公开(公告)号：US5323658A

公开(公告)日：1994-06-28

申请号：US77606

申请日：1993-06-17

申请人： Hironobu Yao ,  Iwao Matsumoto ,  Masami Kishiro

发明人： Hironobu Yao ,  Iwao Matsumoto ,  Masami Kishiro

IPC分类号： G01F1/84

CPC分类号： G01F1/8413 ,  G01F1/8472 ,  G01F1/849

摘要： A Coriolis mass flowmeter which measures mass flow rate of a fluid flowing in a measuring pipe fixed to a housing, utilizing Coriolis'force generated in proportion to mass flow rate of the fluid, wherein the measuring pipe includes: a fixation portion to be fixed to the housing; a portion near the fixation portion; and a vibration canceling element attached to the housing and associated with the fixation portion, and for dynamically canceling vibration of the fixation portion of the measuring pipe, or the portion near the fixation portion of the measuring pipe. The measuring pipe may be straight, and a reinforcing member may be provided to cancel vibration of the fixation portion of the measuring pipe.

摘要翻译： 一种科里奥利质量流量计，其测量在固定到壳体上的测量管中流动的流体的质量流量，利用与流体的质量流量成比例地产生的科里奥利力，其中测量管包括：固定部分， 房屋; 靠近固定部分的部分; 以及安装在壳体上并与固定部分相关联并且用于动态地消除测量管的固定部分或测量管的固定部分附近的部分的振动的振动消除元件。 测量管可以是直的，并且可以设置加强件以消除测量管的固定部分的振动。

公开(公告)号：US5773727A

公开(公告)日：1998-06-30

申请号：US544367

申请日：1995-10-17

申请人： Masami Kishiro ,  Keita Ohkawa ,  Hironobu Yao ,  Iwao Matsumoto

发明人： Masami Kishiro ,  Keita Ohkawa ,  Hironobu Yao ,  Iwao Matsumoto

IPC分类号： G01F1/84 ,  G01F1/78

CPC分类号： G01F1/8409 ,  G01F1/8413 ,  G01F1/8422 ,  G01F1/8427 ,  G01F1/8472 ,  G01F1/849

摘要： A mass flow meter provides improved accuracy in measuring the mass flow rate of a fluid flowing through a straight measuring tube. The as measured mass flow rate value is changed by parameters such as the Young's modules, second moment of area, length, axial force, etc. of the measuring tube. The parameters change with the strain caused in the axial direction of the measuring tube. A strain sensor is installed on a measuring tube, and the as measured mass flow rate is corrected based on the output of the strain sensor. Since the strain affects in a different way the substantial mass flow rate and the zero point offset, the correction is conducted separately on the substantial mass flow rate and on the zero point offset so that the accuracy of measurement may be improved. Since the parameters change also with the temperature of the measuring tube, a temperature sensor is also installed on the measuring tube so that the accuracy of measurement may be further improved.

摘要翻译： 质量流量计提供了测量流过直的测量管的流体的质量流量的改进的精度。 通过诸如杨氏模块，测量管的面积的二次力矩，长度，轴向力等参数来改变测量的质量流量值。 参数随测量管轴向引起的应变而变化。 应变传感器安装在测量管上，并根据应变传感器的输出校正测量的质量流量。 由于应变以不同的方式影响实质的质量流量和零点偏移，所以基于实质的质量流量和零点偏移分别进行校正，从而可以提高测量精度。 由于参数随着测量管的温度而变化，所以在测量管上也安装有温度传感器，从而可以进一步提高测量精度。

公开(公告)号：US5728952A

公开(公告)日：1998-03-17

申请号：US525466

申请日：1995-09-08

申请人： Hironobu Yao ,  Hiroyuki Yoshimura ,  Masato Takahashi ,  Michihiko Tsuruoka ,  Iwao Matsumoto ,  Masakazu Kawakami ,  Keita Okawa

发明人： Hironobu Yao ,  Hiroyuki Yoshimura ,  Masato Takahashi ,  Michihiko Tsuruoka ,  Iwao Matsumoto ,  Masakazu Kawakami ,  Keita Okawa

IPC分类号： G01F1/84 ,  G01N9/00

CPC分类号： G01F1/8418 ,  G01F1/8427 ,  G01F1/8431 ,  G01F1/8436 ,  G01F1/849 ,  G01N9/002

摘要： The precision of phase difference obtained by a phase difference calculating unit is improved by correction through outputs of a frequency ratio calculating unit and a temperature calculating unit considering that the phase or time difference of each output signal of a vibration sensor indicating the mass flow or density of a fluid is a function of the temperature and axial force on a measurement pipe, or that the axial force is a function of the ratio between two resonant frequencies.

