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公开(公告)号：US20120086589A1
公开(公告)日：2012-04-12
申请号：US12899205
申请日：2010-10-06
摘要： Traditionally, pipelined continuous-time (CT) sigma-delta modulators (SDM) have been difficult to build due at least in part to the difficulties in calibrating the pipeline. Here, however, a pipelined CT SDM is provided that has an architecture that is conducing to being calibrated. Namely, the system includes a digital filter and other features that can be adjusted to account for input imbalance errors and well as quantization leakage noise.
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公开(公告)号：US08970411B2
公开(公告)日：2015-03-03
申请号：US13601795
申请日：2012-08-31
IPC分类号： H03M3/00
摘要： Traditionally, pipelined continuous-time (CT) sigma-delta modulators (SDM) have been difficult to build due at least in part to the difficulties in calibrating the pipeline. Here, however, a pipelined CT SDM is provided that has an architecture that is conducing to being calibrated. Namely, the system includes a digital filter and other features that can be adjusted to account for input imbalance errors and well as quantization leakage noise.
摘要翻译： 传统上，流水线连续时间（CT）Σ-Δ调制器（SDM）已经难以构建，至少部分是由于校准管道的困难。 然而，这里提供了一种流水线CT SDM，其具有有助于被校准的架构。 也就是说，该系统包括数字滤波器和其他可调整的特征，以解决输入不平衡误差以及量化泄漏噪声。
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公开(公告)号：US20120326906A1
公开(公告)日：2012-12-27
申请号：US13601795
申请日：2012-08-31
IPC分类号： H03M3/02
摘要： Traditionally, pipelined continuous-time (CT) sigma-delta modulators (SDM) have been difficult to build due at least in part to the difficulties in calibrating the pipeline. Here, however, a pipelined CT SDM is provided that has an architecture that is conducing to being calibrated. Namely, the system includes a digital filter and other features that can be adjusted to account for input imbalance errors and well as quantization leakage noise.
摘要翻译： 传统上，流水线连续时间（CT）Σ-Δ调制器（SDM）已经难以构建，至少部分是由于校准管道的困难。 然而，这里提供了一种流水线CT SDM，其具有有助于被校准的架构。 也就是说，该系统包括数字滤波器和其他可调整的特征，以解决输入不平衡误差以及量化泄漏噪声。
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公开(公告)号：US08284085B2
公开(公告)日：2012-10-09
申请号：US12899205
申请日：2010-10-06
IPC分类号： H03M3/00
摘要： Traditionally, pipelined continuous-time (CT) sigma-delta modulators (SDM) have been difficult to build due at least in part to the difficulties in calibrating the pipeline. Here, however, a pipelined CT SDM is provided that has an architecture that is conducing to being calibrated. Namely, the system includes a digital filter and other features that can be adjusted to account for input imbalance errors and well as quantization leakage noise.
摘要翻译： 传统上，流水线连续时间（CT）Σ-Δ调制器（SDM）已经难以构建，至少部分是由于校准管道的困难。 然而，这里提供了一种流水线CT SDM，其具有有助于被校准的架构。 也就是说，该系统包括数字滤波器和其他可调整的特征，以解决输入不平衡误差以及量化泄漏噪声。
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公开(公告)号：US08472437B2
公开(公告)日：2013-06-25
申请号：US13026777
申请日：2011-02-14
申请人： Nirmal Chindhu Warke , Srinath Hosur , Martin J. Izzard , Siraj Akhtar , Baher S. Haroun , Marco Corsi
发明人： Nirmal Chindhu Warke , Srinath Hosur , Martin J. Izzard , Siraj Akhtar , Baher S. Haroun , Marco Corsi
CPC分类号： H04W40/00 , H01Q3/26 , H01Q9/20 , H01Q21/0006 , H01Q21/0037 , H04B7/0617 , H04B17/336 , H04L45/74 , H04L49/3009 , H04L49/40 , H04W40/06 , H04W40/12 , Y02D70/00 , Y02D70/166 , Y02D70/322 , Y02D70/34
摘要： Embodiments of the invention provide a system and method for chip to chip communications in electronic circuits. A router or switch receives data packets at input port ASICs. A routing table on the input port ASIC or on a routing ASIC is used to identify a destination port ASIC based upon header information in the data packet. The data packet is transmitted from the input port ASIC to the destination port ASIC using millimeter wave signals that are transmitted across a waveguide or a wireless interface.
