公开(公告)号：US20200294886A1

公开(公告)日：2020-09-17

申请号：US16355468

申请日：2019-03-15

Applicant: Intel Corporation

Inventor： Amitesh Saha ,  Shushan Gong ,  Shrenik Kothari

IPC: H01L23/42 ,  H01L23/00 ,  H01L21/48

Abstract: A thermal interface material may be formed comprising a polymer material and a self-healing constituent. The thermal interface material may be used in an integrated circuit assembly between at least one integrated and a heat dissipation device, wherein the self-healing constituent changes the physical properties of the thermal interface material in response to thermo-mechanical stresses to prevent failure modes from occurring during the operation of the integrated circuit assembly.

公开(公告)号：US11978689B2

公开(公告)日：2024-05-07

申请号：US18089537

申请日：2022-12-27

Applicant: Intel Corporation

Inventor： Shrenik Kothari ,  Chandra Mohan Jha ,  Weihua Tang ,  Robert Sankman ,  Xavier Brun ,  Pooya Tadayon

IPC: H01L23/42 ,  H01L23/367 ,  H01L23/373 ,  H01L23/522 ,  H01L23/00 ,  H01L23/495 ,  H01L23/538 ,  H01L25/07

CPC classification number: H01L23/42 ,  H01L23/367 ,  H01L23/3738 ,  H01L23/522 ,  H01L23/49575 ,  H01L23/5384 ,  H01L24/20 ,  H01L25/072

Abstract: Embodiments disclosed herein include semiconductor dies and methods of forming such dies. In an embodiment, the semiconductor die comprises a semiconductor substrate, an active device layer in the semiconductor substrate, where the active device layer comprises one or more transistors, an interconnect layer over a first surface of the active device layer, a first bonding layer over a surface of the semiconductor substrate, a second bonding layer secured to the first bonding layer, and a heat spreader attached to the second bonding layer.

公开(公告)号：US09515003B1

公开(公告)日：2016-12-06

申请号：US14962857

申请日：2015-12-08

Applicant: INTEL CORPORATION

Inventor： Thomas Fitzgerald ,  William Lambert ,  Shrenik Kothari ,  Punita Sullhan ,  Aravindha Antoniswamy

IPC: H01L23/367 ,  H01L49/02 ,  H01L23/498 ,  G06F1/20 ,  H01L23/522 ,  H01L23/34 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/345 ,  G06F1/20 ,  H01L23/04 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5227 ,  H01L24/13 ,  H01L24/16 ,  H01L24/18 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0652 ,  H01L25/0657 ,  H01L28/10 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/381 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Embedded air core inductors are described for integrated circuit package substrates. The substrates have a thermal conductor for the inductors. One example includes a package substrate to carry an integrated circuit die, the package substrate having a plurality of top side pads to connect to the die on a top side and a plurality of bottom side pads to connect to an external component on a bottom side. An inductor is embedded within the package substrate, A thermal conductor is embedded within the package substrate adjacent to the inductor to conduct heat away from the inductor, and a heat sink is thermally coupled to the thermal conductor to receive the heat from the conductor.

Abstract translation: 嵌入式空心电感器被描述用于集成电路封装衬底。 基板具有用于电感器的热导体。 一个示例包括用于承载集成电路管芯的封装衬底，封装衬底具有多个顶侧焊盘以连接到顶侧的管芯和多个底侧焊盘以连接到底侧上的外部部件。 电感器嵌入在封装衬底内。热导体与电感器相邻地嵌入在封装衬底内，以将热量从电感器传导出去，散热器与热导体热耦合以接收来自导体的热量。

公开(公告)号：US11551997B2

公开(公告)日：2023-01-10

申请号：US16355468

申请日：2019-03-15

Applicant: Intel Corporation

Inventor： Amitesh Saha ,  Shushan Gong ,  Shrenik Kothari

IPC: H01L23/42 ,  H01L21/48 ,  H01L23/00

Abstract: A thermal interface material may be formed comprising a polymer material and a self-healing constituent. The thermal interface material may be used in an integrated circuit assembly between at least one integrated and a heat dissipation device, wherein the self-healing constituent changes the physical properties of the thermal interface material in response to thermo-mechanical stresses to prevent failure modes from occurring during the operation of the integrated circuit assembly.

