6039896A

公开(公告)日：2000-03-21

申请号：US268312

申请日：1999-03-16

申请人： Tetsuya Miyamoto ,  Masakazu Kawata

发明人： Tetsuya Miyamoto ,  Masakazu Kawata

IPC分类号： C09J9/02 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H05K3/32 ,  H01B1/06

CPC分类号： C09J9/02 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0239

摘要： An anisotropic conductive adhesive contains conductive particles dispersed in a resin composition, wherein the resin composition includes a radical polymerization resin (A), an organic peroxide (B), a thermoplastic elastomer (C) and a phosphoric ester (D). The resin composition can further contain an epoxy silane coupling agent (E) represented by formula (2) or (3). The resin composition is mixed with other components after the radical polymerization resin (A), the thermoplastic elastomer (C), the phosphoric ester (D) and the epoxy silane coupling agent (E) are reacted. It is also possible to preliminarily react only the phosphoric ester (D) and the epoxy silane coupling agent (E) and to react the product of the preliminary reaction with the radical polymerization resin (A) and the thermoplastic elastomer (C), and then to add other components. The anisotropic conductive adhesive of the present invention can be used for electrical joining of electronic or electric parts of electrical apparatus.

摘要翻译： 各向异性导电粘合剂包含分散在树脂组合物中的导电颗粒，其中树脂组合物包括自由基聚合树脂（A），有机过氧化物（B），热塑性弹性体（C）和磷酸酯（D）。 树脂组合物还可以含有式（2）或（3）表示的环氧硅烷偶联剂（E）。 在自由基聚合树脂（A），热塑性弹性体（C），磷酸酯（D）和环氧硅烷偶联剂（E）反应后，将树脂组合物与其它组分混合。 也可以预先仅使磷酸酯（D）和环氧硅烷偶联剂（E）反应，并使预反应产物与自由基聚合树脂（A）和热塑性弹性体（C）反应，然后 添加其他组件。 本发明的各向异性导电粘合剂可用于电气设备的电子部件或电气部件的电连接。