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    WIRELESS BUS FOR INTRA-CHIP AND INTER-CHIP COMMUNICATION, INCLUDING EMBODIMENTS WITH ADAPTABLE LINKS
    1.
    发明申请
    WIRELESS BUS FOR INTRA-CHIP AND INTER-CHIP COMMUNICATION, INCLUDING EMBODIMENTS WITH ADAPTABLE LINKS 有权
    无线总线用于片内和片段间通信，包括具有适应链路的实体

    公开(公告)号：US20150162958A1

    公开(公告)日：2015-06-11

    申请号：US14621777

    申请日：2015-02-13

    Applicant: Broadcom Corporation

    Inventor： Ahmadreza (Reza) Rofougaran ,  Arya Reza Behzad ,  Sam Ziqum Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

    IPC: H04B5/00

    CPC classification number: G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

    Abstract: Embodiments of the present invention are directed to a scalable wireless bus for intra-chip and inter-chip communication. The scalable wireless bus includes a plurality of wireless-enabled components (WECs). In an embodiment, the scalable wireless bus may have at least one of the number of links among WECs and the capacity of said links adapted based on one or more factors. For example, the number of links and the capacity of the links may be adapted according to one or more of, among other factors, expected activity level over the wireless bus, desired power consumption, delay, and interference levels.

    Abstract translation: 本发明的实施例涉及用于片内和芯片间通信的可扩展无线总线。 可扩展无线总线包括多个无线使能组件（WEC）。 在一个实施例中，可扩展无线总线可以具有基于一个或多个因素的WEC之间的链路数量和所述链路的容量中的至少一个链路。 例如，链路的数量和链路的容量可以根据无线总线上的预期活动级别，期望的功率消耗，延迟和干扰级别中的一个或多个来调整。

    Identifying defective components on a wafer using component triangulation
    2.
    发明授权
    Identifying defective components on a wafer using component triangulation 有权
    使用组件三角测量在晶圆上识别缺陷组件

    公开(公告)号：US09046576B2

    公开(公告)日：2015-06-02

    申请号：US13944430

    申请日：2013-07-17

    Applicant: Broadcom Corporation

    Inventor： Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

    IPC: G01R31/00 ,  G01R31/319 ,  G01R31/302 ,  G01R31/311 ,  H01L23/544 ,  G01R31/28

    CPC classification number: G01R31/319 ,  G01R31/2834 ,  G01R31/3025 ,  G01R31/311 ,  H01L23/544 ,  H01L2223/54433 ,  H01L2924/0002 ,  Y10T29/49121 ,  H01L2924/00

    Abstract: Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

    Abstract translation: 公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。 半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。 多个接收天线在三维空间中观察多个方向的结果。 无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。 无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。

    Creating a system on the fly and applications thereof
    4.
    发明授权
    Creating a system on the fly and applications thereof 有权
    快速创建系统及其应用

    公开(公告)号：US09459921B2

    公开(公告)日：2016-10-04

    申请号：US14615866

    申请日：2015-02-06

    Applicant: Broadcom Corporation

    Inventor： Ahmadreza (Reza) Rofougaran ,  Arya Reza Behzad ,  Michael Boers ,  Jesus Alfonso Castaneda ,  Sam Ziqun Zhao

    IPC: H04W4/00 ,  G06F9/50 ,  H04B7/10 ,  H04B5/00 ,  H04W84/18 ,  H04B7/26

    CPC classification number: G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

    Abstract: Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.