摘要翻译： 本发明的实施例提供了一种用于电子电路中芯片到芯片通信的系统和方法。 路由器或交换机在输入端口ASIC处接收数据包。 输入端口ASIC或路由ASIC上的路由表用于根据数据包中的报头信息识别目标端口ASIC。 使用在波导或无线接口上传输的毫米波信号，将数据分组从输入端口ASIC发送到目标端口ASIC。
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6.发明申请CHIP TO DIELECTRIC WAVEGUIDE INTERFACE FOR SUB-MILLIMETER WAVE COMMUNICATIONS LINK 有权切割到用于亚微波通信的电介质波导接口公开(公告)号：US20120068891A1
公开(公告)日：2012-03-22
申请号：US12887323
申请日：2010-09-21
申请人： Baher S. Haroun , Marco Corsi , Siraj Akhtar , Nirmal C. Warke
发明人： Baher S. Haroun , Marco Corsi , Siraj Akhtar , Nirmal C. Warke
IPC分类号： H01Q1/24
CPC分类号： H01Q3/44 , H01L23/3107 , H01L23/66 , H01L24/16 , H01L24/48 , H01L24/49 , H01L2223/6677 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/48227 , H01L2224/48247 , H01L2224/49175 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/3011 , H01Q3/26 , H01Q9/0407 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth.
摘要翻译： 在一些开发的互连技术中，例如芯片到芯片的光学互连或金属波导互连，错位可能是一个严重的问题。 然而，这里提供了使用片上定向天线（其在亚毫米范围内操作）通过介质波导形成射频（RF）互连的互连。 该系统允许不对准，同时提供增加的通信带宽。
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公开(公告)号：US20130265732A1
公开(公告)日：2013-10-10
申请号：US13439557
申请日：2012-04-04
CPC分类号： H05K1/0239 , G02B6/12004 , G02B6/1228 , H01L2223/6627 , H01L2224/16227 , H01L2924/15311 , H01P3/121 , H01P3/16 , H05K1/0243 , H05K1/025 , H05K1/0274 , H05K1/115 , H05K1/18 , H05K2201/0187 , H05K2201/037 , H05K2201/09618 , H05K2201/10098
摘要： An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.
摘要翻译： 提供了一种装置。 存在具有封装基板和集成电路（IC）的电路组件。 封装衬底具有微带线，并且IC被固定到封装衬底并且电耦合到微带线。 电路板也固定到封装衬底。 介质波导固定在电路板上。 电介质波导具有延伸到位于电介质波导和微带线之间的过渡区域的介质芯，并且微带线被配置为与介质波导形成通信链路。
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8.发明授权公开(公告)号：US09405064B2
公开(公告)日：2016-08-02
申请号：US13439557
申请日：2012-04-04
CPC分类号： H05K1/0239 , G02B6/12004 , G02B6/1228 , H01L2223/6627 , H01L2224/16227 , H01L2924/15311 , H01P3/121 , H01P3/16 , H05K1/0243 , H05K1/025 , H05K1/0274 , H05K1/115 , H05K1/18 , H05K2201/0187 , H05K2201/037 , H05K2201/09618 , H05K2201/10098
摘要： An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.
摘要翻译： 提供了一种装置。 存在具有封装基板和集成电路（IC）的电路组件。 封装衬底具有微带线，并且IC被固定到封装衬底并且电耦合到微带线。 电路板也固定到封装衬底。 介质波导固定在电路板上。 电介质波导具有延伸到位于电介质波导和微带线之间的过渡区域的介质芯，并且微带线被配置为与介质波导形成通信链路。
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9.发明申请公开(公告)号：US20130265734A1
公开(公告)日：2013-10-10
申请号：US13439646
申请日：2012-04-04
CPC分类号： G02B6/12004 , G02B6/1228 , G02B6/43 , H01L2223/6627 , H01L2224/16227 , H01L2924/15311 , H01P3/121 , H01P3/122 , H01P5/107 , H05K1/0239 , H05K1/0243 , H05K1/025 , H05K1/0274 , H05K2201/0187 , H05K2201/037 , H05K2201/09618 , H05K2201/10098
摘要： An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.
摘要翻译： 提供了一种装置。 存在具有封装基板和集成电路（IC）的电路组件。 封装衬底具有微带线，并且IC被固定到封装衬底并且电耦合到微带线。 电路板也固定到封装衬底。 介质波导固定在电路板上。 电介质波导具有延伸到位于电介质波导和微带线之间的过渡区域的介质芯，并且微带线被配置为与介质波导形成通信链路。
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10.发明授权Chip to dielectric waveguide interface for sub-millimeter wave communications link 有权芯片到介质波导接口用于亚毫米波通信链路公开(公告)号：US09123737B2
公开(公告)日：2015-09-01
申请号：US12887323
申请日：2010-09-21
申请人： Baher S. Haroun , Marco Corsi , Siraj Akhtar , Nirmal C. Warke
发明人： Baher S. Haroun , Marco Corsi , Siraj Akhtar , Nirmal C. Warke
CPC分类号： H01Q3/44 , H01L23/3107 , H01L23/66 , H01L24/16 , H01L24/48 , H01L24/49 , H01L2223/6677 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/48227 , H01L2224/48247 , H01L2224/49175 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/3011 , H01Q3/26 , H01Q9/0407 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth.
摘要翻译： 在一些开发的互连技术中，例如芯片到芯片的光学互连或金属波导互连，错位可能是一个严重的问题。 然而，这里提供了使用片上定向天线（其在亚毫米范围内操作）通过介质波导形成射频（RF）互连的互连。 该系统允许不对准，同时提供增加的通信带宽。
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