利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

62 条记录 (耗时 0.041 秒)

    METHOD TO REORDER (SHUFFLE) OPTICAL CABLE WAVEGUIDE LAYERS
    6.
    发明申请
    METHOD TO REORDER (SHUFFLE) OPTICAL CABLE WAVEGUIDE LAYERS 有权
    方法（SHUFFLE）光电缆波导层

    公开(公告)号：US20130044979A1

    公开(公告)日：2013-02-21

    申请号：US13277767

    申请日：2011-10-20

    申请人： Russell A. Budd ,  Frank R. Libsch

    发明人： Russell A. Budd ,  Frank R. Libsch

    IPC分类号： G02B6/38 ,  G02B6/26

    CPC分类号： G02B6/38 ,  G02B6/3817 ,  G02B6/4293 ,  G02B6/43

    摘要： An optical cable including connectors includes a plurality of waveguide layers each including a plurality of optical channels each having a first end and a second end. First and second connectors each include a plurality of electrically conductive pins, and each of the plurality of optical channels of each of the waveguides, at their first and second ends, are connected to a specified pin on each of the first and second connectors, respectively. A first optical channel connection pattern on the first connector, and a second optical channel connection pattern on the second connector. The first optical channel connection pattern on the first connector is a different pattern than the second optical channel connection pattern on the second connector in relation to a connection hole pattern which is the same for both the first and second connectors.

    摘要翻译： 包括连接器的光缆包括多个波导层，每个波导层包括多个光通道，每个光通道具有第一端和第二端。 第一和第二连接器各自包括多个导电引脚，并且每个波导的多个光通道中的每一个在其第一和第二端分别连接到第一和第二连接器中的每一个上的指定引脚 。 第一连接器上的第一光通道连接图案和第二连接器上的第二光通道连接图案。 第一连接器上的第一光通道连接图案是与第二连接器上的第二光通道连接图案相对于第一和第二连接器两者相同的连接孔图案不同的图案。

    Fill head for full-field solder coverage with a rotatable member
    8.
    发明授权
    Fill head for full-field solder coverage with a rotatable member 有权
    用可旋转构件填充头用于全场焊接覆盖

    公开(公告)号：US07980445B2

    公开(公告)日：2011-07-19

    申请号：US12018421

    申请日：2008-01-23

    申请人： Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

    发明人： Russell A. Budd ,  John P. Karidis ,  Mark D. Schultz

    IPC分类号： B23K1/00 ,  B23K37/06 ,  B23K37/00 ,  B23K35/12

    CPC分类号： H05K3/3457 ,  B23K1/0016 ,  B23K3/0638 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

    摘要： A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

    摘要翻译： 提供一种系统，装置和方法，以将导电接合材料沉积在模具中的空腔中。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。