-
公开(公告)号：US20230095914A1
公开(公告)日：2023-03-30
申请号：US17485211
申请日：2021-09-24
Applicant: Intel Corporation
Inventor： Gerald PASDAST , Sathya Narasimman TIAGARAJ , Adel A. ELSHERBINI , Tanay KARNIK , Robert MUNOZ , Kevin SAFFORD
IPC: G01R31/317 , G01R31/28
Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die module coupled to the package substrate. In an embodiment, the die module comprises a die and a chiplet coupled to the die. In an embodiment, the chiplet is coupled to the die with a hybrid bonding interconnect architecture.
-
公开(公告)号：US20200036095A1
公开(公告)日：2020-01-30
申请号：US16465980
申请日：2017-01-04
Applicant: Intel Corporation
Inventor： Adel A. ELSHERBINI , Shawna M. LIFF , William J. LAMBERT
Abstract: Embodiments are generally directed to a package architecture for antenna arrays. An embodiment of an apparatus includes an electronic package, the electronic package including one or more routing layers; a transmitter to drive a signal for wireless transmission; and an assembled phased array antenna to transmit the signal, the assembled phased array antenna including a plurality of separate antenna elements in an array, each antenna element of the array being individually attached to a first side of the electronic package. The antenna elements include a first antenna element and a second antenna element, wherein the first antenna element is separated from the second antenna element by a gap.
-
3.发明申请公开(公告)号：US20180310399A1
公开(公告)日：2018-10-25
申请号：US15771833
申请日：2015-12-21
Applicant: Intel Corporation
Inventor： Vijay K. NAIR , Sasha N. OSTER , Adel A. ELSHERBINI , Telesphor KAMGAING , Feras EID
CPC classification number: H05K1/0243 , H01P3/121 , H01P5/107 , H05K3/4697 , H05K2201/037 , H05K2201/09618
Abstract: Embodiments of the invention include a waveguide structure that includes a lower member, at least one sidewall member coupled to the lower member, and an upper member. The lower member, the at least one sidewall member, and the upper member include at least one conductive layer to form a cavity in a substrate for allowing communications between devices that are coupled or attached to the substrate.
-
4.发明申请公开(公告)号：US20180234128A1
公开(公告)日：2018-08-16
申请号：US15745980
申请日：2015-09-25
Applicant: Intel Corporation
Inventor： Adel A. ELSHERBINI , Telesphor KAMGAING , Sasha N. OSTER , Brandon M. RAWLINGS , Georgios C. DOGIAMIS
Abstract: Communication is described between integrated circuit packages using a millimeter-wave wireless radio fabric. In one example a first package has a radio transceiver to communicate with a radio transceiver of a second package. The second package has a radio transceiver to communicate with the radio transceiver of the first package. A switch communicates with the first package and the second package to establish a connection through the respective radio transceivers between the first package and the second package. A system board carries the first package, the second package, and the switch.
-
5.发明申请公开(公告)号：US20180217949A1
公开(公告)日：2018-08-02
申请号：US15746318
申请日：2015-09-25
Applicant: Intel Corporation
Inventor： Sasha N. OSTER , Telesphor KAMGAING , Adel A. ELSHERBINI , Georgios C. DOGIAMIS , Brandon M. RAWLINGS
Abstract: Microelectronic package communications are described that use radio interfaces that are connected through waveguides. One example includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, and a radio on the package substrate coupled to the radio chip to modulate the data over a carrier and to transmit the modulated data. A waveguide connector is coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide carries the modulated data to an external component.
-
Patent Agency Ranking
公开(公告)号：US20180097284A1
公开(公告)日：2018-04-05
申请号：US15283140
申请日：2016-09-30
Applicant: Intel Corporation
Inventor： Shawna M. LIFF , Adel A. ELSHERBINI , Sasha N. OSTER , Feras EID , Georgios C. DOGIAMIS , Thomas L. SOUNART , Johanna M. SWAN
IPC: H01Q1/52 , H01L41/09 , H01L41/047 , H01L41/187 , H01L41/04 , H01Q5/50 , H04L29/06
CPC classification number: H01Q1/526 , H01L41/047 , H01L41/094 , H01Q1/273 , H01Q15/0086 , H04L63/0245 , H04L63/1475 , H04L67/12 , H04L67/146 , H04W12/0052 , H04W12/12
Abstract: Embodiments of the invention include a reconfigurable communication system, that includes a substrate and a metamaterial shield formed over the substrate. In an embodiment, the metamaterial shield surrounds one or more components on the substrate. Additionally, a plurality of first piezoelectric actuators may be formed on the substrate. The first piezoelectric actuators may be configured to deform the metamaterial shield and change a frequency band that is permitted to pass through the metamaterial shield. Embodiments may also include a reconfigurable antenna that includes a metamaterial. In an embodiment, a plurality of second piezoelectric actuators may be configured to deform the metamaterial of the antenna and change a central operating frequency of the antenna. Embodiments may also include an integrated circuit electrically coupled to the plurality of first piezoelectric actuators and second piezoelectric actuators.
