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公开(公告)号：US20150348800A1
公开(公告)日：2015-12-03
申请号：US14610410
申请日：2015-01-30
Inventor： Kyoung Ik CHO , Jae Bon KOO , Chan Woo PARK , Bock Soon NA , Sang Seok LEE , Sang Chul LIM , Soon-Won JUNG , Hye Yong CHU
IPC: H01L21/311 , H01L29/66 , H01L29/786
CPC classification number: H01L29/78603 , H01L21/3105 , H01L21/31058 , H01L21/31144 , H01L27/1218 , H01L27/1266 , H01L29/66742
Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.
Abstract translation: 本发明提供一种电子器件的制造方法，该方法包括：制备包括元件区域和布线区域的载体衬底; 在载体基板上形成牺牲层; 在元件区域的牺牲层上形成电子元件; 在布线区域的第一弹性层上形成具有波纹状表面的第一弹性层; 在布线区域的第一弹性层上形成电连接电子元件的金属配线; 在所述第一弹性层上形成覆盖所述金属布线的第二弹性层; 在所述电子元件上方的所述第二弹性层的凹部中形成高刚性图案，以与所述电子元件重叠，并具有波纹状表面; 在第二弹性层上形成第三弹性层和高刚性图案; 并分离载体衬底。
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公开(公告)号：US20150147854A1
公开(公告)日：2015-05-28
申请号：US14259042
申请日：2014-04-22
Inventor： Soon-Won JUNG , Jae Bon KOO , Chan Woo PARK , Bock Soon NA , Sang Chul LIM , Sang Seok LEE , Kyoung Ik CHO , Hye Yong CHU
IPC: H01L21/311 , H01L29/66
CPC classification number: H01L21/311 , G09F9/301 , H01L29/66477 , H01L51/0023 , H01L51/0055 , H01L51/0525 , H01L51/102 , H05K1/0283 , H05K1/0333 , H05K1/16 , H05K3/0017 , H05K3/007 , H05K2201/0133 , H05K2201/0162 , H05K2201/09036 , H05K2201/09045 , H05K2201/10166 , H05K2201/2009 , H05K2203/308
Abstract: Provided is a method of fabricating an electronic circuit. The method includes preparing a substrate, forming a polymer film on the substrate, patterning the polymer film to form a polymer pattern, and forming an electronic device on the polymer pattern.
Abstract translation: 提供一种制造电子电路的方法。 该方法包括制备基底，在基底上形成聚合物膜，图案化聚合物膜以形成聚合物图案，并在聚合物图案上形成电子器件。
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公开(公告)号：US20140299362A1
公开(公告)日：2014-10-09
申请号：US14244087
申请日：2014-04-03
Inventor： Chan Woo PARK , Jae Bon KOO , Soon-Won JUNG , Sang Chul LIM , Ji-Young OH , Bock Soon NA , Sang Seok LEE , Hye Yong CHU
CPC classification number: H05K1/0283 , H01L2224/04105 , H01L2224/96 , H01L2924/1815 , H05K1/189 , H05K3/284 , H05K2201/0162 , H05K2201/2009 , Y10T29/4913
Abstract: Provided are a stretchable electric circuit and a manufacturing method thereof The method for manufacturing the stretchable electric circuit includes forming a mold substrate, forming a stretchable substrate having a first flat surface and a first corrugated surface outside the first flat surface on the mold substrate, removing the mold substrate, forming a corrugated wire on the first corrugated surface, and forming an electric device connected to the corrugated wire on the first flat surface.
