公开(公告)号：US12262508B2

公开(公告)日：2025-03-25

申请号：US17127355

申请日：2020-12-18

Applicant: Intel Corporation

Inventor： Juha Paavola ,  Columbia Mishra ,  Justin Huttula ,  Mark Carbone

IPC: H05K7/20 ,  B23P15/26 ,  G06F1/20

Abstract: Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.

公开(公告)号：US20240231454A1

公开(公告)日：2024-07-11

申请号：US18422948

申请日：2024-01-25

Applicant: Intel Corporation

Inventor： Columbia Mishra ,  Carin Ruiz ,  Helin Cao ,  Soethiha Soe ,  James Hermerding, II ,  Bijendra Singh ,  Navneet Singh

IPC: G06F1/20 ,  G06F1/32 ,  G06F3/01 ,  G06V10/774 ,  G06V40/10 ,  G06V40/16 ,  G10L25/51 ,  H04B1/3827

CPC classification number: G06F1/206 ,  G06F1/32 ,  G06F3/013 ,  G06V10/774 ,  G06V40/10 ,  G06V40/165 ,  G10L25/51 ,  H04B1/3827 ,  G06F2200/201

Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example apparatus includes at least one of a user presence detection analyzer to identify a presence of a user relative to an electronic device based on first sensor data generated by a first sensor or at least one of an image data analyzer or a motion data analyzer to determine a gesture of the user relative to the device based on second sensor data generated by a second sensor; a thermal constraint selector to select a thermal constraint for a temperature of an exterior surface of the electronic device based on one or more of the presence of the user or the gesture; and a power source manager to adjust a power level for a processor of the electronic device based on the thermal constraint.

公开(公告)号：US20190254194A1

公开(公告)日：2019-08-15

申请号：US16370918

申请日：2019-03-30

Applicant: Intel Corporation

Inventor： Juha Tapani Paavola ,  Mikko Antero Makinen ,  Columbia Mishra ,  Mark Carbone

IPC: H05K7/20 ,  F28D15/02

CPC classification number: H05K7/20336 ,  F28D15/0208 ,  F28D2015/0216 ,  F28F2230/00

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a torsional heat pipe. The torsional heat pipe can include a first housing static portion located in a first housing of an electronic device, where the first housing static portion is coupled to a heat source, a second housing static portion located in a second housing of the electronic device, where the second housing static portion is coupled to a heat spreader, and a torsion portion located in a hinge of the electronic device, where the hinge rotatably couples the first housing to the second housing and the torsion portion rotates as the second housing rotates relative to the first housing and the torsion portion couples the first housing static portion to the second housing static portion.

公开(公告)号：US11966268B2

公开(公告)日：2024-04-23

申请号：US17732173

申请日：2022-04-28

Applicant: Intel Corporation

Inventor： Columbia Mishra ,  Carin Ruiz ,  Helin Cao ,  Soethiha Soe ,  James Hermerding, II ,  Bijendra Singh ,  Navneet Singh

IPC: G06F1/20 ,  G06F1/32 ,  G06F3/01 ,  G06V10/774 ,  G06V40/10 ,  G06V40/16 ,  G10L25/51 ,  H04B1/3827

CPC classification number: G06F1/206 ,  G06F1/32 ,  G06F3/013 ,  G06V10/774 ,  G06V40/10 ,  G06V40/165 ,  G10L25/51 ,  H04B1/3827 ,  G06F2200/201

Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example apparatus includes at least one of a user presence detection analyzer to identify a presence of a user relative to an electronic device based on first sensor data generated by a first sensor or at least one of an image data analyzer or a motion data analyzer to determine a gesture of the user relative to the device based on second sensor data generated by a second sensor; a thermal constraint selector to select a thermal constraint for a temperature of an exterior surface of the electronic device based on one or more of the presence of the user or the gesture; and a power source manager to adjust a power level for a processor of the electronic device based on the thermal constraint.

公开(公告)号：US20220350385A1

公开(公告)日：2022-11-03

申请号：US17732173

申请日：2022-04-28

Applicant: Intel Corporation

Inventor： Columbia Mishra ,  Carin Ruiz ,  Helin Cao ,  Soethiha Soe ,  James Hermerding, II ,  Bijendra Singh ,  Navneet Singh

IPC: G06F1/20 ,  H04B1/3827 ,  G10L25/51 ,  G06F3/01 ,  G06F1/32 ,  G06V40/10

Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example apparatus includes at least one of a user presence detection analyzer to identify a presence of a user relative to an electronic device based on first sensor data generated by a first sensor or at least one of an image data analyzer or a motion data analyzer to determine a gesture of the user relative to the device based on second sensor data generated by a second sensor; a thermal constraint selector to select a thermal constraint for a temperature of an exterior surface of the electronic device based on one or more of the presence of the user or the gesture; and a power source manager to adjust a power level for a processor of the electronic device based on the thermal constraint.