摘要翻译： 考虑到表示质量流量或密度的振动传感器的每个输出信号的相位或时间差，通过频率比计算单元和温度计算单元的输出进行校正来提高通过相位差计算单元获得的相位差的精度 流体是测量管上的温度和轴向力的函数，或轴向力是两个谐振频率之间的比值的函数。

公开(公告)号：US20060220048A1

公开(公告)日：2006-10-05

申请号：US11390240

申请日：2006-03-28

申请人： Iwao Matsumoto ,  Tatsuo Tonedachi

发明人： Iwao Matsumoto ,  Tatsuo Tonedachi

IPC分类号： H01L33/00

CPC分类号： H01L33/647 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： In various aspects, a semiconductor light emitting device may include a mold resin having a cup shape portion on an upper surface of the mold resin; a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, the first lead having a first lead section and a second lead section, the second lead section of the first lead being thicker than the first lead section of the first lead, the second lead section of the first lead having a hole; a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, having a first lead section and a second lead section, the second lead section of the second lead being thicker than the first lead section of the second lead; a light emitting element mounted on the second section of the first lead in the cup shape portion; a wire electrically connecting the light emitting element and the second lead; and a sealing resin configured to seal the light emitting element and the wire.

公开(公告)号：US20110186875A1

公开(公告)日：2011-08-04

申请号：US12886124

申请日：2010-09-20

申请人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

发明人： Hidenori Egoshi ,  Kazuhiro Tamura ,  Hiroaki Oshio ,  Satoshi Shimizu ,  Teruo Takeuchi ,  Kazuhiro Inoue ,  Iwao Matsumoto

IPC分类号： H01L33/48

CPC分类号： H01L33/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.

摘要翻译： 根据一个实施例，LED封装包括（2×n）（n为2以上的整数）引线框，n个LED芯片和树脂体。 （2×n）个引线框架彼此分开布置。 n个LED芯片设置在引线框架的上方。 n个LED芯片中的每一个具有连接到（2×n）个引线框架的n个引线框架中的每一个的一个端子，以及连接到除了n个引线框架之外的（2×n）个引线框架的每个引线框架的另一个端子。 树脂体覆盖（2×n）引线框和n个LED芯片。

公开(公告)号：US20110186868A1

公开(公告)日：2011-08-04

申请号：US12886911

申请日：2010-09-21

申请人： Gen Watari ,  Satoshi Shimizu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi ,  Iwao Matsumoto

发明人： Gen Watari ,  Satoshi Shimizu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi ,  Iwao Matsumoto

IPC分类号： H01L33/50 ,  H01L33/62

CPC分类号： H01L24/49 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/05599 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes a first and a second lead frame, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and has one terminal connected to the first lead frame and another terminal connected to the second lead frame. The wire connects the one terminal to the first lead frame. The resin body covers the first and second lead frames, the LED chip, and the wire. The first lead frame includes a base portion and a plurality of extending portions. As viewed from above, a bonding position of the wire is located inside one of polygonal regions connecting between roots of the two or more of the extending portions. An appearance of the resin body is a part of an appearance of the LED package.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框彼此分开。 LED芯片设置在第一和第二引线框架的上方，并且具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。 线将一个端子连接到第一引线框架。 树脂体覆盖第一和第二引线框架，LED芯片和导线。 第一引线框架包括基部和多个延伸部分。 从上方观察，线的接合位置位于连接两个或更多个延伸部分的根部的多边形区域之一内。 树脂体的外观是LED封装的外观的一部分。

公开(公告)号：US5649754A

公开(公告)日：1997-07-22

申请号：US372102

申请日：1995-01-13

申请人： Iwao Matsumoto

发明人： Iwao Matsumoto

IPC分类号： F21V8/00 ,  G02B6/00 ,  G09F13/18

CPC分类号： G02B6/0038 ,  G02B6/0036 ,  G02B6/005 ,  G02B6/0061 ,  G02B6/0065 ,  G09F2013/1813 ,  G09F2013/1831

摘要： An illuminating apparatus has a transparent or semitransparent optical medium in the form of an acrylic plate, two fluorescent tubes for emitting light into the acrylic plate through opposite end surfaces thereof, and a reflecting plate disposed under a lower surface of the acrylic plate for upwardly reflecting the light. The lower surface of the acrylic plate defines a diffusing plane including a plurality of irregular reflector regions distributed thereon. The irregular reflector regions comprise ship-shape patterns arranged in juxtaposition longitudinally of the fluorescent tubes. The diffusing plane further includes modified irregular reflector regions formed where the irregular reflector regions are absent. The modified irregular reflector regions irregularly reflect a less quantity of light than the irregular reflector regions.

