摘要:
A Coriolis mass flowmeter which measures mass flow rate of a fluid flowing in a measuring pipe fixed to a housing, utilizing Coriolis'force generated in proportion to mass flow rate of the fluid, wherein the measuring pipe includes: a fixation portion to be fixed to the housing; a portion near the fixation portion; and a vibration canceling element attached to the housing and associated with the fixation portion, and for dynamically canceling vibration of the fixation portion of the measuring pipe, or the portion near the fixation portion of the measuring pipe. The measuring pipe may be straight, and a reinforcing member may be provided to cancel vibration of the fixation portion of the measuring pipe.
摘要:
A mass flow meter provides improved accuracy in measuring the mass flow rate of a fluid flowing through a straight measuring tube. The as measured mass flow rate value is changed by parameters such as the Young's modules, second moment of area, length, axial force, etc. of the measuring tube. The parameters change with the strain caused in the axial direction of the measuring tube. A strain sensor is installed on a measuring tube, and the as measured mass flow rate is corrected based on the output of the strain sensor. Since the strain affects in a different way the substantial mass flow rate and the zero point offset, the correction is conducted separately on the substantial mass flow rate and on the zero point offset so that the accuracy of measurement may be improved. Since the parameters change also with the temperature of the measuring tube, a temperature sensor is also installed on the measuring tube so that the accuracy of measurement may be further improved.
摘要:
The precision of phase difference obtained by a phase difference calculating unit is improved by correction through outputs of a frequency ratio calculating unit and a temperature calculating unit considering that the phase or time difference of each output signal of a vibration sensor indicating the mass flow or density of a fluid is a function of the temperature and axial force on a measurement pipe, or that the axial force is a function of the ratio between two resonant frequencies.
摘要:
In various aspects, a semiconductor light emitting device may include a mold resin having a cup shape portion on an upper surface of the mold resin; a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, the first lead having a first lead section and a second lead section, the second lead section of the first lead being thicker than the first lead section of the first lead, the second lead section of the first lead having a hole; a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, having a first lead section and a second lead section, the second lead section of the second lead being thicker than the first lead section of the second lead; a light emitting element mounted on the second section of the first lead in the cup shape portion; a wire electrically connecting the light emitting element and the second lead; and a sealing resin configured to seal the light emitting element and the wire.
摘要:
According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.
摘要:
According to one embodiment, an LED package includes a first and a second lead frame, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and has one terminal connected to the first lead frame and another terminal connected to the second lead frame. The wire connects the one terminal to the first lead frame. The resin body covers the first and second lead frames, the LED chip, and the wire. The first lead frame includes a base portion and a plurality of extending portions. As viewed from above, a bonding position of the wire is located inside one of polygonal regions connecting between roots of the two or more of the extending portions. An appearance of the resin body is a part of an appearance of the LED package.
摘要:
An illuminating apparatus has a transparent or semitransparent optical medium in the form of an acrylic plate, two fluorescent tubes for emitting light into the acrylic plate through opposite end surfaces thereof, and a reflecting plate disposed under a lower surface of the acrylic plate for upwardly reflecting the light. The lower surface of the acrylic plate defines a diffusing plane including a plurality of irregular reflector regions distributed thereon. The irregular reflector regions comprise ship-shape patterns arranged in juxtaposition longitudinally of the fluorescent tubes. The diffusing plane further includes modified irregular reflector regions formed where the irregular reflector regions are absent. The modified irregular reflector regions irregularly reflect a less quantity of light than the irregular reflector regions.
摘要:
In order to enable a natural and clear image to appear in both light reflection and light transmission usage modes of a light-reflection/light-transmission image sheet having front and back-side images (3, 4) overlying each other with a sheet-like base material (2) that is reflective and transmissive interposed therebetween, the density distribution of the back-side image (4) of the light-reflection/light-transmission image sheet is obtained by reducing a high-density portion (N1) that exceeds a set density α in the density distribution of the front-side image (3), to the set density α or a density close in value thereto.
摘要:
A light emitting device includes: a light emitting element; a first lead including a recess in one end portion, the recess including a first bottom surface with the light emitting element bonded thereto, at least one of a through hole and a notch, and a light shielding portion capable of suppressing leakage of emitted light from the light emitting element from the one of the through hole and the notch; a second lead opposed to the first lead; and a molded body filling the one of the through hole and the notch, covering the light emitting element, embedding at least part of the first lead and at least part of the second lead, and made of a translucent resin.
摘要:
A semiconductor light emitting device includes: a body having a recess, a step being provided on a side wall of the recess; a semiconductor light emitting element mounted in the recess; and a resin layer. The resin layer covers at least a portion of an inner surface of the recess of the body. The resin layer has a higher reflectivity than the inner surface of the recess of the body.