Abstract translation: 本发明提供一种伸缩性电路及其制造方法本发明的拉伸电路的制造方法包括：形成模具基板，在模具基板的第一平面的外侧形成具有第一平坦面和第一波纹状表面的伸缩性基板， 所述模具基板在所述第一波纹状表面上形成波纹状线，以及在所述第一平坦表面上形成连接到所述波纹状电线的电气装置。
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公开(公告)号：US20160266459A1
公开(公告)日：2016-09-15
申请号：US15007912
申请日：2016-01-27
Inventor： Ji-Young OH , Jae Bon KOO , Joo Yeon KIM , Bock Soon NA , Chan Woo PARK , Sang Seok LEE , Soon-Won JUNG , Hye Yong CHU
CPC classification number: G02F1/155 , G02F1/15 , G02F1/153 , G02F1/157 , G02F2001/1552 , G02F2001/1555 , G02F2201/44 , G09G3/38
Abstract: Provided is a complex display device Including a first substrate and an opposed second substrate, a first electrode, an electrochromic layer, a common electrode, an emission part and a second electrode, laminated between the first substrate and the second substrate one by one, and an organic layer disposed between the first electrode and the electrochromic layer, or between the electrochromic layer and the common electrode. The organic layer of the complex display device may include at least one of a hole injection material, a hole transport material and a mixture thereof, or at least one of an electron injection material, an electron transport material or a mixture thereof.
Abstract translation: 提供了一种复合显示装置，包括第一基板和相对的第二基板，第一电极，电致变色层，公共电极，发射部分和第二电极，一个接一个地层叠在第一基板和第二基板之间，以及 设置在第一电极和电致变色层之间或在电致变色层和公共电极之间的有机层。 复合显示装置的有机层可以包括空穴注入材料，空穴传输材料及其混合物中的至少一种，或电子注入材料，电子传输材料或其混合物中的至少一种。
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5.发明申请METHOD OF MANUFACTURING FLEXIBLE SUBSTRATE ALLOWING ELECTRONIC DEVICE TO BE MOUNTED THERETO 审中-公开制造易于安装的电子器件的柔性基板的制造方法公开(公告)号：US20150159266A1
公开(公告)日：2015-06-11
申请号：US14282980
申请日：2014-05-20
Inventor： Sang Chul LIM , Jae Bon KOO , Chan Woo PARK , Soon-Won JUNG , Bock Soon NA , Sang Seok LEE , Kyoung Ik CHO , Hye Yong CHU
CPC classification number: C23C16/042 , C23C14/20 , C23C14/22 , C23C16/06 , C23C16/44
Abstract: Provided is a method of manufacturing a flexible substrate allowing an electronic device to be mounted thereto. The method of manufacturing a flexible substrate allowing an electronic device to be mountable thereto, includes preparing a substrate, applying a force to the substrate to stretch the substrate in horizontal direction, performing a surface treatment process on the substrate and forming a first region having a plurality of wavy surfaces, and forming an electrode on the first region.
Abstract translation: 提供一种制造允许电子装置安装在其上的柔性基板的方法。 制造允许电子装置可以安装的柔性基板的方法包括：准备基板，向基板施加力以在水平方向上拉伸基板，在基板上进行表面处理处理，并形成具有 多个波状表面，并且在第一区域上形成电极。
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Patent Agency Ranking
公开(公告)号：US20180012861A1
公开(公告)日：2018-01-11
申请号：US15631678
申请日：2017-06-23
Inventor： Ji-Young OH , Joo Yeon KIM , Jae Bon KOO , Bock Soon NA , Nae-Man PARK , Chan Woo PARK , Sang Seok LEE , Soon Won JUNG , Chi-Sun HWANG , Keunsoo LEE
IPC: H01L23/00
CPC classification number: H01L24/83 , H01L51/0097 , H01L51/0545 , H01L2224/8349 , H01L2924/078 , Y02E10/549
Abstract: Provided is a method of manufacturing an electronic apparatus which includes preparing a substrate having a first Young's modulus, disposing a thin film having a second Young's modulus greater than the first Young's modulus on the substrate, disposing an electronic device on the thin film, and disposing a capping layer configured to cover the electronic device on the thin film.
