公开(公告)号：US20210333848A1

公开(公告)日：2021-10-28

申请号：US17368851

申请日：2021-07-07

Applicant: Intel Corporation

Inventor： Jeff KU ,  Tin Poay CHUAH ,  Howe Yin LOO ,  Chin Kung GOH ,  Yew San LIM ,  Cora Shih Wei NIEN

IPC: G06F1/20 ,  F28F3/04 ,  F28F21/08 ,  G06F1/16

Abstract: According to the present disclosure, a laptop may be provided with a compartment including a moveable segment, an expandable heat exchanger with a movable section, and an expandable fan unit. The release of the movable segment of the compartment from a lower portion of the compartment produces an opening in the compartment and the movable section of the expandable heat exchanger is extended downward, and the expandable fan unit is lowered when the movable segment of the compartment is released.

公开(公告)号：US20230397323A1

公开(公告)日：2023-12-07

申请号：US17834641

申请日：2022-06-07

Applicant: Intel Corporation

Inventor： Min Suet LIM ,  Tin Poay CHUAH ,  Yew San LIM ,  Jeff KU ,  Twan Sing LOO ,  Poh Boon KHOO ,  Jiun Hann SIR

IPC: H05K1/02 ,  H01L23/367 ,  H01L25/065 ,  H01L25/18 ,  H05K3/22 ,  H01L23/42

CPC classification number: H05K1/0204 ,  H01L23/3675 ,  H01L25/0652 ,  H01L25/18 ,  H05K3/22 ,  H01L23/42 ,  H01L2224/32225 ,  H01L24/32

Abstract: Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a first slot is through a thickness of the substrate, and a second slot is through the thickness of the substrate, where the first slot is parallel to the second slot. In an embodiment, a metal plate is provided on the PCB. In an embodiment the metal plate comprises a first portion over the first surface of the substrate between the first slot and the second slot, a second portion connected to the first portion, wherein the second portion is in the first slot, and a third portion connected to the first portion, wherein the third portion is in the second slot.

公开(公告)号：US20230123645A1

公开(公告)日：2023-04-20

申请号：US17500983

申请日：2021-10-14

Applicant: Intel Corporation

Inventor： Tin Poay CHUAH ,  Jeff KU ,  Yew San LIM ,  Boon Ping KOH ,  Min Suet LIM

IPC: H01R12/78 ,  H01R13/28 ,  H01R13/629 ,  H01R13/20 ,  H01R43/02

Abstract: There may be provided a fastener arrangement. The fastener arrangement may include a first fastener tape including a first plurality of electrically conductive coupling elements and a first plurality of non-electrically conductive coupling elements. The fastener arrangement may further include a second fastener tape comprising a second plurality of electrically conductive coupling elements and a second plurality of non-electrically conductive coupling element. The fastener arrangement may further include a slider couplable to the first fastener tape and the second fastener tape for reversibly interleaving and interlocking the first plurality of electrically conductive and non-electrically conductive coupling elements with their corresponding second plurality of electrically conductive and non-electrically conductive elements. The interleaved and interlocked first and second plurality of electrically conductive coupling elements may form a plurality of conductive-bridges and the interleaved and interlocked first and second plurality of non-electrically conductive coupling elements may form a plurality of insulation-bridges.

公开(公告)号：US20250008711A1

公开(公告)日：2025-01-02

申请号：US18344934

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： Juha PAAVOLA ,  Curtis KOEPSELL ,  Sami HEINISUO ,  Kari MANSUKOSKI ,  Jeff KU

IPC: H05K9/00 ,  H05K1/02

Abstract: An electronic device and method for assembling an electronic device. The device includes a shielding structure at least partially, laterally surrounding an electrical component on a circuit board. The device further includes a lid affixed to the top of the shielding structure and covering the electrical component, a spring directly or indirectly applying a load force to the electronic component, and a fastener affixing the lid and the spring to the circuit board.

公开(公告)号：US20230337406A1

公开(公告)日：2023-10-19

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu BAWA ,  Ruander CARDENAS ,  Kathiravan D ,  Jia Yan GO ,  Chin Kung GOH ,  Jeff KU ,  Prakash Kurma RAJU ,  Baomin LIU ,  Twan Sing LOO ,  Mikko MAKINEN ,  Columbia MISHRA ,  Juha PAAVOLA ,  Prasanna PICHUMANI ,  Daniel RAGLAND ,  Kannan RAJA ,  Khai Ern SEE ,  Javed SHAIKH ,  Gokul SUBRAMANIAM ,  George Baoci SUN ,  Xiyong TIAN ,  Hua YANG ,  Mark CARBONE ,  Vivek PARANJAPE ,  Nehakausar PINJARI ,  Hari Shanker THAKUR ,  Christopher MOORE ,  Gustavo FRICKE ,  Justin HUTTULA ,  Gavin SUNG ,  Sammi WY LIU ,  Arnab SEN ,  Chun-Ting LIU ,  Jason Y. JIANG ,  Gerry JUAN ,  Shih Wei NIEN ,  Lance LIN ,  Evan KUKLINSKI

