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公开(公告)号:US12230569B2
公开(公告)日:2025-02-18
申请号:US17177055
申请日:2021-02-16
Applicant: Intel Corporation
Inventor: Kushal Sreedhar , Christopher Mozak , Mahmoud Elassal
IPC: H01L23/528 , H01L23/522 , G11C5/14 , G11C11/16
Abstract: A scheme intelligently balances existing TM0 resources to simultaneously boost both AC and DC power delivery topologies without incurring a penalty on either area or IR drop. TM0 tracks are either regular or staples. Regular tracks are continuous across the width of an active silicon. Staples are located right under the respective TM1 (Top Metal 1) tracks. TM1 is above TM0 in the hierarchy of metal layers. The staples aid in increasing the total TV0 (Top Via 0 that connects TM0 to TM1) density for all supplies simultaneously as they are consecutively track-shared between the TM1 tracks. This boost in via density helps reduce the net series resistance of the MIM capacitor as the Manhattan (displacement) distance between the supply and ground vias is now reduced. The outcome is a high-density high-bandwidth MIM capacitor, located between the main power distribution layers in the die metal stack—TM0 and TM1.
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公开(公告)号:US11037607B2
公开(公告)日:2021-06-15
申请号:US16220523
申请日:2018-12-14
Applicant: Intel Corporation
Inventor: Raymond Chong , Bee Min Teng , Christopher Mozak
IPC: G01R19/00 , G11C7/00 , G11C7/06 , H03K3/037 , G11C7/10 , H04L7/00 , G11C11/16 , H04B1/16 , G11C7/08
Abstract: Described is an apparatus to widen or improve a common mode range of a strong arm latch (SAL). In some embodiments, the SAL comprises a master-slave architecture with a common latch. The apparatus includes: a sampler to sample an input with a first clock, and to provide a sampled output on a node. The SAL is to receive the sampled output on the node, and to sample the sampled output according to a second clock. The apparatus comprises a digital-to-analog converter (DAC) coupled to the node, wherein the DAC is to adjust a common mode of the sampled output according to a digital control to the DAC.
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公开(公告)号:US10672438B2
公开(公告)日:2020-06-02
申请号:US16147635
申请日:2018-09-29
Applicant: Intel Corporation
Inventor: Mohammed G. Mostofa , Roger K. Cheng , Aaron Martin , Christopher Mozak , Pavan Kumar Kappagantula , Hsien-Pao Yang
IPC: G11C7/10 , G06F1/3234 , G06F13/16
Abstract: An apparatus is provided which comprises: a first circuitry to sample a first input signal to generate a first sampled signal, and to sample a second input signal to generate a second sampled signal, wherein the first input signal comprises data; a second circuitry to receive the first sampled signal and the second sampled signal, and to generate a first pair of differential signals; an offset cancellation circuitry to cancel or reduce an offset in the first pair of differential signals; and a latch to receive the first pair of differential signals subsequent to the cancellation or reduction of the offset, and to output a second pair of differential signals, wherein the second pair of differential signals is indicative of the data.
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4.
公开(公告)号:US10573272B2
公开(公告)日:2020-02-25
申请号:US16022357
申请日:2018-06-28
Applicant: Intel Corporation
Inventor: Christopher Mozak , Senthil Kumar Sampath
Abstract: Techniques and mechanisms for determining a delay to be applied to a clock signal for synchronizing data communication. In an embodiment, a delay is applied to a first clock signal to generate a second clock signal, which is then communicated to a latch circuit via a clock signal distribution path. The delay is determined based on an evaluation of a first time needed for signal communication via a model of the clock signal distribution path. Such determining is further based on an evaluation of a second time for one cycle of a cyclical signal, where said cycle correspond to that of the first clock signal. In another embodiment, multiple different delays are applied each to a different respective clock signal, where each of said delays is based on both the evaluation of the first time and the evaluation of the second time.
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5.
