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公开(公告)号:US11856661B1
公开(公告)日:2023-12-26
申请号:US17183864
申请日:2021-02-24
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor: David Neuman , Pat Connolly , Brian Backes
CPC classification number: H05B3/34 , H05B3/18 , H05B3/342 , H05B3/347 , H05B2203/002 , H05B2203/003 , H05B2203/007 , H05B2203/011 , H05B2203/014 , H05B2203/029
Abstract: A heating element includes a flexible substrate, a layer of adhesive disposed on a surface of the substrate, and a continuous strand of electrically conductive wire disposed on the adhesive in a pattern of coil structures. Each coil structure includes a first coiled part and a second coiled part. The wire in the first coiled part forms a counterclockwise pattern from an outermost turn to an innermost turn of the first coiled part, and the second coiled part has an innermost turn beginning at an end of the innermost turn of the first coiled part. The wire in the second coiled part forms a clockwise pattern from the innermost turn of the second coiled part to an outermost turn. A connector segment of wire connects outermost turns of adjacent ones of the coil structures.
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公开(公告)号:US10398873B1
公开(公告)日:2019-09-03
申请号:US16041392
申请日:2018-07-20
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor: Kimmo Kyllonen , David Neuman , Scott Lindblad
Abstract: A disclosed cable includes a roll of flexible substrate. The substrate has opposing first and second surfaces and the roll is structured around an axis. A plurality of electrically conductive wires are attached to the first surface of the substrate, and the roll of flexible substrate and attached plurality of wires have alternating layers of wires and substrate.
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公开(公告)号:US09781839B1
公开(公告)日:2017-10-03
申请号:US14883302
申请日:2015-10-14
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor: David Neuman , Robert Neuman , Pat Connolly , Brian Backes
CPC classification number: H05K3/321 , H05K3/10 , H05K3/103 , H05K2201/10287
Abstract: A method of attaching wire to an exposed surface of an adhesive layer includes guiding wire from a wire source through a payout head and through a foot of a write head. A first portion of the wire extends from the foot toward the adhesive layer. The write head is positioned such that a gap between the foot and the exposed surface of the adhesive layer is greater than a diameter of the wire. The write head is moved in a motion parallel to the adhesive layer, and the first portion of the wire adheres to the adhesive layer. Wire is pulled from the wire source by the payout head as the write head is moving in order to maintain slack in a second portion of the wire between the payout head and the write head as the wire is attached to the exposed surface of the adhesive layer.
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公开(公告)号:US11793717B1
公开(公告)日:2023-10-24
申请号:US17851636
申请日:2022-06-28
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor: David Neuman
CPC classification number: A61J1/035 , A61J7/0409 , B65D75/367 , B65D75/5855 , B65D2203/10 , Y10T29/49162
Abstract: Approaches for use in making a lid for a blister package include forming a continuous pattern of electrically conductive wire on an adhesive surface of a substrate. The continuous pattern has a plurality of detector segments, and each detector segment has an outer connector portion and an inner connector portion. The outer connector portion and the inner connector portion of each detector segment are adjacent to one another, and pairs of successive first and second detector segments of the plurality of detector segments are connected by the inner connector portion of the first detector segment and the outer connector portion of the second detector segment. The forming includes forming an arced segment between the inner connector portion of the first detector segment and the outer connector portion of the second detector segment.
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公开(公告)号:US10995931B1
公开(公告)日:2021-05-04
申请号:US16986763
申请日:2020-08-06
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor: Aaron M. Anderson , Scott Lindblad , David Neuman
IPC: F21V3/02 , G02B5/02 , F21Y115/00
Abstract: The disclosed lighting apparatus has a light-diffusive panel having opposing first and second faces bounded by one or more sides and having one or more channels extending inward from one of the one or more sides. A first conductor is disposed on the first face of the light-diffusive panel and is proximate a first side. The first conductor has a concave section disposed within a channel of the one or more channels. A second conductor is disposed on the second face of the light-diffusive panel and is proximate the first side. The second conductor has a concave section disposed within a channel. Solid-state lighting (SSL) elements have light emitting portions that face a second side that is adjacent to the first side of the light-diffusive panel, and the SSL elements are electrically coupled to the first conductor and to the second conductor.
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公开(公告)号:US10786428B1
公开(公告)日:2020-09-29
申请号:US16373111
申请日:2019-04-02
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor: David Neuman
Abstract: A lid for a blister package has a continuous pattern of wire on an adhesive surface of a substrate. The continuous pattern has multiple detector segments, and the detector segments have respective destructible portions of wire at locations on the substrate corresponding to cavities of a blister sheet. Each detector segment has an outer connector portion and an inner connector portion. The outer connector portion and the inner connector portion of each detector segment are adjacent, and pairs of successive detector segments are connected by the inner connector portion of the one detector segment and the outer connector portion of the next detector segment. The continuous pattern of wire is severed at the outer connector portions and inner connector portions of the plurality of detector segments in order to disconnects the detector segments one from another, and form terminal ends of the detector segments.