-
7.发明申请公开(公告)号：US20170288724A1
公开(公告)日：2017-10-05
申请号：US15088996
申请日：2016-04-01
Applicant: Intel Corporation
Inventor： Telesphor KAMGAING , Feras EID , Adel A. ELSHERBINI , Georgios C. DOGIAMIS , Vijay K. NAIR , Johanna M. SWAN , Valluri R. RAO
CPC classification number: H04B1/48 , H01H57/00 , H01H2057/006 , H03H7/38 , H03H2015/005
Abstract: Embodiments of the invention include a tunable radio frequency (RF) communication module that includes a transmitting component having at least one tunable component and a receiving component having at least one tunable component. The tunable RF communication module includes at least one piezoelectric switching device coupled to at least one of the transmitting and receiving components. The at least one piezoelectric switching device is formed within an organic substrate having organic material and is designed to tune at least one tunable component of the tunable RF communication module.
-
公开(公告)号：US20170287808A1
公开(公告)日：2017-10-05
申请号：US15625947
申请日：2017-06-16
Applicant: Intel Corporation
Inventor： Henning BRAUNISCH , Feras EID , Adel A. ELSHERBINI , Johanna M. SWAN , Don W. NELSON
IPC: H01L23/498 , H01L23/367 , H01L21/52 , H01L23/473
CPC classification number: H01L23/3675 , H01L21/52 , H01L23/36 , H01L23/367 , H01L23/3677 , H01L23/473 , H01L23/49811 , H01L23/49833 , H01L23/49838 , H01L23/50 , H01L23/5389 , H01L2924/0002 , H05K1/021 , H05K1/185 , H05K2201/066 , H05K2201/10416 , H05K2201/10545 , H01L2924/00
Abstract: An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate.
-
公开(公告)号：US20160211190A1
公开(公告)日：2016-07-21
申请号：US14914998
申请日：2013-09-27
Applicant: INTEL CORPORATION
Inventor： Henning BRAUNISCH , Feras EID , Adel A. ELSHERBINI , Johanna M. SWAN , Don W. NELSON
IPC: H01L23/367 , H01L21/52 , H01L23/498
CPC classification number: H01L23/3675 , H01L21/52 , H01L23/36 , H01L23/367 , H01L23/3677 , H01L23/473 , H01L23/49811 , H01L23/49833 , H01L23/49838 , H01L23/50 , H01L23/5389 , H01L2924/0002 , H05K1/021 , H05K1/185 , H05K2201/066 , H05K2201/10416 , H05K2201/10545 , H01L2924/00
Abstract: An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate.
Abstract translation: 一种包括模具的设备，所述模具的第一侧包括第一类型的系统级接触点和包括第二类型的接触点的第二侧; 以及耦合到管芯和管芯的第二侧的封装衬底。 一种包括管芯的设备，所述管芯的第一侧包括多个系统级逻辑接触点和包括第二多个系统级电力接触点的第二侧。 一种方法，包括将管芯的第一侧上的第一类型的系统级接触点中的一个与管芯的第二侧上的第二类型的系统级接触点耦合到封装衬底。
-
公开(公告)号：US20240355750A1
公开(公告)日：2024-10-24
申请号：US18758992
申请日：2024-06-28
Applicant: Intel Corporation
Inventor： Adel A. ELSHERBINI , Amr ELSHAZLY , Arun CHANDRASEKHAR , Shawna M. LIFF , Johanna M. SWAN
IPC: H01L23/538 , H01L23/00 , H01L25/00
CPC classification number: H01L23/5385 , H01L24/16 , H01L24/17 , H01L25/00 , H01L2224/16225 , H01L2224/1703
Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.
-
-
-
-
-
-
-
-
-
Search Results
70
records
(took 0.022 seconds)