公开(公告)号:US20180181504A1
公开(公告)日:2018-06-28
申请号:US15389462
申请日:2016-12-23
Applicant: Intel Corporation
Inventor: Tonia Morris , John Van Lovelace , Christopher Mozak , Bill Nale
IPC: G06F13/16 , G06F3/06 , G11C11/4076 , G11C11/4093
CPC classification number: G06F13/1689 , G06F12/0238 , G06F12/0868 , G06F13/1673 , G06F2212/7203 , G11C5/04 , G11C11/4076 , G11C11/4093
Abstract: The present disclosure relates to an apparatus for training one or more signal timing relations of a control interface between a registering clock driver and one or more data buffers of a memory module comprising a plurality of memory chips, the control interface comprising a clock signal and at least one control signal. The apparatus includes control circuitry which is configured to adjust a relative timing between the at least one control signal and the clock signal based on samples of the at least one control signal sampled based on the clock signal
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公开(公告)号:US20210167014A1
公开(公告)日:2021-06-03
申请号:US17177055
申请日:2021-02-16
Applicant: Intel Corporation
Inventor: Kushal Sreedhar , Christopher Mozak , Mahmoud Elassal
IPC: H01L23/528 , H01L23/522
Abstract: A scheme intelligently balances existing TM0 resources to simultaneously boost both AC and DC power delivery topologies without incurring a penalty on either area or IR drop. TM0 tracks are either regular or staples. Regular tracks are continuous across the width of an active silicon. Staples are located right under the respective TM1 (Top Metal 1) tracks. TM1 is above TM0 in the hierarchy of metal layers. The staples aid in increasing the total TV0 (Top Via 0 that connects TM0 to TM1) density for all supplies simultaneously as they are consecutively track-shared between the TM1 tracks. This boost in via density helps reduce the net series resistance of the MIM capacitor as the Manhattan (displacement) distance between the supply and ground vias is now reduced. The outcome is a high-density high-bandwidth MIM capacitor, located between the main power distribution layers in the die metal stack—TM0 and TM1.
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公开(公告)号:US10923164B2
公开(公告)日:2021-02-16
申请号:US16147634
申请日:2018-09-29
Applicant: Intel Corporation
Inventor: Hariprasath Venkatram , Mohammed G. Mostofa , Rajesh Inti , Roger K. Cheng , Aaron Martin , Christopher Mozak , Pavan Kumar Kappagantula , Hsien-Pao Yang , Mozhgan Mansuri , James Jaussi , Harishankar Sridharan
IPC: G11C7/10 , G06F1/3234 , G06F13/16
Abstract: An apparatus is provided which comprises: a first power supply rail to provide a first power supply; second and third power supply rails to provide second and third power supplies, respectively, wherein a voltage level of the first power supply is higher than a voltage level of each of the second and third power supplies; a first driver circuitry coupled to the first power supply rail and the second power supply rail; a second driver circuitry coupled to the third power supply rail, and coupled to the first driver circuitry; and a stack of transistors of N conductivity type coupled to the first power supply rail, and to the second driver circuitry.
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公开(公告)号:US20200105319A1
公开(公告)日:2020-04-02
申请号:US16147635
申请日:2018-09-29
Applicant: Intel Corporation
Inventor: Mohammed G. Mostofa , Roger K. Cheng , Aaron Martin , Christopher Mozak , Pavan Kumar Kappagantula , Hsien-Pao Yang
Abstract: An apparatus is provided which comprises: a first circuitry to sample a first input signal to generate a first sampled signal, and to sample a second input signal to generate a second sampled signal, wherein the first input signal comprises data; a second circuitry to receive the first sampled signal and the second sampled signal, and to generate a first pair of differential signals; an offset cancellation circuitry to cancel or reduce an offset in the first pair of differential signals; and a latch to receive the first pair of differential signals subsequent to the cancellation or reduction of the offset, and to output a second pair of differential signals, wherein the second pair of differential signals is indicative of the data.
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9.
公开(公告)号:US20200005729A1
公开(公告)日:2020-01-02
申请号:US16022357
申请日:2018-06-28
Applicant: Intel Corporation
Inventor: Christopher Mozak , Senthil Kumar Sampath
Abstract: Techniques and mechanisms for determining a delay to be applied to a clock signal for synchronizing data communication. In an embodiment, a delay is applied to a first clock signal to generate a second clock signal, which is then communicated to a latch circuit via a clock signal distribution path. The delay is determined based on an evaluation of a first time needed for signal communication via a model of the clock signal distribution path. Such determining is further based on an evaluation of a second time for one cycle of a cyclical signal, where said cycle correspond to that of the first clock signal. In another embodiment, multiple different delays are applied each to a different respective clock signal, where each of said delays is based on both the evaluation of the first time and the evaluation of the second time.
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公开(公告)号:US20170236566A1
公开(公告)日:2017-08-17
申请号:US15046384
申请日:2016-02-17
Applicant: Intel Corporation
Inventor: Pooja Nukala , Christopher Mozak , Kristina D. Morgan , Rebecca Loop
CPC classification number: G11C7/1072 , G06F13/1673 , G06F13/1689 , G06F13/4243 , G06F13/4291
Abstract: Memory devices, systems, and methods that maximize command and address (CA) signal group rate with minimized margin degradation across a channel and associated operating modes are disclosed and described. In one example, the operating mode can be 1 bit per 1.5 clock cycles.
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