摘要翻译： 照明装置具有丙烯酸板形式的透明或半透明光学介质，用于通过其相对端面将光发射到丙烯酸板中的两个荧光管和设置在丙烯酸板下表面下方的反射板，用于向上反射 光。 丙烯酸板的下表面限定了包括分布在其上的多个不规则反射器区域的漫射平面。 不规则反射器区域包括沿着荧光管的纵向并列布置的船形图案。 漫射平面还包括不规则反射器区域形成的改进的不规则反射区域。 改进的不规则反射区域不规则地反射比不规则反射器区域少的光量。

公开(公告)号：US20150125668A1

公开(公告)日：2015-05-07

申请号：US14349192

申请日：2012-05-02

申请人： Iwao Matsumoto

发明人： Iwao Matsumoto

IPC分类号： B44F1/06 ,  B44F1/02

CPC分类号： B44F1/06 ,  B44F1/02 ,  H04N1/4074 ,  Y10T428/24802

摘要： In order to enable a natural and clear image to appear in both light reflection and light transmission usage modes of a light-reflection/light-transmission image sheet having front and back-side images (3, 4) overlying each other with a sheet-like base material (2) that is reflective and transmissive interposed therebetween, the density distribution of the back-side image (4) of the light-reflection/light-transmission image sheet is obtained by reducing a high-density portion (N1) that exceeds a set density α in the density distribution of the front-side image (3), to the set density α or a density close in value thereto.

摘要翻译： 为了使自然而清晰的图像出现在光反射/透光图像片材的光反射和透光图像片材中，其具有彼此重叠的片材形状的前侧和后侧图像（3,4） 通过反射和透射的基板材料（2）插入其间，通过降低高反射透光图像片材的高密度部分（N1），获得光反射/透光图像片材的背面图像（4）的密度分布， 超过了正面图像（3）的密度分布中的设定密度α到设定密度α或其值接近的密度。

公开(公告)号：US20100171139A1

公开(公告)日：2010-07-08

申请号：US12652422

申请日：2010-01-05

申请人： Tetsuya Muranaka ,  Masaki Adachi ,  Iwao Matsumoto ,  Kenji Naito ,  Toshiaki Hosoya

发明人： Tetsuya Muranaka ,  Masaki Adachi ,  Iwao Matsumoto ,  Kenji Naito ,  Toshiaki Hosoya

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emitting device includes: a light emitting element; a first lead including a recess in one end portion, the recess including a first bottom surface with the light emitting element bonded thereto, at least one of a through hole and a notch, and a light shielding portion capable of suppressing leakage of emitted light from the light emitting element from the one of the through hole and the notch; a second lead opposed to the first lead; and a molded body filling the one of the through hole and the notch, covering the light emitting element, embedding at least part of the first lead and at least part of the second lead, and made of a translucent resin.

摘要翻译： 发光器件包括：发光元件; 第一引线，其包括在一个端部中的凹部，所述凹部包括与发光元件接合的第一底表面，通孔和凹口中的至少一个以及能够抑制发射光的泄漏的遮光部分 所述发光元件来自所述通孔和所述凹口中的一个; 第二个领先者反对第一个领先; 以及填充所述通孔和所述凹口中的一个的成型体，覆盖所述发光元件，包埋所述第一引线的至少一部分和所述第二引线的至少一部分，并且由半透明树脂制成。

公开(公告)号：US07531845B2

公开(公告)日：2009-05-12

申请号：US11765077

申请日：2007-06-19

申请人： Hiroaki Oshio ,  Iwao Matsumoto ,  Mitsuhiro Nawashiro

发明人： Hiroaki Oshio ,  Iwao Matsumoto ,  Mitsuhiro Nawashiro

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/46 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor light emitting device includes: a body having a recess, a step being provided on a side wall of the recess; a semiconductor light emitting element mounted in the recess; and a resin layer. The resin layer covers at least a portion of an inner surface of the recess of the body. The resin layer has a higher reflectivity than the inner surface of the recess of the body.

摘要翻译： 一种半导体发光器件，包括：具有凹部的主体，设置在所述凹部的侧壁上的台阶; 安装在所述凹部中的半导体发光元件; 和树脂层。 树脂层覆盖主体的凹部的内表面的至少一部分。 树脂层的反射率比身体的凹部的内表面高。