    Abstract translation: 这里公开了用于创建无线组件（WEC）的系统的系统，设备和方法。 这样的系统包括服务器和多个无线使能分量（WEC）。 每个WEC包括功能资源（例如，处理资源和/或存储器资源），并且被配置用于与服务器和一个或多个其他WEC的无线通信。 第一WEC被配置为向服务器无线地上传第一WEC的功能资源的可用性。 第一WEC还被配置为从服务器无线地下载链接资源，用于与多个WEC中的一个或多个相关联。 多个WEC可以位于单个芯片上，在单个设备的多个芯片上，或者位于多个设备的多个芯片上。

    Wireless bus for intra-chip and inter-chip communication, including embodiments with adaptable links
    6.
    发明授权
    Wireless bus for intra-chip and inter-chip communication, including embodiments with adaptable links 有权
    用于芯片内和芯片间通信的无线总线，包括具有适应性链路的实施例

    公开(公告)号：US09361158B2

    公开(公告)日：2016-06-07

    申请号：US14621777

    申请日：2015-02-13

    Applicant: Broadcom Corporation

    Inventor： Ahmadreza (Reza) Rofougaran ,  Arya Reza Behzad ,  Sam Ziqum Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

    IPC: H04W4/00 ,  G06F9/50 ,  H04B7/10 ,  H04B5/00 ,  H04W84/18

    CPC classification number: G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

    Abstract: Embodiments of the present invention are directed to a scalable wireless bus for intra-chip and inter-chip communication. The scalable wireless bus includes a plurality of wireless-enabled components (WECs). In an embodiment, the scalable wireless bus may have at least one of the number of links among WECs and the capacity of said links adapted based on one or more factors. For example, the number of links and the capacity of the links may be adapted according to one or more of, among other factors, expected activity level over the wireless bus, desired power consumption, delay, and interference levels.

    Abstract translation: 本发明的实施例涉及用于片内和芯片间通信的可扩展无线总线。 可扩展无线总线包括多个无线使能组件（WEC）。 在一个实施例中，可扩展无线总线可以具有基于一个或多个因素的WEC之间的链路数量和所述链路的容量中的至少一个链路。 例如，链路的数量和链路的容量可以根据无线总线上的预期活动级别，期望的功率消耗，延迟和干扰级别中的一个或多个来调整。

    PASSIVE PROBING OF VARIOUS LOCATIONS IN A WIRELESS ENABLED INTEGRATED CIRCUIT (IC)
    9.
    发明申请
    PASSIVE PROBING OF VARIOUS LOCATIONS IN A WIRELESS ENABLED INTEGRATED CIRCUIT (IC) 审中-公开
    无线使能集成电路（IC）中各种位置的被动探测

    公开(公告)号：US20150276856A1

    公开(公告)日：2015-10-01

    申请号：US14735994

    申请日：2015-06-10

    Applicant: Broadcom Corporation

    Inventor： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Michael Boers

    IPC: G01R31/28 ,  G01R31/303 ,  G01R31/302

    CPC classification number: G01R31/2834 ,  G01R31/2822 ,  G01R31/2831 ,  G01R31/3025 ,  G01R31/303 ,  H01L2224/16225 ,  H01L2924/15311

    Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

    Abstract translation: 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。

    Creating a System on the Fly and Applications Thereof
    10.
    发明申请
    Creating a System on the Fly and Applications Thereof 有权
    创建一个系统及其应用程序

    公开(公告)号：US20150223275A1

    公开(公告)日：2015-08-06

    申请号：US14615866

    申请日：2015-02-06

    Applicant: Broadcom Corporation

    Inventor： Ahmadreza (Reza) ROFOUGARAN ,  Arya Reza Behzad ,  Michael Boers ,  Jesus Alfonso Castaneda ,  Sam Ziqun Zhao

    IPC: H04W76/02 ,  H04B7/26

    CPC classification number: G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

    Abstract: Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.

    Abstract translation: 这里公开了用于创建无线组件（WEC）的系统的系统，设备和方法。 这样的系统包括服务器和多个无线使能分量（WEC）。 每个WEC包括功能资源（例如，处理资源和/或存储器资源），并且被配置用于与服务器和一个或多个其他WEC的无线通信。 第一WEC被配置为向服务器无线地上传第一WEC的功能资源的可用性。 第一WEC还被配置为从服务器无线地下载链接资源，用于与多个WEC中的一个或多个相关联。 多个WEC可以位于单个芯片上，在单个设备的多个芯片上，或者位于多个设备的多个芯片上。

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