IPC: H05K7/20 ,  H01L23/34 ,  G06F1/20

CPC classification number: H05K7/20963 ,  H01L23/34 ,  G06F1/203 ,  H05K7/20336 ,  H05K7/2099 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20154

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

公开(公告)号：US20240186206A1

公开(公告)日：2024-06-06

申请号：US18438450

申请日：2024-02-10

Applicant: Intel Corporation

Inventor： Satish PRATHABAN ,  Ramaswamy PARTHASARATHY ,  Biswajit PATRA ,  Tongyan ZHAI ,  Jeff KU ,  Min Suet LIM ,  Yi HUANG ,  Kai XIAO ,  Gene F. YOUNG ,  Weimin SHI

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/427 ,  H01L25/065 ,  H01L25/18 ,  H05K1/02

CPC classification number: H01L23/367 ,  H01L23/427 ,  H01L25/0655 ,  H01L25/18 ,  H05K1/0203 ,  H05K1/0262 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/1427 ,  H01L2924/15311

Abstract: Systems, apparatuses and methods may provide for technology that includes a voltage regulator, a board assembly including a die and a circuit board electrically coupled to a first side of the die, and a thermal dissipation assembly thermally and electrically coupled to a second side of the die, wherein the thermal dissipation assembly is further electrically coupled to the voltage regulator. In one example, the thermal dissipation assembly includes a vapor chamber and the technology further includes a plurality of copper plates electrically coupled to the voltage regulator and a package substrate containing the die, wherein the plurality of copper plates are further thermally coupled to the vapor chamber.

公开(公告)号：US20220075410A1

公开(公告)日：2022-03-10

申请号：US17089752

申请日：2020-11-05

Applicant: Intel Corporation

Inventor： Min Suet LIM ,  Chee Chun YEE ,  Yew San LIM ,  Jeff KU ,  Tin Poay CHUAH

IPC: G06F1/16 ,  H05K7/20 ,  G06F1/20

Abstract: According to the present disclosure, a laptop may be provided with a smaller z-height using a motherboard assembly, including a motherboard having a plurality of components coupled thereon, a thermal transfer unit coupled to one or more component on the motherboard and attachment members for holding the motherboard in a lower compartment of a laptop clamshell casing at an inclining position.

公开(公告)号：US20220066509A1

公开(公告)日：2022-03-03

申请号：US17088620

申请日：2020-11-04

Applicant: Intel Corporation

Inventor： Chee Chun YEE ,  Tin Poay CHUAH ,  Yew San LIM ,  Min Suet LIM ,  Jeff KU

IPC: G06F1/16

Abstract: According to the various examples, a dual display system having a first panel having a first display area, a second panel having a second display area, and a connector assembly, attached to the first and second panels, that is configured to enable the first and second panels to rotate around three-directional axes. The connector assembly includes an elongated member and a hinge assembly, which are configured for attachment to the first and second display panels. The present dual display system may have several functional modalities, including use as a desktop computer, a laptop computer, a tablet, and a panoramic display.

公开(公告)号：US20250003424A1

公开(公告)日：2025-01-02

申请号：US18399686

申请日：2023-12-29

Applicant: Intel Corporation

Inventor： Abhishek SRIVASTAV ,  Smit KAPILA ,  Pawel TRELLA ,  Jeff KU ,  Prakash KURMA RAJU ,  Dominik STANCZAK

IPC: F04D29/46 ,  F04D29/42 ,  F04D29/58

Abstract: An apparatus and system for reducing air turbulence in a fan using a flow shaper. The fan including an impeller, a first outlet, and a second outlet. The flow shaper including a partition structure arranged at an inflection area between the first outlet and the second outlet. The flow shaper further including a first fin for the first outlet defining a first channel between the partition structure and the first fin. The first channel extending from a proximity of the impeller to the first outlet.

公开(公告)号：US20220066506A1

公开(公告)日：2022-03-03

申请号：US17088611

申请日：2020-11-04

Applicant: Intel Corporation

Inventor： Jeff KU ,  Tin Poay CHUAH ,  Yew San LIM ,  Min Suet LIM ,  Chee Chun YEE

IPC: G06F1/16 ,  G06F13/42 ,  G06F1/20 ,  H05K7/20

Abstract: The present disclosure relates to a docking station including a triangular prism shaped body, and a cradle proximal to a top section of the triangular prism shaped body for detachably receiving a mobile device, wherein the cradle may include a plurality of different connection interfaces to provide a selectable connection with a complementary connection interface of the mobile device.