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公开(公告)号:US10168037B1
公开(公告)日:2019-01-01
申请号:US15171328
申请日:2016-06-02
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor: David Neuman , Scott Lindblad , Pat Connolly
IPC: F21K9/90 , F21V23/00 , F21Y101/02
Abstract: A disclosed lighting apparatus includes a first dielectric sheet disposed on the first electrically conductive sheet and a second electrically conductive sheet disposed on the first dielectric sheet. A plurality of solid-state lighting (SSL) elements are electrically coupled to the first electrically conductive sheet and to the second electrically conductive sheet. The first electrically conductive sheet, first dielectric sheet, and second electrically conductive sheet have bends that configure the first electrically conductive sheet, first dielectric sheet, and second electrically conductive sheet in a three-dimensional shape.
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公开(公告)号:US09606285B1
公开(公告)日:2017-03-28
申请号:US14575648
申请日:2014-12-18
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor: Scott Lindblad , David Neuman , Matthew Odden
IPC: F21V8/00 , F21Y101/02 , F21Y105/00
CPC classification number: G02B6/0083 , F21V23/002 , F21Y2103/10 , F21Y2115/10 , G02B6/0081 , H01L2224/49109
Abstract: A disclosed lighting apparatus includes a light-diffusive plate having opposing first and second faces bounded by one or more sides. A first electrically conductive sheet is disposed on the first face of the light-diffusive plate, and an electrically insulative sheet is disposed on the first electrically conductive sheet. A second electrically conductive sheet is disposed on the electrically insulative sheet. A plurality of light-emitting diodes (LEDs) have light emitting portions that face a portion of the light-diffusive plate. The LEDs are electrically coupled to the first electrically conductive sheet and to the second electrically conductive sheet.
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公开(公告)号:US09431363B1
公开(公告)日:2016-08-30
申请号:US14553519
申请日:2014-11-25
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor: Scott Lindblad , David Neuman , Robert Neuman
CPC classification number: H01L24/46 , G06K19/07749 , G06K19/0775 , G06K19/07783 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L33/62 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48472 , H01L2224/48997 , H01L2224/4903 , H01L2224/4905 , H01L2224/4911 , H01L2224/494 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/0782 , H01L2924/12041 , H01L2924/14 , H01L2924/19107 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2224/85399
Abstract: A circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, and one or more round wire segments attached to the substrate. The one or more round wire segments have first and second portions for connecting to the IC component, and each first and second portion has a planar landing area extending longitudinally along the wire. The circuit arrangement further includes bond wires connecting the landing areas to the IC component.
Abstract translation: 电路装置包括衬底,附着到衬底的集成电路(IC)部件和附接到衬底的一个或多个圆形线段。 一个或多个圆形线段具有用于连接到IC部件的第一和第二部分,并且每个第一和第二部分具有沿着线纵向延伸的平面着陆区域。 电路装置还包括将着陆区域连接到IC部件的接合线。
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公开(公告)号:US08893976B1
公开(公告)日:2014-11-25
申请号:US13945016
申请日:2013-07-18
Applicant: Automated Assembly Corporation
Inventor: Scott Lindblad , David Neuman , Robert Neuman
IPC: G06K19/02 , G06K19/077
CPC classification number: G06K19/07798 , B60R2325/105 , G08G1/017 , G09F3/0292 , G09F3/0297
Abstract: A tamper-resistant electronic system includes a destructible vinyl (DV) substrate having conductive wiring disposed on a first surface of the DV substrate. An RFID device has pins mechanically and electrically connected to the wiring on the first surface of the DV substrate. A plate has a first surface, and a portion of the first surface of the plate is adhered to a portion of the first surface of the DV substrate. The plate has a cavity that encompasses the RFID device. A backing is adhered to a second surface of the plate opposite the first surface of the plate.
Abstract translation: 防篡改电子系统包括具有设置在DV基板的第一表面上的导电布线的可破坏乙烯基(DV)基板。 RFID设备具有机械地和电连接到DV基板的第一表面上的布线的引脚。 板具有第一表面,并且板的第一表面的一部分粘附到DV基板的第一表面的一部分。 该板具有包围RFID装置的空腔。 背衬粘附到板的与板的第一表面相对的第二表面。
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