公开(公告)号：US20120007781A1

公开(公告)日：2012-01-12

申请号：US12984081

申请日：2011-01-04

申请人： Joo Yong KIM ,  Dong Young KIM ,  Kwang Jae OH ,  Yun Hwi PARK ,  Bong Gyun KIM ,  Yoon Hyuck CHOI ,  Seok Chool YOON

发明人： Joo Yong KIM ,  Dong Young KIM ,  Kwang Jae OH ,  Yun Hwi PARK ,  Bong Gyun KIM ,  Yoon Hyuck CHOI ,  Seok Chool YOON

IPC分类号： H01Q1/38

CPC分类号： H01Q9/0407 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q19/005

摘要： There is provided an antenna module. The antenna module according to the present invention may include a patch antenna resonator formed on a surface of a dielectric substrate; and a surface wave-radiation resonator disposed to be separated from the patch antenna resonator, and formed to surround the patch antenna resonator so that signals from the patch antenna resonator are radiated. In this instance, the signals may flow on the surface of the dielectric substrate.

摘要翻译： 提供了天线模块。 根据本发明的天线模块可以包括形成在电介质基板的表面上的贴片天线谐振器; 以及布置成与贴片天线谐振器分离的表面波辐射谐振器，并且形成为围绕贴片天线谐振器，从而辐射来自贴片天线谐振器的信号。 在这种情况下，信号可以在电介质基片的表面上流动。

公开(公告)号：US08053682B2

公开(公告)日：2011-11-08

申请号：US12467542

申请日：2009-05-18

申请人： Yun Hwi Park ,  Bong Gyun Kim ,  Yoon Hyuck Choi

发明人： Yun Hwi Park ,  Bong Gyun Kim ,  Yoon Hyuck Choi

IPC分类号： H05K1/11

CPC分类号： H05K3/4061 ,  H05K1/0242 ,  H05K3/4629 ,  H05K2201/0269 ,  H05K2201/096 ,  H05K2203/082 ,  Y10T428/24322 ,  Y10T428/24926

摘要： There is provided a multilayer ceramic substrate including a conductive via of a dual-layer structure capable of preventing loss in electrical conductivity and signal. The multilayer ceramic substrate includes: a plurality of dielectric layers; and a circuit pattern part formed on at least a portion of the dielectric layers, the circuit pattern part including at least one conductive via and conductive pattern, wherein the at least one conductive via comprises an outer peripheral portion and an inner peripheral portion, the outer peripheral portion formed along an inner wall of a via hole extending through the dielectric layers and formed of a first conductive material containing a metal, and the inner peripheral portion filled in the outer peripheral portion and formed of a second conductive material having a shrinkage initiation temperature higher than a shrinkage initiation temperature of the first conductive material.

摘要翻译： 提供了一种包括能够防止导电性和信号损失的双层结构的导电通孔的多层陶瓷基板。 多层陶瓷基板包括：多个电介质层; 以及形成在所述电介质层的至少一部分上的电路图形部分，所述电路图形部分包括至少一个导电通路和导电图案，其中所述至少一个导电通孔包括外周部分和内周部分， 沿着贯穿电介质层的通路孔的内壁形成的周边部分，并且由包含金属的第一导电材料形成，并且内周部分填充在外周部分中，并由具有收缩起始温度的第二导电材料形成 高于第一导电材料的收缩起始温度。

公开(公告)号：US20110011636A1

公开(公告)日：2011-01-20

申请号：US12654491

申请日：2009-12-22

申请人： Kwang Jae Oh ,  Joo Yong Kim ,  Yoon Hyuck Choi

发明人： Kwang Jae Oh ,  Joo Yong Kim ,  Yoon Hyuck Choi

IPC分类号： H05K1/16 ,  H05K3/30

CPC分类号： H05K1/167 ,  H05K3/4644 ,  H05K2201/09627 ,  H05K2201/09672 ,  H05K2203/171 ,  Y10T29/49082 ,  Y10T29/4913 ,  Y10T29/49162

摘要： There are provided a multilayer wiring board and a method of manufacturing the same. The multilayer wiring board according to an aspect of the invention may include: a main body having a plurality of insulting layers stacked upon each other, including a first layer provided as an inner layer and a second layer provided as an outer layer; a first resistor provided on the first layer; and a second resistor provided on the second layer, connected in parallel with the first resistor, and having a smaller area than the first resistor. The multilayer wiring board obtains a target resistance value using the first and second resistors formed on the first and second layers. The second resistor, formed on the outer layer, can have a smaller area than the first resistor. Accordingly, the usable area of the outer layer is increased to thereby reduce the size of the multilayer wiring board.