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公开(公告)号：US20170169918A1
公开(公告)日：2017-06-15
申请号：US15220866
申请日：2016-07-27
Inventor： Chan Woo PARK , Jae Bon KOO , Bock Soon NA , Rae-Man PARK , Ji-Young OH , Sang Seok LEE , Soon-Won JUNG
IPC: H01B7/06 , H01B13/008
CPC classification number: H01B7/06 , H01B13/008 , H05K1/0283 , H05K3/007 , H05K3/107 , H05K3/20 , H05K2201/0329 , H05K2201/0338 , H05K2201/035 , H05K2203/016 , H05K2203/0568 , H05K2203/128
Abstract: Provided is a stretchable wire including: a stretchable solid-phase conductive structure; a stretchable insulation layer which surrounds the solid-phase conductive structure; and a liquid-phase conductive material layer disposed between the solid-phase conductive structure and the stretchable insulation layer, and in contact with the solid-phase conductive structure, and a method of fabricating the same.
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公开(公告)号：US20160234930A1
公开(公告)日：2016-08-11
申请号：US14869424
申请日：2015-09-29
Inventor： Chan Woo PARK , Jae Bon KOO , Bock Soon NA , Ji-Young OH , Sang Seok LEE , Soon-Won JUNG
CPC classification number: H05K1/0283
Abstract: Provided is a stretchable transparent electrode including a first substrate having an uneven surface, a first conductive film conformally covering the uneven surface of the first substrate to have an uneven top surface, a second conductive film conformally covering the first conductive film to have an uneven top surface, and a second substrate covering the second conductive film, wherein one of the first and second conductive films is a metal film and the other is a graphene film.
Abstract translation: 本发明提供一种具有不平坦表面的第一基板的可拉伸透明电极，保形地覆盖第一基板的不平坦表面以具有不平坦的顶表面的第一导电膜，保形地覆盖第一导电膜以具有不平坦顶部的第二导电膜 表面和覆盖第二导电膜的第二基板，其中第一和第二导电膜之一是金属膜，另一个是石墨烯膜。
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公开(公告)号：US20150173186A1
公开(公告)日：2015-06-18
申请号：US14280205
申请日：2014-05-16
Inventor： Bock Soon NA , Soon-Won JUNG , Jae Bon KOO , Chan Woo PARK , Sang Chul LIM , Sang Seok LEE , Kyoung Ik CHO , Hye Yong CHU
CPC classification number: H05K1/0283 , H05K2201/017 , H05K2201/10106 , H05K2201/10128 , H05K2201/10151 , Y10T29/49156 , Y10T29/49158 , Y10T29/49162
Abstract: Provided is a stretchable devices. The stretchable device includes a first stretchable substrate having a first wavy surface that wrinkles in a first direction; first wiring lines extending along the first wavy surface in the first direction; a second stretchable substrate having a second wavy surface that faces the first wavy surface and wrinkles in a second direction intersecting the first direction, wherein the second stretchable substrate is disposed on the first stretchable substrate; second wiring lines extending along the second wavy surface in the second direction; and interlayer insulating layers disposed on the intersections of the first wiring lines and the second wiring lines and disposed between the first wiring lines and the second wiring lines.
Abstract translation: 提供了一种可拉伸的装置。 该可拉伸装置包括：具有在第一方向上折皱的第一波状表面的第一可拉伸基底; 第一布线沿着第一方向沿第一波浪形表面延伸; 第二可拉伸基板，具有面向第一波状面的第二波状表面，并且沿与第一方向交叉的第二方向起皱纹，其中第二可拉伸基板设置在第一可拉伸基板上; 第二布线沿第二波形表面沿第二方向延伸; 以及层间绝缘层，其设置在第一布线和第二布线的交点上，并布置在第一布线和第二布线之间。
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公开(公告)号：US20180277684A1
公开(公告)日：2018-09-27
申请号：US15994097
申请日：2018-05-31
Inventor： Kyoung Ik CHO , Jae Bon KOO , Chan Woo PARK , Bock Soon NA , Sang Seok LEE , Sang Chul LIM , Soon-Won JUNG , Hye Yong CHU
IPC: H01L29/786 , H01L27/12 , H01L21/311 , H01L21/3105 , H01L29/66
CPC classification number: H01L29/78603 , H01L21/3105 , H01L21/31058 , H01L21/31144 , H01L27/1218 , H01L27/1266 , H01L29/66742
Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.
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