公开(公告)号：US20210375719A1

公开(公告)日：2021-12-02

申请号：US17399882

申请日：2021-08-11

Applicant: Intel Corporation

Inventor： Feras Eid ,  Shrenik Kothari ,  Chandra M. Jha ,  Johanna M. Swan ,  Michael J. Baker ,  Shawna M. Liff ,  Thomas L. Sounart ,  Betsegaw K. Gebrehiwot ,  Shankar Devasenathipathy ,  Taylor Gaines ,  Digvijay Ashokkumar Raorane

IPC: H01L23/433 ,  H01L23/29 ,  H01L21/56 ,  H01L25/00 ,  H01L25/18 ,  H01L23/42 ,  H01L23/367 ,  H01L23/04 ,  H01L25/065 ,  H01L25/16 ,  H01L23/16

Abstract: A semiconductor device that has a semiconductor die coupled to a substrate. A mold compound encapsulates the semiconductor die, and at least one thermal conductive material section extends from adjacent the semiconductor die through the mold compound. The at least one conductive material section thus conveys heat from the semiconductor die through the mold compound.

公开(公告)号：US11756860B2

公开(公告)日：2023-09-12

申请号：US16522443

申请日：2019-07-25

Applicant: Intel Corporation

Inventor： Shrenik Kothari ,  Chandra Mohan Jha ,  Weihua Tang ,  Robert Sankman ,  Xavier Brun ,  Pooya Tadayon

IPC: H01L23/42 ,  H01L23/522 ,  H01L23/373 ,  H01L23/367 ,  H01L25/07 ,  H01L23/538

CPC classification number: H01L23/42 ,  H01L23/367 ,  H01L23/3738 ,  H01L23/522 ,  H01L23/5384 ,  H01L25/072

Abstract: Embodiments disclosed herein include semiconductor dies and methods of forming such dies. In an embodiment, the semiconductor die comprises a semiconductor substrate, an active device layer in the semiconductor substrate, where the active device layer comprises one or more transistors, an interconnect layer over a first surface of the active device layer, a first bonding layer over a surface of the semiconductor substrate, a second bonding layer secured to the first bonding layer, and a heat spreader attached to the second bonding layer.

公开(公告)号：US11495518B2

公开(公告)日：2022-11-08

申请号：US16264419

申请日：2019-01-31

Applicant: Intel Corporation

Inventor： Shrenik Kothari ,  Sandeep Ahuja ,  Susan Smith ,  Jeffory Smalley ,  Francisco Gabriel Lozano Sanchez ,  Maria de la Luz Belmont Velazquez ,  Je-Young Chang ,  Jorge Contreras Perez ,  Phil Geng ,  Andres Ramirez Macias ,  Gilberto Rayas Paredes

IPC: H01L31/00 ,  H01L21/00 ,  H01L23/40 ,  H01L25/18 ,  H01L23/427

Abstract: An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

公开(公告)号：US20200251403A1

公开(公告)日：2020-08-06

申请号：US16264419

申请日：2019-01-31

Applicant: Intel Corporation

Inventor： Shrenik Kothari ,  Sandeep Ahuja ,  Susan Smith ,  Jeffory Smalley ,  Francisco Gabriel Lozano Sanchez ,  Maria de la Luz Belmont Velazquez ,  Je-Young Chang ,  Jorge Contreras Perez ,  Phil Geng ,  Andres Ramirez Macias ,  Gilberto Rayas Paredes

IPC: H01L23/40 ,  H01L23/427 ,  H01L25/18

Abstract: An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.

公开(公告)号：US20190027379A1

公开(公告)日：2019-01-24

申请号：US15767126

申请日：2015-11-16

Applicant: Intel Corporation

Inventor： Wei Hu ,  Aravindha R. Antoniswamy ,  Thomas J. Fitzgerald ,  Nikunj P. Patel ,  Syadwad Jain ,  Zhizhong Tang ,  Shrenik Kothari

IPC: H01L21/48 ,  H01L23/367 ,  H01L23/373 ,  H01L23/544 ,  H01L23/42

Abstract: Disclosed herein are embodiments of sintered heat spreaders with inserts and related devices and methods. In some embodiments, a heat spreader may include: a frame including aluminum and a polymer binder; an insert disposed in the frame, wherein the insert has a thermal conductivity higher than a thermal conductivity of the frame; and a recess having at least one sidewall formed by the frame. The polymer binder may be left over from sintering frame material and insert material to form the heat spreader.