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    METHOD OF FORMING A METAL PATTERN AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE INCLUDING THE METAL PATTERN
    3.
    发明申请
    METHOD OF FORMING A METAL PATTERN AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE INCLUDING THE METAL PATTERN 有权
    形成金属图案的方法和制造包括金属图案的显示基板的方法

    公开(公告)号：US20120318769A1

    公开(公告)日：2012-12-20

    申请号：US13406388

    申请日：2012-02-27

    申请人： Jong-Hyun Choung ,  Ji-Young Park ,  Seon-Il Kim ,  Sang-Gab Kim ,  In-Bae Kim ,  Jae-Woo Jeong

    发明人： Jong-Hyun Choung ,  Ji-Young Park ,  Seon-Il Kim ,  Sang-Gab Kim ,  In-Bae Kim ,  Jae-Woo Jeong

    IPC分类号： C23F1/00 ,  H01B13/00

    CPC分类号： C23F1/18 ,  H01L21/32134 ,  H01L27/124 ,  H01L27/1288 ,  H01L29/458 ,  H01L29/66765

    摘要： A method of forming a metal pattern on a display substrate includes blanket depositing a copper-based layer having a thickness between about 1,500 Å and about 5,500 Å on a base substrate, and forming a patterned photoresist layer on the copper-based layer. The copper-based layer is over-etched by an etching composition containing an oxidizing moderating agent where the over-etch factor is between about 40% and about 200% while using the patterned photoresist layer as an etch stopping layer, and where the etching composition includes ammonium persulfate between about 0.1% by weight and about 50% by weight, includes an azole-based compound between about 0.01% by weight and about 5% by weight and a remainder of water. Thus, reliability of the metal pattern and that of manufacturing a display substrate may be improved.

    摘要翻译： 在显示基板上形成金属图案的方法包括：在基底基板上铺设厚度在约至约为500埃之间的铜基层，并在铜基层上形成图案化的光致抗蚀剂层。 通过含有氧化调节剂的蚀刻组合物对铜基层进行过蚀刻，其中过蚀刻因子在约40％至约200％之间，同时使用图案化的光致抗蚀剂层作为蚀刻停止层，并且其中蚀刻组合物 包括约0.1重量％至约50重量％的过硫酸铵，包括约0.01重量％至约5重量％的唑类化合物和剩余的水。 因此，可以提高金属图案的可靠性和制造显示基板的可靠性。

    Method of forming a metal pattern and method of manufacturing a display substrate including the metal pattern
    8.
    发明授权
    Method of forming a metal pattern and method of manufacturing a display substrate including the metal pattern 有权
    形成金属图案的方法和制造包括金属图案的显示基板的方法

    公开(公告)号：US08765614B2

    公开(公告)日：2014-07-01

    申请号：US13406388

    申请日：2012-02-27

    申请人： Jong-Hyun Choung ,  Ji-Young Park ,  Seon-Il Kim ,  Sang-Gab Kim ,  In-Bae Kim ,  Jae-Woo Jeong

    发明人： Jong-Hyun Choung ,  Ji-Young Park ,  Seon-Il Kim ,  Sang-Gab Kim ,  In-Bae Kim ,  Jae-Woo Jeong

    IPC分类号： H01L21/302

    CPC分类号： C23F1/18 ,  H01L21/32134 ,  H01L27/124 ,  H01L27/1288 ,  H01L29/458 ,  H01L29/66765

    摘要： A method of forming a metal pattern on a display substrate includes blanket depositing a copper-based layer having a thickness between about 1,500 Å and about 5,500 Å on a base substrate, and forming a patterned photoresist layer on the copper-based layer. The copper-based layer is over-etched by an etching composition containing an oxidizing moderating agent where the over-etch factor is between about 40% and about 200% while using the patterned photoresist layer as an etch stopping layer, and where the etching composition includes ammonium persulfate between about 0.1% by weight and about 50% by weight, includes an azole-based compound between about 0.01% by weight and about 5% by weight and a remainder of water. Thus, reliability of the metal pattern and that of manufacturing a display substrate may be improved.

    摘要翻译： 在显示基板上形成金属图案的方法包括：在基底基板上铺设厚度在约至约为500埃之间的铜基层，并在铜基层上形成图案化的光致抗蚀剂层。 通过含有氧化调节剂的蚀刻组合物对铜基层进行过蚀刻，其中过蚀刻因子在约40％至约200％之间，同时使用图案化的光致抗蚀剂层作为蚀刻停止层，并且其中蚀刻组合物 包括约0.1重量％至约50重量％的过硫酸铵，包括约0.01重量％至约5重量％的唑类化合物和剩余的水。 因此，可以提高金属图案的可靠性和制造显示基板的可靠性。