摘要翻译： 提供了一种多层布线板及其制造方法。 根据本发明的一个方面的多层布线板可以包括：主体，其具有堆叠在一起的多个绝缘层，包括设置为内层的第一层和设置为外层的第二层; 设置在第一层上的第一电阻器; 以及设置在所述第二层上的与所述第一电阻并联连接并且具有比所述第一电阻器小的面积的第二电阻器。 多层布线基板使用形成在第一层和第二层上的第一和第二电阻来获得目标电阻值。 形成在外层上的第二电阻器可以具有比第一电阻器更小的面积。 因此，增加了外层的可用面积，从而减小了多层布线板的尺寸。

公开(公告)号：US20100252305A1

公开(公告)日：2010-10-07

申请号：US12550812

申请日：2009-08-31

申请人： Yoon Hyuck CHOI ,  Dae Hyeong Lee ,  Jin Waun Kim ,  Kwang Jae Oh

发明人： Yoon Hyuck CHOI ,  Dae Hyeong Lee ,  Jin Waun Kim ,  Kwang Jae Oh

IPC分类号： H05K1/00 ,  B32B37/00 ,  B32B38/00

CPC分类号： H05K1/0201 ,  H01C1/148 ,  H01C7/003 ,  H05K1/0306 ,  H05K1/167 ,  H05K2201/066 ,  H05K2201/09909 ,  Y10T156/10

摘要： There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions.The adhesive portions are selectively formed, thereby preventing short circuits occurring between the resistor mounted onto the circuit board and the heat dissipation member. Accordingly, the reliability of components can be increased.Furthermore, an adhesive material used to connect the board and the heat dissipation member is formed of a thermally conductive material, thereby increasing heat dissipation efficiency.

摘要翻译： 提供了一种电路板模块及其制造方法。 电路板模块可以包括：电路板; 布置在电路板上的电阻器; 覆盖电阻器两端的焊盘; 粘合剂部分至少设置在焊盘上并由电绝缘材料形成; 以及散热构件，其设置在所述电阻器上并且使用所述粘合部分结合到所述焊盘。 选择性地形成粘合剂部分，从而防止在安装到电路板上的电阻器和散热构件之间发生短路。 因此，可以提高部件的可靠性。 此外，用于连接板和散热构件的粘合材料由导热材料形成，从而提高散热效率。

公开(公告)号：US08330049B2

公开(公告)日：2012-12-11

申请号：US12550812

申请日：2009-08-31

申请人： Yoon Hyuck Choi ,  Dae Hyeong Lee ,  Jin Waun Kim ,  Kwang Jae Oh

发明人： Yoon Hyuck Choi ,  Dae Hyeong Lee ,  Jin Waun Kim ,  Kwang Jae Oh

IPC分类号： H05K1/00

CPC分类号： H05K1/0201 ,  H01C1/148 ,  H01C7/003 ,  H05K1/0306 ,  H05K1/167 ,  H05K2201/066 ,  H05K2201/09909 ,  Y10T156/10

摘要： There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions.The adhesive portions are selectively formed, thereby preventing short circuits occurring between the resistor mounted onto the circuit board and the heat dissipation member. Accordingly, the reliability of components can be increased.Furthermore, an adhesive material used to connect the board and the heat dissipation member is formed of a thermally conductive material, thereby increasing heat dissipation efficiency.

