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公开(公告)号：US10821573B2
公开(公告)日：2020-11-03
申请号：US14887240
申请日：2015-10-19
Applicant: Applied Materials, Inc.
Inventor： Rajeev Bajaj , Daniel Redfield , Mahendra C. Orilall , Boyi Fu , Aniruddh Khanna , Jason G. Fung , Mario Cornejo , Ashwin Chockalingam , Mayu Yamamura , Veera Raghava Reddy Kakireddy , Ashavani Kumar , Venkat Hariharan , Gregory E. Menk , Fred C. Redeker , Nag B. Patibandla , Hou T. Ng , Robert E. Davenport , Amritanshu Sinha
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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Patent Agency Ranking
公开(公告)号：US11685014B2
公开(公告)日：2023-06-27
申请号：US16529884
申请日：2019-08-02
Applicant: Applied Materials, Inc.
Inventor： Sivapackia Ganapathiappan , Ankit Vora , Boyi Fu , Venkat Hariharan , Mayu Yamamura , Mario Cornejo , Igor Abramson , Mo Yang , Daniel Redfield , Rajeev Bajaj , Nag B. Patibandla
IPC: B24B37/24 , C08F283/00 , B33Y10/00 , B29C64/112 , B33Y70/10 , B29L31/00 , B33Y80/00
CPC classification number: B24B37/24 , B29C64/112 , B33Y10/00 , B33Y70/10 , C08F283/008 , B29L2031/736 , B33Y80/00
Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.
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公开(公告)号：US10773509B2
公开(公告)日：2020-09-15
申请号：US15452053
申请日：2017-03-07
Applicant: Applied Materials, Inc.
Inventor： Hou T. Ng , Nag B. Patibandla , Rajeev Bajaj , Daniel Redfield , Ashwin Chockalingam , Mayu Yamamura , Mario Cornejo
Abstract: A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.
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公开(公告)号：US11986922B2
公开(公告)日：2024-05-21
申请号：US16731492
申请日：2019-12-31
Applicant: Applied Materials, Inc.
Inventor： Jason G. Fung , Rajeev Bajaj , Daniel Redfield , Aniruddh Jagdish Khanna , Mario Cornejo , Gregory E. Menk , John Watkins
IPC: B29C64/00 , B24B37/26 , B24B49/00 , B24B49/10 , B24B49/14 , B24B49/16 , B33Y10/00 , B33Y80/00 , H01L21/306 , H01L21/66 , H01L21/67 , B29L31/00
CPC classification number: B24B37/26 , B24B49/003 , B24B49/10 , B24B49/14 , B24B49/16 , B33Y10/00 , B33Y80/00 , H01L21/30625 , H01L21/67075 , H01L21/67253 , H01L21/67294 , H01L22/20 , B29K2995/0003 , B29K2995/0005 , B29L2031/736 , H01L22/12 , H01L22/26
Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.
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公开(公告)号：US10593574B2
公开(公告)日：2020-03-17
申请号：US14935134
申请日：2015-11-06
Applicant: Applied Materials, Inc.
Inventor： Jason G. Fung , Rajeev Bajaj , Daniel Redfield , Aniruddh Khanna , Mario Cornejo , Gregory E. Menk , John Watkins
IPC: B24B37/013 , H01L21/67 , B29C64/106 , B33Y10/00 , B33Y80/00 , B24B37/26 , B24B49/00 , B24B49/10 , B24B49/14 , B24B49/16 , H01L21/306 , H01L21/66 , B29L31/00
Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.
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公开(公告)号：US10384330B2
公开(公告)日：2019-08-20
申请号：US14885950
申请日：2015-10-16
Applicant: Applied Materials, Inc.
Inventor： Rajeev Bajaj , Daniel Redfield , Mahendra C. Orilall , Boyi Fu , Aniruddh Khanna , Jason G. Fung , Mario Cornejo , Ashwin Chockalingam , Mayu Yamamura , Veera Raghava Reddy Kakireddy , Ashavani Kumar , Venkat Hariharan , Gregory E. Menk , Fred C. Redeker , Nag B. Patibandla , Hou T. Ng , Robert E. Davenport , Amritanshu Sinha
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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