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    ELECTRICALLY CONDUCTIVE BONDING TAPE WITH LOW PASSIVE INTERMODULATION
    1.
    发明申请
    ELECTRICALLY CONDUCTIVE BONDING TAPE WITH LOW PASSIVE INTERMODULATION 有权

    公开(公告)号：US20230110790A1

    公开(公告)日：2023-04-13

    申请号：US17992224

    申请日：2022-11-22

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jeongwan Choi ,  Jeffrey W. McCutcheon ,  Marina M. Kaplun ,  Steven Y. Yu ,  Jinbae Kim

    IPC: C09J7/38 ,  H01R4/04 ,  H05K9/00 ,  C09J7/28 ,  C09J7/25

    Abstract: An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

    INTEGRAL ELECTRONIC STACK
    5.
    发明申请
    INTEGRAL ELECTRONIC STACK 有权

    公开(公告)号：US20240414845A1

    公开(公告)日：2024-12-12

    申请号：US18698113

    申请日：2022-10-05

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jeongwan Choi ,  Jong-Pil Kim ,  Jinbae Kim ,  Jeffrey W. McCutcheon

    IPC: H05K1/14 ,  H05K3/46

    Abstract: The disclosure relates to an integral electronic stack and a multi-layer stack. Specifically, according to an embodiment of the disclosure, there is provided an integral electronic stack for grounding an electrically conductive component in which passive intermodulation (PIM) is reduced, wherein the integral electronic stack includes a first integral stack and a second integral stack, the first integral stack being bonded to the second integral stack, wherein the first integral stack includes: a first board which is substantially rigid; a first electrically conductive layer which is disposed on at least part of a first main surface of the first board; a first electrically conductive adhesive layer and a second electrically conductive adhesive layer; and a first electrically conductive film which is disposed between the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, and is bonded to the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, respectively, the first electrically conductive adhesive layer and the second electrically conductive adhesive layer including a plurality of electrically conductive elements substantially distributed in an electrically insulative material, wherein the first electrically conductive adhesive layer bonds the first electrically conductive film to the one or more first electrically conductive layer.

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