公开(公告)号：US10999930B2

公开(公告)日：2021-05-04

申请号：US16222913

申请日：2018-12-17

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Shobhana Punjabi ,  Kan Seto ,  Straty Argyrakis ,  Joel Richard Goergen ,  Paul Lachlan Mantiply ,  Richard Anthony O'Brien

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11

Abstract: In one embodiment, an apparatus generally comprises a power delivery board for integration with a printed circuit board, the power delivery board comprising a power plane for delivering power from a voltage regulator module to an application specific integrated circuit (ASIC) mounted on a first side of the printed circuit board. The power plane in the power delivery board interconnects with power vias in the power delivery board for vertical alignment with the ASIC through power vias in the printed circuit board to electrically couple the voltage regulator module and the ASIC when the power delivery board is mounted on a second side of the printed circuit board.

公开(公告)号：US10096582B2

公开(公告)日：2018-10-09

申请号：US15205702

申请日：2016-07-08

Applicant: Cisco Technology, Inc.

Inventor： Paul L. Mantiply ,  Straty Argyrakis

IPC: H05K7/10 ,  H01L25/18 ,  H02M3/158 ,  H01L23/498 ,  H05K1/11 ,  H05K1/18 ,  H01L25/16 ,  H01L23/538 ,  H05K1/02 ,  H01L23/367 ,  H01L25/00 ,  H05K3/34 ,  H01L23/00

Abstract: Presented herein is a method and apparatus for enhanced power distribution to application specific integrated circuits (ASICs). The apparatus includes a substrate, an ASIC, and a voltage regulator module. The substrate includes a first side, a second side, and a vertical interconnect access (via) extending between the first side and the second side. The ASIC is mounted on the first side of the substrate in alignment with the via. The voltage regulator module is mounted on the second side of the substrate in alignment with the via so that the voltage regulator module is electrically coupled to the ASIC through the via.

公开(公告)号：US20180012879A1

公开(公告)日：2018-01-11

申请号：US15205702

申请日：2016-07-08

Applicant: Cisco Technology, Inc.

Inventor： Paul L. Mantiply ,  Straty Argyrakis

IPC: H01L25/18 ,  H05K1/18 ,  H01L23/538 ,  H05K3/34 ,  H01L25/00 ,  H01L23/367 ,  H02M3/158 ,  H05K1/02 ,  H05K1/11 ,  H01L23/498 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L25/18 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/17 ,  H01L25/16 ,  H01L25/50 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1306 ,  H01L2924/1426 ,  H01L2924/1427 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19102 ,  H02M3/158 ,  H05K1/0204 ,  H05K1/0262 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10734

Abstract: Presented herein is a method and apparatus for enhanced power distribution to application specific integrated circuits (ASICs). The apparatus includes a substrate, an ASIC, and a voltage regulator module. The substrate includes a first side, a second side, and a vertical interconnect access (via) extending between the first side and the second side. The ASIC is mounted on the first side of the substrate in alignment with the via. The voltage regulator module is mounted on the second side of the substrate in alignment with the via so that the voltage regulator module is electrically coupled to the ASIC through the via.

公开(公告)号：US20210219426A1

公开(公告)日：2021-07-15

申请号：US17220033

申请日：2021-04-01

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Shobhana Punjabi ,  Kan Seto ,  Straty Argyrakis ,  Joel Richard Goergen ,  Paul Lachlan Mantiply ,  Richard Anthony O'Brien

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11

Abstract: In one embodiment, an apparatus generally comprises a printed circuit board comprising a first side, a second side, and a plurality of power vias extending from the first side to the second side, the first side configured for receiving an application specific integrated circuit (ASIC), and a power delivery board mounted on the second side of the printed circuit board and comprising a power plane interconnected with power vias in the power delivery board to electrically couple voltage regulator modules and the ASIC. The voltage regulator modules are mounted on the second side of the printed circuit board.

公开(公告)号：US11564317B2

公开(公告)日：2023-01-24

申请号：US17220033

申请日：2021-04-01

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Shobhana Punjabi ,  Kan Seto ,  Straty Argyrakis ,  Joel Richard Goergen ,  Paul Lachlan Mantiply ,  Richard Anthony O'Brien

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11

Abstract: In one embodiment, an apparatus generally comprises a printed circuit board comprising a first side, a second side, and a plurality of power vias extending from the first side to the second side, the first side configured for receiving an application specific integrated circuit (ASIC), and a power delivery board mounted on the second side of the printed circuit board and comprising a power plane interconnected with power vias in the power delivery board to electrically couple voltage regulator modules and the ASIC. The voltage regulator modules are mounted on the second side of the printed circuit board.