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    ADHESIVE AGENT
    1.
    发明申请
    ADHESIVE AGENT 审中-公开
    胶粘剂

    公开(公告)号：US20160264822A1

    公开(公告)日：2016-09-15

    申请号：US15028147

    申请日：2014-10-06

    Applicant: DAICEL CORPORATION

    Inventor： Yousuke ITO ,  Hiroki TANAKA ,  Kiyoharu TSUTSUMI

    IPC: C09J5/06 ,  C09J125/08 ,  C09J133/06 ,  C09J4/00 ,  C09J125/18

    Abstract: Provided are: an adhesive that offers high adhesiveness to bond and secure an adherend even in a high-temperature environment, as long as securing is necessary. The adherend can be removed without failure and without adhesive residue once securing becomes unnecessary; and a method for processing an adherend using the adhesive. The adhesive according to the present invention contains a multivalent vinyl ether compound (A) and at least one of a compound (B) and a compound (C). The compound (B) is represented by Formula (b). The compound (C) includes two or more constitutional units each represented by Formula (c). Formulae (b) and (c) are expressed as follows:

    ADHESIVE
    3.
    发明申请
    ADHESIVE 审中-公开

    公开(公告)号：US20190119534A1

    公开(公告)日：2019-04-25

    申请号：US15766250

    申请日：2016-10-04

    Applicant: DAICEL CORPORATION

    Inventor： Hiroyoshi KODUMA ,  Hiroki TANAKA

    IPC: C09J11/06 ,  C09J11/08 ,  C09J201/06 ,  C08J5/18 ,  C08L29/10

    Abstract: Provided is an adhesive as follows. The adhesive can bond/secure an adherend to a support with maintaining high adhesiveness during the existence of the need for securing of the adherend to the support, even in a high-temperature environment or in an environment with abrupt temperature change. The adhesive enables debonding of the adherend from the support without breakage of the adherend when the securing becomes unnecessary. The adhesive can be easily removed when remained on the adherend after debonding. The adhesive according to the present invention contains (A) a multivalent vinyl ether compound, (B) a compound including two or more of a constitutional unit represented by Formula (b), and (C) a thermoplastic resin. In the formula, X is selected from hydroxy and carboxy.

    CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING ADHESIVE SHEET, AND DEVICE
    5.
    发明申请
    CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING ADHESIVE SHEET, AND DEVICE 审中-公开

    公开(公告)号：US20180171193A1

    公开(公告)日：2018-06-21

    申请号：US15737229

    申请日：2016-06-13

    Applicant: DAICEL CORPORATION

    Inventor： Hiroki TANAKA ,  Naoko TSUJI ,  Akira YAMAKAWA

    IPC: C09J183/12 ,  C09J183/04 ,  C08L83/04 ,  B32B27/28 ,  C08L83/12

    CPC classification number: C09J183/12 ,  B32B27/283 ,  C08G77/045 ,  C08K5/17 ,  C08K5/34 ,  C08L83/04 ,  C08L83/06 ,  C08L83/12 ,  C09J183/04 ,  C09J183/06 ,  C08K5/5435

    Abstract: Provided is a curable composition that can, when cured, form a cured product having adhesiveness and adhesion to an adherend at excellent levels. The curable composition contains a polyorganosilsesquioxane and one of (A) a compound represented by Formula (X); and (B) a polymerization stabilizer, where Formula (X) is expressed as follows: wherein r1 represents an integer from 4 to 20; L represents a group containing epoxy, oxetanyl or vinyl ether group; R11 and R12 each represent an optionally substituted hydrocarbon group; s1 represents an integer from 1 to 3; t1 represents an integer from 0 to 2, where s1 plus t1 equals 3; and R13 and R14 are selected from hydrogen and an optionally substituted hydrocarbon group. The polyorganosilsesquioxane has a number-average molecular weight of 1000 to 3000 and a molecular-weight dispersity of 1.0 to 3.0, includes a constitutional unit represented by Formula (1), has a ratio of a constitutional unit represented by Formula (I) to a constitutional unit represented by Formula (II) of 5 or more, and has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55 to 100 mole percent of all siloxane constitutional units. [R1SiO3/2] (1), [RaSiO3/2] (I), [RbSiO2/2(ORc)] (II), [R1SiO2/2(ORc)] (4), where R1 represents an epoxy-containing group; Ra and Rb are each selected from an epoxy-containing group, substituted or unsubstituted aryl, substituted or unsubstituted aralkyl, substituted or unsubstituted cycloalkyl, substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, and hydrogen; and Rc is selected from hydrogen and C1-C4 alkyl.

    ADHESIVE AGENT COMPOSITION FOR MULTILAYER SEMICONDUCTOR
    6.
    发明申请
    ADHESIVE AGENT COMPOSITION FOR MULTILAYER SEMICONDUCTOR 审中-公开
    多层半导体的粘合剂组合物

    公开(公告)号：US20160215183A1

    公开(公告)日：2016-07-28

    申请号：US15025143

    申请日：2014-09-25

    Applicant: DAICEL CORPORATION

    Inventor： Hiroki TANAKA ,  Katsuhiro NAKAGUCHI ,  Kiyoharu TSUTSUMI ,  Yousuke ITO ,  Naoko TSUJI

    IPC: C09J163/00 ,  C09J7/02 ,  H01L23/00

    CPC classification number: C09J163/00 ,  C08G59/68 ,  C09J7/35 ,  C09J2203/326 ,  C09J2463/00 ,  H01L23/293 ,  H01L24/83 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L2224/83855 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Provided is an adhesive composition for multilayer semiconductors. The adhesive composition gives, when applied and dried by heating, an adhesive layer that has approximately no adhesiveness at a temperature lower than 50° C., but, when heated at such a temperature as to less cause damage to semiconductor chips, offers adhesiveness and is rapidly cured thereafter. This adhesive composition for multilayer semiconductors includes a polymerizable compound (A), at least one of a cationic-polymerization initiator (B1) and an anionic-polymerization initiator (B2), and a solvent (C). The polymerizable compound (A) contains 80% by weight or more of an epoxide having a softening point or melting point of 50° C. or higher. The cationic-polymerization initiator (B1) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C., where the composition contains 1 part by weight of the cationic-polymerization initiator (B1) and 100 parts by weight of 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate. The anionic-polymerization initiator (B2) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C., where the composition contains 1 part by weight of the anionic-polymerization initiator (B2) and 100 parts by weight of bisphenol-A diglycidyl ether.

    Abstract translation: 提供了一种用于多层半导体的粘合剂组合物。 粘合剂组合物通过加热施加和干燥时，在低于50℃的温度下具有大致无粘合性的粘合剂层，但是当在较低温度下加热以致对半导体芯片造成损害时，提供粘合性和 此后迅速治愈。 该多层半导体用粘合剂组合物包含聚合性化合物（A），阳离子聚合引发剂（B1）和阴离子聚合引发剂（B2）中的至少一种和溶剂（C）。 可聚合化合物（A）含有80重量％以上的软化点或熔点为50℃以上的环氧化物。 阳离子聚合引发剂（B1）在130℃下得到热固化时间为3.5分钟以上的组合物，其中组合物含有1重量份的阳离子聚合引发剂（B1）和100重量份的 3,4-环氧环己基甲基（3,4-环氧）环己烷羧酸酯。 阴离子聚合引发剂（B2）在130℃下得到热固化时间为3.5分钟以上的组合物，其中组合物含有1重量份的阴离子聚合引发剂（B2）和100重量份的 双酚A二缩水甘油醚。

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