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公开(公告)号：US20210394454A1
公开(公告)日：2021-12-23
申请号：US17343573
申请日：2021-06-09
Applicant: Applied Materials, Inc.
Inventor： Igor ABRAMSON , Mo YANG , Jason G. FUNG , Douglas KITAJIMA
IPC: B29C64/393 , G01B11/27 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B29C64/112
Abstract: Embodiments of the present disclosure generally relate to droplet ejecting additive manufacturing systems used in the manufacturing of advanced polishing articles. In particular, embodiments herein provide methods for aligning a plurality of dispense heads of the additive manufacturing system. In one embodiment, a method for aligning a plurality of dispense heads of an additive manufacturing system includes forming an alignment test pattern comprising droplets dispensed from each of the plurality of dispense heads, comparing the placement of one or more of the droplets to determine offset distances therebetween, and generating one or more timing offsets based on the offset distances. In some embodiments, the method further includes using the timing offsets to control the dispensing of droplets from one or more of the plurality of dispense heads in a subsequent additive manufacturing process.
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公开(公告)号：US20210187693A1
公开(公告)日：2021-06-24
申请号：US17036623
申请日：2020-09-29
Applicant: Applied Materials, Inc.
Inventor： Aniruddh Jagdish KHANNA , Jason G. FUNG , Puneet Narendra JAWALI , Rajeev BAJAJ , Adam Wade MANZONIE , Nandan BARADANAHALLI KENCHAPPA , Veera Raghava Reddy KAKIREDDY , Joonho AN , Jaeseok KIM , Mayu YAMAMURA
Abstract: Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.
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公开(公告)号：US20240025010A1
公开(公告)日：2024-01-25
申请号：US18480060
申请日：2023-10-03
Applicant: Applied Materials, Inc.
Inventor： Puneet Narendra JAWALI , Nandan BARADANAHALLI KENCHAPPA , Jason G. FUNG , Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE , Rajeev BAJAJ , Adam Wade MANZONIE , Andrew Scott LAWING
Abstract: Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.
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公开(公告)号：US20240025009A1
公开(公告)日：2024-01-25
申请号：US18377073
申请日：2023-10-05
Applicant: Applied Materials, Inc.
Inventor： Aniruddh Jagdish KHANNA , Jason G. FUNG , Puneet Narendra JAWALI , Rajeev BAJAJ , Adam Wade MANZONIE , Nandan BARADANAHALLI KENCHAPPA , Veera Raghava Reddy KAKIREDDY , Joonho AN , Jaeseok KIM , Mayu YAMAMURA
CPC classification number: B24B37/20 , B24B37/042
Abstract: Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.
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公开(公告)号：US20170133252A1
公开(公告)日：2017-05-11
申请号：US14935134
申请日：2015-11-06
Applicant: Applied Materials, Inc.
Inventor： Jason G. FUNG , Rajeev BAJAJ , Daniel REDFIELD , Aniruddh KHANNA , Mario CORNEJO , Gregory E. MENK , John WATKINS
IPC: H01L21/67 , H01L21/66 , B24B37/26 , B29C67/00 , B24B49/14 , B24B49/16 , B24B49/10 , H01L21/306 , B24B49/00
CPC classification number: H01L21/67253 , B24B37/26 , B24B49/003 , B24B49/10 , B24B49/14 , B24B49/16 , B29C64/106 , B29K2995/0003 , B29K2995/0005 , B29L2031/736 , B33Y10/00 , B33Y80/00 , H01L21/30625 , H01L21/67075 , H01L21/67294 , H01L22/12 , H01L22/20 , H01L22/26
Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.
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Patent Agency Ranking
公开(公告)号：US20160107295A1
公开(公告)日：2016-04-21
申请号：US14885950
申请日：2015-10-16
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava Reddy KAKIREDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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公开(公告)号：US20210394333A1
公开(公告)日：2021-12-23
申请号：US16906992
申请日：2020-06-19
Applicant: Applied Materials, Inc.
Inventor： Puneet Narendra JAWALI , Nandan BARADANAHALLI KENCHAPPA , Jason G. FUNG , Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE , Rajeev BAJAJ , Adam Wade MANZONIE , Andrew Scott LAWING
Abstract: Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.
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公开(公告)号：US20210107116A1
公开(公告)日：2021-04-15
申请号：US17114633
申请日：2020-12-08
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh Jagdish KHANNA , Jason G. FUNG , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava Reddy KAKIREDDY , Gregory E. MENK , Nag B. PATIBANDLA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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9.发明申请公开(公告)号：US20200147750A1
公开(公告)日：2020-05-14
申请号：US16746065
申请日：2020-01-17
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Kasiraman KRISHNAN , Mahendra C. ORILALL , Daniel REDFIELD , Fred C. REDEKER , Nag B. PATIBANDLA , Gregory E. MENK , Jason G. FUNG , Russell Edward PERRY , Robert E. DAVENPORT
Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
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10.发明申请公开(公告)号：US20180043613A1
公开(公告)日：2018-02-15
申请号：US15722810
申请日：2017-10-02
Applicant: Applied Materials, Inc.
Inventor： Kasiraman KRISHNAN , Daniel REDFIELD , Russell Edward PERRY , Gregory E. MENK , Rajeev BAJAJ , Fred C. REDEKER , Nag B. PATIBANDLA , Mahendra C. ORILALL , Jason G. FUNG
IPC: B24B37/26 , B24B37/22 , B29L31/00 , B29K105/16
Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.
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