摘要翻译： 提供了一种电路板模块及其制造方法。 电路板模块可以包括：电路板; 布置在电路板上的电阻器; 覆盖电阻器两端的焊盘; 粘合剂部分至少设置在焊盘上并由电绝缘材料形成; 以及散热构件，其设置在所述电阻器上并且使用所述粘合部分结合到所述焊盘。 选择性地形成粘合剂部分，从而防止在安装到电路板上的电阻器和散热构件之间发生短路。 因此，可以提高部件的可靠性。 此外，用于连接板和散热构件的粘合材料由导热材料形成，从而提高散热效率。

公开(公告)号：US20100055393A1

公开(公告)日：2010-03-04

申请号：US12467542

申请日：2009-05-18

申请人： Yun Hwi PARK ,  Bong Gyun Kim ,  Yoon Hyuck Choi

发明人： Yun Hwi PARK ,  Bong Gyun Kim ,  Yoon Hyuck Choi

IPC分类号： B32B3/10

CPC分类号： H05K3/4061 ,  H05K1/0242 ,  H05K3/4629 ,  H05K2201/0269 ,  H05K2201/096 ,  H05K2203/082 ,  Y10T428/24322 ,  Y10T428/24926

摘要： There is provided a multilayer ceramic substrate including a conductive via of a dual-layer structure capable of preventing loss in electrical conductivity and signal. The multilayer ceramic substrate includes: a plurality of dielectric layers; and a circuit pattern part formed on at least a portion of the dielectric layers, the circuit pattern part including at least one conductive via and conductive pattern, wherein the at least one conductive via comprises an outer peripheral portion and an inner peripheral portion, the outer peripheral portion formed along an inner wall of a via hole extending through the dielectric layers and formed of a first conductive material containing a metal, and the inner peripheral portion filled in the outer peripheral portion and formed of a second conductive material having a shrinkage initiation temperature higher than a shrinkage initiation temperature of the first conductive material.

摘要翻译： 提供了一种包括能够防止导电性和信号损失的双层结构的导电通孔的多层陶瓷基板。 多层陶瓷基板包括：多个电介质层; 以及形成在所述电介质层的至少一部分上的电路图形部分，所述电路图形部分包括至少一个导电通路和导电图案，其中所述至少一个导电通孔包括外周部分和内周部分， 沿着贯穿电介质层的通路孔的内壁形成的周边部分，并且由包含金属的第一导电材料形成，并且内周部分填充在外周部分中，并由具有收缩起始温度的第二导电材料形成 高于第一导电材料的收缩起始温度。

公开(公告)号：US08397379B2

公开(公告)日：2013-03-19

申请号：US13017950

申请日：2011-01-31

申请人： Je Hong Sung ,  Yoon Hyuck Choi

发明人： Je Hong Sung ,  Yoon Hyuck Choi

IPC分类号： H05K3/36

CPC分类号： H05K3/28 ,  H05K3/0073 ,  H05K3/4629 ,  H05K2201/0154 ,  H05K2203/0759 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method for fabricating a ceramic substrate includes: preparing a ceramic substrate; disposing a metal mask having a plurality of holes at an upper side of the ceramic substrate; and injecting a polyimide resin into the holes of the metal mask to form a polyimide thin film on the ceramic substrate. A thin film is formed on a ceramic substrate in a simpler manner, so the fabrication cost can be reduced and a fixed time can be shortened, thus increasing the efficiency of a product.

摘要翻译： 陶瓷基板的制造方法包括：制备陶瓷基板; 在陶瓷基板的上侧设置具有多个孔的金属掩模; 并将聚酰亚胺树脂注入到金属掩模的孔中，以在陶瓷基片上形成聚酰亚胺薄膜。 以简单的方式在陶瓷基板上形成薄膜，可以降低制造成本，缩短固定时间，提高产品的效率。

公开(公告)号：US20120047730A1

公开(公告)日：2012-03-01

申请号：US13017950

申请日：2011-01-31

申请人： Je Hong SUNG ,  Yoon Hyuck Choi

发明人： Je Hong SUNG ,  Yoon Hyuck Choi

IPC分类号： H05K3/10

CPC分类号： H05K3/28 ,  H05K3/0073 ,  H05K3/4629 ,  H05K2201/0154 ,  H05K2203/0759 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method for fabricating a ceramic substrate includes: preparing a ceramic substrate; disposing a metal mask having a plurality of holes at an upper side of the ceramic substrate; and injecting a polyimide resin into the holes of the metal mask to form a polyimide thin film on the ceramic substrate. A thin film is formed on a ceramic substrate in a simpler manner, so the fabrication cost can be reduced and a fixed time can be shortened, thus increasing the efficiency of a product.

