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    SEMICONDUCTOR DEVICE
    1.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20220278030A1

    公开(公告)日：2022-09-01

    申请号：US17747629

    申请日：2022-05-18

    Applicant: DENSO CORPORATION

    Inventor： Syunsuke ARAI ,  Masayoshi NISHIHATA ,  Shinji HIRAMITSU ,  Noriyuki KAKIMOTO

    IPC: H01L23/495 ,  H01L23/00 ,  H01L25/07

    Abstract: A semiconductor device has a joint part in which a first conducting part and a second conducting part are joined by a joint material. The first conducting part has a high wettability region and a low wettability region in a surface opposite to the second conducting part. The low wettability region is adjacent to the high wettability region to define an outer periphery of the high wettability region and has wettability lower than the high wettability region to the joint material. The high wettability region has an overlap region overlapping a formation region of the joint part in the second conducting part in a planar view, and a non-overlap region connected to the overlap region and not overlapping the formation region of the joint part in the second conducting part. The non-overlap region includes a holding region capable of holding the joint material that is surplus for the joint part.

    SEMICONDUCTOR DEVICE
    4.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20190333843A1

    公开(公告)日：2019-10-31

    申请号：US16505812

    申请日：2019-07-09

    Applicant: DENSO CORPORATION

    Inventor： Shinji HIRAMITSU

    IPC: H01L23/495 ,  H02M7/48 ,  H01L23/31 ,  H01L23/433

    Abstract: In a semiconductor device, a first semiconductor chip and a second semiconductor chip are aligned in a direction orthogonal to a plate thickness direction of the first semiconductor chip. A pair of first heat sinks is disposed on opposite sides of the first semiconductor chip in the first direction, and a pair of second heat sinks disposed on opposite sides of the second semiconductor chip in the first direction. The semiconductor chips and the heat sinks are sealed in a resin molded body. A plurality of main terminals are aligned in the second direction and project from a same side surface of a resin molded body. The main terminals includes a positive electrode terminal, a negative electrode terminal, an output terminal, and an auxiliary terminal. The first relay members are disposed in the resin molded body, and electrically connecting the main terminals and the corresponding heat sinks.

    SEMICONDUCTOR DEVICE
    6.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20190088568A1

    公开(公告)日：2019-03-21

    申请号：US16088093

    申请日：2017-04-27

    Applicant: DENSO CORPORATION

    Inventor： Hiroshi ISHINO ,  Hideki KAWAHARA ,  Shinji HIRAMITSU ,  Shunsuke ARAI

    IPC: H01L23/36 ,  H01L25/07 ,  H02M7/48 ,  H01L23/00

    Abstract: In a semiconductor device, a plurality of semiconductor chips included in an upper-arm circuit are connected in parallel between a pair of upper-arm plates, while a plurality of semiconductor chips included in a lower-arm circuit are connected in parallel between a pair of lower-arm plates. In each of the arm circuits, the plurality of semiconductor chips are arranged in a direction perpendicular to a direction in which emitter electrodes and pads are arranged, the pads are disposed on the same side of the emitter electrodes, and signal terminals extend in the same direction. A series-connecting part between the upper- and lower-arm circuits includes a joint part 20 continued to respective side surfaces of the corresponding upper- and lower-arm plates. Each of inductances of respective parallel-connecting parts of the upper- and lower-arm plates which connect the semiconductor chips in parallel is smaller than an inductance of the series-connecting part.

    POWER CONVERTER
    8.
    发明申请
    POWER CONVERTER 有权
    电源转换器

    公开(公告)号：US20160255714A1

    公开(公告)日：2016-09-01

    申请号：US15045329

    申请日：2016-02-17

    Applicant: DENSO CORPORATION

    Inventor： Shinji HIRAMITSU

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H02M7/00

    CPC classification number: H02M7/003 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2924/181 ,  H05K1/0209 ,  H05K1/0215 ,  H05K3/284 ,  H05K2201/066 ,  H05K2201/10053 ,  H05K2201/10166 ,  H01L2924/00012

    Abstract: A power converter includes: a circuit board having an insulating substrate and a plurality of wirings in the insulating substrate; and first and second switching elements on a first surface of the circuit board that are connected in series. The first switching element has first and second electrodes. The second switching element has a third electrode and a fourth electrode. The circuit board has a first wiring connected to the first electrode, a second wiring connected to the second and third electrodes, a third wiring connected to the fourth electrode, a fourth wiring as an output wiring connected to the third electrode, and a fifth wiring connected to the third wiring. The first, second, third and fourth wirings are arranged in order on the first surface, and the fifth wiring on a second surface opposite to the first surface is opposed to the first, second, and third wirings.

    Abstract translation: 电力转换器包括：电路板，其具有绝缘基板和绝缘基板中的多个布线; 以及串联连接在电路板的第一表面上的第一和第二开关元件。 第一开关元件具有第一和第二电极。 第二开关元件具有第三电极和第四电极。 电路板具有连接到第一电极的第一布线，连接到第二和第三电极的第二布线，连接到第四电极的第三布线，连接到第三电极的输出布线的第四布线和第五布线 连接到第三个接线。 第一，第二，第三和第四布线依次布置在第一表面上，与第一表面相对的第二表面上的第五布线与第一布线，第二布线和第三布线相对。

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