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    Semiconductor module, socket for the same, and semiconductor module/socket assembly
    2.
    发明授权
    Semiconductor module, socket for the same, and semiconductor module/socket assembly 有权
    半导体模块，插座相同，以及半导体模块/插座组件

    公开(公告)号：US08385080B2

    公开(公告)日：2013-02-26

    申请号：US13006692

    申请日：2011-01-14

    申请人： Jung-Hoon Kim ,  Seong-Chan Han ,  Dong-Chun Lee ,  Jae-Hoon Choi ,  Sun-Kyu Hwang

    发明人： Jung-Hoon Kim ,  Seong-Chan Han ,  Dong-Chun Lee ,  Jae-Hoon Choi ,  Sun-Kyu Hwang

    IPC分类号： H05K7/00

    CPC分类号： H05K7/00

    摘要： A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.

    摘要翻译： 公开了半导体模块，用于其的插座和半导体模块/插座组件。 半导体模块包括具有多个半导体器件，多个绝缘层和多个金属层的印刷电路板，多个绝缘层和多个金属层交替堆叠。 金属层的露出部分在印刷电路板的第一和第二端处暴露于半导体模块的外部。 第一端和第二端位于印刷电路板的相对端。

    Printed circuit board of semiconductor package and method for mounting semiconductor package using the same
    4.
    发明授权
    Printed circuit board of semiconductor package and method for mounting semiconductor package using the same 失效
    半导体封装的印刷电路板和使用其的半导体封装的安装方法

    公开(公告)号：US07576437B2

    公开(公告)日：2009-08-18

    申请号：US11598755

    申请日：2006-11-14

    申请人： Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

    发明人： Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

    IPC分类号： H01L23/48 ,  H01L23/495

    CPC分类号： H05K3/3421 ,  H05K3/243 ,  H05K3/282 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10689 ,  H05K2203/046 ,  Y02P70/613

    摘要： Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

    摘要翻译： 示例性实施例可以涉及具有绝缘基板，设置在绝缘基板的表面上的焊盘，阻焊剂和焊料移动部分的印刷电路板。 半导体封装的引线可以安装在绝缘基板上。 连接半导体封装的引线的焊盘可以设置在绝缘基板的表面上。 阻焊层可以覆盖绝缘基板，但也可以包含露出半导体封装的引线连接到的焊盘的至少一部分的开口。 在每个半导体引线连接到焊盘的过程中，焊盘上的焊料移动部分可以允许将半导体封装的每个引线的每个引线的焊料焊接涂覆到半导体封装引线的肩部。

    Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof
    5.
    发明授权
    Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof 有权
    配有耦合装置的散热器，附有散热器的存储模块及其制造方法

    公开(公告)号：US06449156B1

    公开(公告)日：2002-09-10

    申请号：US09952303

    申请日：2001-09-12

    申请人： Seong-Chan Han ,  Dong-Woo Shin ,  Dong-Chun Lee ,  Wang-Jae Lee

    发明人： Seong-Chan Han ,  Dong-Woo Shin ,  Dong-Chun Lee ,  Wang-Jae Lee

    IPC分类号： H05K720

    CPC分类号： G11C5/04

    摘要： A novel heat sink structure for being mounted to a module board to which semiconductor chips are attached and for dissipating or spreading heat generated from the semiconductor chips is disclosed. The heat sink comprises a heat sink base, and a coupling means for coupling the heat sink base to the module board. The coupling means passes through the heat sink base. The coupling means includes integrally formed upper and lower body portions, an orifice formed at least through the lower body portion, and a flanged base formed integral with the lower body portion. The flanged base fixes the coupling means to the heat sink base. The outer dimension of the upper body portion is smaller than the inner dimension of the lower body portion. As a result, many heat sinks can be stacked stably.

    摘要翻译： 公开了一种新颖的散热器结构，用于安装到模块板，半导体芯片被附着到模块板上，并用于散发或扩散从半导体芯片产生的热量。 散热器包括散热器基座和用于将散热器基座耦合到模块板的耦合装置。 联接装置通过散热器底座。 联接装置包括一体形成的上主体部分和至少穿过下主体部分的孔口，以及与下主体部分一体形成的凸缘基部。 带凸缘的底座将联接装置固定在散热器底座上。 上身部的外部尺寸小于下主体部的内部尺寸。 结果，许多散热器可以稳定堆叠。

    Printed circuit board of semiconductor package and method for mounting semiconductor package using the same
    7.
    发明申请
    Printed circuit board of semiconductor package and method for mounting semiconductor package using the same 失效
    半导体封装的印刷电路板和使用其的半导体封装的安装方法

    公开(公告)号：US20070109758A1

    公开(公告)日：2007-05-17

    申请号：US11598755

    申请日：2006-11-14

    申请人： Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

    发明人： Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

    IPC分类号： H05K7/00

    CPC分类号： H05K3/3421 ,  H05K3/243 ,  H05K3/282 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10689 ,  H05K2203/046 ,  Y02P70/613

    摘要： Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

    摘要翻译： 示例性实施例可以涉及具有绝缘基板，设置在绝缘基板的表面上的焊盘，阻焊剂和焊料移动部分的印刷电路板。 半导体封装的引线可以安装在绝缘基板上。 连接半导体封装的引线的焊盘可以设置在绝缘基板的表面上。 阻焊层可以覆盖绝缘基板，但也可以包含露出半导体封装的引线连接到的焊盘的至少一部分的开口。 在每个半导体引线连接到焊盘的过程中，焊盘上的焊料移动部分可以允许将半导体封装的每个引线的每个引线的焊锡涂层移动到半导体封装引线的肩部。

    Method of testing a substrate and apparatus for performing the same
    10.
    发明申请
    Method of testing a substrate and apparatus for performing the same 审中-公开
    测试基板的方法及其执行装置

    公开(公告)号：US20070072467A1

    公开(公告)日：2007-03-29

    申请号：US11525971

    申请日：2006-09-25

    申请人： Young-Soo Lee ,  Dong-Chun Lee ,  Seong-Chan Han ,  Hyo-Jae Bang

    发明人： Young-Soo Lee ,  Dong-Chun Lee ,  Seong-Chan Han ,  Hyo-Jae Bang

    IPC分类号： H01R29/00

    CPC分类号： G01R31/046

    摘要： A method of testing a substrate may involve photographing a first chip on a first face of the substrate to obtain a first image of the first chip, and photographing a second chip on a second face of the substrate opposite to the first face without reversing the substrate to obtain a second image of the second chip. The normality of the first and the second chips may be determined based on the first and the second images.

    摘要翻译： 测试衬底的方法可以涉及拍摄衬底的第一面上的第一芯片以获得第一芯片的第一图像，并且在与第一面相对的基板的第二面上拍摄第二芯片而不使基板反转 以获得第二芯片的第二图像。 可以基于第一和第二图像来确定第一和第二码片的正常性。