摘要翻译： 陶瓷基板的制造方法包括：制备陶瓷基板; 在陶瓷基板的上侧设置具有多个孔的金属掩模; 并将聚酰亚胺树脂注入到金属掩模的孔中，以在陶瓷基片上形成聚酰亚胺薄膜。 以简单的方式在陶瓷基板上形成薄膜，可以降低制造成本，缩短固定时间，提高产品的效率。

公开(公告)号：US20120013360A1

公开(公告)日：2012-01-19

申请号：US12926802

申请日：2010-12-09

申请人： Kwang Jae Oh ,  Joo Yong Kim ,  Yoon Hyuck Choi ,  Bong Gyun Kim

发明人： Kwang Jae Oh ,  Joo Yong Kim ,  Yoon Hyuck Choi ,  Bong Gyun Kim

IPC分类号： G01R31/28 ,  H05K3/00

CPC分类号： G01R3/00 ,  G01R1/07378 ,  H05K1/0292 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/107 ,  H05K3/225 ,  H05K3/4629 ,  H05K2201/0979 ,  H05K2201/10378 ,  H05K2203/173

摘要： There are provided a method of repairing a probe card and a repaired probe board. The method of repairing a probe card includes: in a board body composed of a sintered ceramic having first and second pillar surfaces disposed at a position opposed to each other, preparing the board body including a plurality of main channels for electrically connecting a first pad formed on the first pillar surface to a second pad formed on a second pillar surface and reserved channels disposed to be adjacent to the main channels to repair to damaged main channels; when the main channels are damaged; removing the first and second pads formed in the main channels and the reserved channels; forming cavities by partially removing the board between the damaged main channels and the reserved channels adjacent to the main channel; and forming repair connection parts in the cavities in order to electrically connect the damaged main channels to the reserved channels adjacent thereto.

摘要翻译： 提供了一种修复探针卡和修理的探针板的方法。 修补探针卡的方法包括：在由具有设置在彼此相对的位置的第一和第二柱面的烧结陶瓷构成的板主体中，准备板主体，其包括多个主通道，用于电连接形成的第一焊盘 在第一柱面上，形成在第二柱面上的第二焊盘，以及设置成邻近主通道的保留通道，以修复损坏的主通道; 当主渠道受损时; 去除在主通道和预留通道中形成的第一和第二焊盘; 通过在损坏的主通道和与主通道相邻的预留通道之间部分地去除板来形成空腔; 以及在空腔中形成修复连接部分，以便将损坏的主通道电连接到与其相邻的预留通道。

公开(公告)号：US20090176875A1

公开(公告)日：2009-07-09

申请号：US11971614

申请日：2008-01-09

申请人： Dong-Pyo Kim ,  Yoon-Hyuck Choi ,  Choong G. Row

发明人： Dong-Pyo Kim ,  Yoon-Hyuck Choi ,  Choong G. Row

IPC分类号： A61K31/28 ,  A61K31/315 ,  A61K31/295 ,  A61K31/30

CPC分类号： A61K9/08 ,  A61K9/0014 ,  A61K31/28 ,  A61K31/295 ,  A61K31/30 ,  A61K31/315 ,  A61K33/24 ,  A61K33/30 ,  A61K33/34 ,  A61K47/32 ,  A61K47/34

摘要： A method for manufacturing a stabilized metal nano particle solution is disclosed. This method manufactures a metal nano particle solution so as to make a metal substance such as silver, gold, copper, zinc or cobalt into ultra-capsular nano particles. That is to say, this new method is simple and suitable for mass production without requiring any separate reducer putting process at a room temperature while a transition metal nano particle solution is produced. In this method, an alcohol solution including a metal salt solution and a soluble polymer is mixed at a room temperature to make a nano metal particle solution with a particle size of 100 nm or less.

摘要翻译： 公开了一种用于制造稳定的金属纳米颗粒溶液的方法。 该方法制造金属纳米颗粒溶液，以使诸如银，金，铜，锌或钴的金属物质成为超薄纳米颗粒。 也就是说，这种新方法简单，适用于批量生产，而不需要在室温下进行单独的减速器放置过程，同时生产过渡金属纳米颗粒溶液。 在该方法中，将包含金属盐溶液和可溶性聚合物的醇溶液在室温下混合，制成粒径为100nm以下的纳米金属粒子溶液。