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    Method of testing a substrate and apparatus for performing the same
    3.
    发明申请
    Method of testing a substrate and apparatus for performing the same 审中-公开
    测试基板的方法及其执行装置

    公开(公告)号：US20070072467A1

    公开(公告)日：2007-03-29

    申请号：US11525971

    申请日：2006-09-25

    申请人： Young-Soo Lee ,  Dong-Chun Lee ,  Seong-Chan Han ,  Hyo-Jae Bang

    发明人： Young-Soo Lee ,  Dong-Chun Lee ,  Seong-Chan Han ,  Hyo-Jae Bang

    IPC分类号： H01R29/00

    CPC分类号： G01R31/046

    摘要： A method of testing a substrate may involve photographing a first chip on a first face of the substrate to obtain a first image of the first chip, and photographing a second chip on a second face of the substrate opposite to the first face without reversing the substrate to obtain a second image of the second chip. The normality of the first and the second chips may be determined based on the first and the second images.

    摘要翻译： 测试衬底的方法可以涉及拍摄衬底的第一面上的第一芯片以获得第一芯片的第一图像，并且在与第一面相对的基板的第二面上拍摄第二芯片而不使基板反转 以获得第二芯片的第二图像。 可以基于第一和第二图像来确定第一和第二码片的正常性。

    Semiconductor device and method of manufacturing the same
    4.
    发明申请
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号：US20080111235A1

    公开(公告)日：2008-05-15

    申请号：US11978370

    申请日：2007-10-29

    申请人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

    发明人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

    IPC分类号： H01L23/488 ,  H01L21/60

    CPC分类号： H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613

    摘要： A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

    摘要翻译： 半导体器件包括半导体封装，电路板和间隔保持元件。 半导体封装具有从主体突出的主体和引线。 电路板具有与引线电连接的第一焊盘。 间隔保持构件插入在电路板和主体之间。 间隔保持构件保持引线与第一焊盘之间的间隔。 因此，均匀地保持引线和焊盘之间的间隔，从而提高了半导体器件的热和/或机械可靠性。

    Semiconductor module, socket for the same, and semiconductor module/socket assembly
    7.
    发明授权
    Semiconductor module, socket for the same, and semiconductor module/socket assembly 有权
    半导体模块，插座相同，以及半导体模块/插座组件

    公开(公告)号：US08385080B2

    公开(公告)日：2013-02-26

    申请号：US13006692

    申请日：2011-01-14

    申请人： Jung-Hoon Kim ,  Seong-Chan Han ,  Dong-Chun Lee ,  Jae-Hoon Choi ,  Sun-Kyu Hwang

    发明人： Jung-Hoon Kim ,  Seong-Chan Han ,  Dong-Chun Lee ,  Jae-Hoon Choi ,  Sun-Kyu Hwang

    IPC分类号： H05K7/00

    CPC分类号： H05K7/00

    摘要： A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.

    摘要翻译： 公开了半导体模块，用于其的插座和半导体模块/插座组件。 半导体模块包括具有多个半导体器件，多个绝缘层和多个金属层的印刷电路板，多个绝缘层和多个金属层交替堆叠。 金属层的露出部分在印刷电路板的第一和第二端处暴露于半导体模块的外部。 第一端和第二端位于印刷电路板的相对端。

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号：US20100105201A1

    公开(公告)日：2010-04-29

    申请号：US12650093

    申请日：2009-12-30

    申请人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

    发明人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

    IPC分类号： H01L21/60

    CPC分类号： H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613

    摘要： A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

    摘要翻译： 半导体器件包括半导体封装，电路板和间隔保持元件。 半导体封装具有从主体突出的主体和引线。 电路板具有与引线电连接的第一焊盘。 间隔保持构件插入在电路板和主体之间。 间隔保持构件保持引线与第一焊盘之间的间隔。 因此，均匀地保持引线和焊盘之间的间隔，从而提高了半导体器件的热和/或机械可靠性。

    Semiconductor device and method of manufacturing the same
    9.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号：US07663219B2

    公开(公告)日：2010-02-16

    申请号：US11978370

    申请日：2007-10-29

    申请人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

    发明人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

    IPC分类号： H01L23/48

    CPC分类号： H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613

    摘要： A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

    摘要翻译： 半导体器件包括半导体封装，电路板和间隔保持元件。 半导体封装具有从主体突出的主体和引线。 电路板具有与引线电连接的第一焊盘。 间隔保持构件插入在电路板和主体之间。 间隔保持构件保持引线与第一焊盘之间的间隔。 因此，均匀地保持引线和焊盘之间的间隔，从而提高了半导体器件的热和/或机械可靠性。

    Printed circuit board of semiconductor package and method for mounting semiconductor package using the same
    10.
    发明授权
    Printed circuit board of semiconductor package and method for mounting semiconductor package using the same 失效
    半导体封装的印刷电路板和使用其的半导体封装的安装方法

    公开(公告)号：US07576437B2

    公开(公告)日：2009-08-18

    申请号：US11598755

    申请日：2006-11-14

    申请人： Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

    发明人： Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

    IPC分类号： H01L23/48 ,  H01L23/495

    CPC分类号： H05K3/3421 ,  H05K3/243 ,  H05K3/282 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10689 ,  H05K2203/046 ,  Y02P70/613

    摘要： Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

    摘要翻译： 示例性实施例可以涉及具有绝缘基板，设置在绝缘基板的表面上的焊盘，阻焊剂和焊料移动部分的印刷电路板。 半导体封装的引线可以安装在绝缘基板上。 连接半导体封装的引线的焊盘可以设置在绝缘基板的表面上。 阻焊层可以覆盖绝缘基板，但也可以包含露出半导体封装的引线连接到的焊盘的至少一部分的开口。 在每个半导体引线连接到焊盘的过程中，焊盘上的焊料移动部分可以允许将半导体封装的每个引线的每个引线的焊料焊接涂覆到半导体封装引线的肩部。