公开(公告)号：US20210136956A1

公开(公告)日：2021-05-06

申请号：US17127355

申请日：2020-12-18

Applicant: Intel Corporation

Inventor： Juha Paavola ,  Columbia Mishra ,  Justin Huttula ,  Mark Carbone

IPC: H05K7/20 ,  B23P15/26 ,  G06F1/20

Abstract: Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.

公开(公告)号：US12284793B2

公开(公告)日：2025-04-22

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu Bawa ,  Ruander Cardenas ,  Kathiravan D ,  Jia Yan Go ,  Chin Kung Goh ,  Jeff Ku ,  Prakash Kurma Raju ,  Baomin Liu ,  Twan Sing Loo ,  Mikko Makinen ,  Columbia Mishra ,  Juha Paavola ,  Prasanna Pichumani ,  Daniel Ragland ,  Kannan Raja ,  Khal Ern See ,  Javed Shaikh ,  Gokul Subramaniam ,  George Baoci Sun ,  Xiyong Tian ,  Hua Yang ,  Mark Carbone ,  Vivek Paranjape ,  Nehakausar Pinjari ,  Hari Shanker Thakur ,  Christopher Moore ,  Gustavo Fricke ,  Justin Huttula ,  Gavin Sung ,  Sammi Wy Liu ,  Arnab Sen ,  Chun-Ting Liu ,  Jason Y. Jiang ,  Gerry Juan ,  Shih Wei Nien ,  Lance Lin ,  Evan Kuklinski

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/34

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

公开(公告)号：US11972303B2

公开(公告)日：2024-04-30

申请号：US16914177

申请日：2020-06-26

Applicant: Intel Corporation

Inventor： Carin Ruiz ,  Bo Qiu ,  Columbia Mishra ,  Arijit Chattopadhyay ,  Chee Lim Nge ,  Srikanth Potluri ,  Jianfang Zhu ,  Deepak Samuel Kirubakaran ,  Akhilesh Rallabandi ,  Mark Gallina ,  Renji Thomas ,  James Hermerding, II

IPC: G06F9/50 ,  G06F9/48 ,  G06F11/30

CPC classification number: G06F9/5094 ,  G06F9/4881 ,  G06F9/505 ,  G06F11/3058 ,  G06F2209/508

Abstract: Methods, apparatus, and systems to dynamically schedule a workload to among compute blocks based on temperature are disclosed. An apparatus to schedule a workload to at least one of a plurality of compute blocks based on temperature includes a prediction engine to determine (i) a first predicted temperature of a first compute block of the plurality of compute blocks and (ii) a second predicted temperature of a second compute block of the plurality of compute blocks. The apparatus also includes a selector to select between the first compute block and the second compute block for assignment of the workload. The selection is based on which of the first and second predicted temperatures is lower. The apparatus further includes a workload scheduler to assign the workload to the selected one of the first or second compute blocks.

公开(公告)号：US10932393B2

公开(公告)日：2021-02-23

申请号：US16370918

申请日：2019-03-30

Applicant: Intel Corporation

Inventor： Juha Tapani Paavola ,  Mikko Antero Makinen ,  Columbia Mishra ,  Mark Carbone

IPC: H05K7/20 ,  F28D15/02 ,  G06F1/20

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a torsional heat pipe. The torsional heat pipe can include a first housing static portion located in a first housing of an electronic device, where the first housing static portion is coupled to a heat source, a second housing static portion located in a second housing of the electronic device, where the second housing static portion is coupled to a heat spreader, and a torsion portion located in a hinge of the electronic device, where the hinge rotatably couples the first housing to the second housing and the torsion portion rotates as the second housing rotates relative to the first housing and the torsion portion couples the first housing static portion to the second housing static portion.

公开(公告)号：US20250142778A1

公开(公告)日：2025-05-01

申请号：US19001914

申请日：2024-12-26

Applicant: Intel Corporation

Inventor： Juha Paavola ,  Columbia Mishra ,  Justin Huttula ,  Mark Carbone

IPC: H05K7/20 ,  B23P15/26 ,  G06F1/20

Abstract: Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.