公开(公告)号：US09943931B2

公开(公告)日：2018-04-17

申请号：US15221102

申请日：2016-07-27

申请人： Intel Corporation

发明人： Zhihua Li ,  Hemanth K. Dhavaleswarapu ,  Joseph B. Petrini ,  Shankar Devasenathipathy ,  Steven B. Roach ,  Ioan Sauciuc ,  Pranav K. Desai ,  George S. Kostiew ,  Sanjoy K. Saha

IPC分类号： B23K37/00 ,  B23K3/08 ,  H01L23/00 ,  H05K3/34 ,  B23K20/02 ,  F25B21/02

CPC分类号： B23K37/003 ,  B23K3/085 ,  B23K20/023 ,  F25B21/02 ,  F25B2321/0251 ,  H01L24/13 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/291 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75502 ,  H01L2224/81203 ,  H01L2224/83203 ,  H05K3/34 ,  H01L2924/014

摘要： Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.

公开(公告)号：US10297567B2

公开(公告)日：2019-05-21

申请号：US14974823

申请日：2015-12-18

申请人： Intel Corporation

发明人： Donglai David Lu ,  Jimin Yao ,  Amrita Mallik ,  George S. Kostiew ,  Shawna M. Liff

IPC分类号： H01L23/00

摘要： Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.

公开(公告)号：US20160211238A1

公开(公告)日：2016-07-21

申请号：US15062298

申请日：2016-03-07

申请人： Intel Corporation

发明人： Hemanth Dhavaleswarapu ,  Zhihua Li ,  Joseph Petrini ,  Steven B. Roach ,  Shankar Devasenathipathy ,  George S. Kostiew ,  Amram Eitan

IPC分类号： H01L23/00 ,  B23K20/00 ,  B23K35/02 ,  B23K20/02 ,  B23K20/26

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K3/04 ,  B23K3/08 ,  B23K3/085 ,  B23K20/002 ,  B23K20/023 ,  B23K20/026 ,  B23K20/26 ,  B23K35/0244 ,  B23K37/003 ,  B23K2101/42 ,  B33Y80/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/75266 ,  H01L2224/75301 ,  H01L2224/75502 ,  H01L2224/7555 ,  H01L2224/81097 ,  H01L2224/81098 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/81948 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/04 ,  H05K2203/1121 ,  H01L2924/014 ,  H01L2924/00012

摘要： Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

公开(公告)号：US20170014957A1

公开(公告)日：2017-01-19

申请号：US15221102

申请日：2016-07-27

申请人： Intel Corporation

发明人： Zhihua Li ,  Hemanth K. Dhavaleswarapu ,  Joseph B. Petrini ,  Shankar Devasenathipathy ,  Steven B. Roach ,  Ioan Sauciuc ,  Pranav K. Desai ,  George S. Kostiew ,  Sanjoy K. Saha

IPC分类号： B23K37/00 ,  H05K3/34 ,  B23K20/02 ,  H01L23/00 ,  F25B21/02 ,  B23K3/08

CPC分类号： B23K37/003 ,  B23K3/085 ,  B23K20/023 ,  F25B21/02 ,  F25B2321/0251 ,  H01L24/13 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/291 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75502 ,  H01L2224/81203 ,  H01L2224/83203 ,  H05K3/34 ,  H01L2924/014

摘要： Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.

摘要翻译： 描述了热压接瞬态冷却方案的各种实施例。 这些实施例包括耦合到加热器表面的垂直分离的微通道的阵列，其中每个出口微通道包括两个相邻的入口微通道，并且其中入口和出口歧管联接到微通道阵列，并且其中加热器表面 并且微通道在同一块内耦合。