公开(公告)号：US20210043754A1

公开(公告)日：2021-02-11

申请号：US17080713

申请日：2020-10-26

Applicant: Intel Corporation

Inventor： Jeffrey S. LEIB ,  Jenny HU ,  Anindya DASGUPTA ,  Michael L. HATTENDORF ,  Christopher P. AUTH

IPC: H01L29/66 ,  H01L29/78 ,  H01L21/285 ,  H01L21/02 ,  H01L27/088 ,  H01L29/06 ,  H01L21/8234 ,  H01L21/768 ,  H01L21/8238 ,  H01L29/417 ,  H01L21/311 ,  H01L27/092 ,  H01L29/08 ,  H01L21/762 ,  H01L21/033 ,  H01L21/28 ,  H01L21/308 ,  H01L49/02 ,  H01L23/532 ,  H01L27/02 ,  H01L23/528 ,  H01L29/167 ,  H01L23/522 ,  H01L29/165 ,  H01L27/11 ,  H01L29/51 ,  H01L23/00

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a semiconductor substrate comprising an N well region having a semiconductor fin protruding therefrom. A trench isolation layer is on the semiconductor substrate around the semiconductor fin, wherein the semiconductor fin extends above the trench isolation layer. A gate dielectric layer is over the semiconductor fin. A conductive layer is over the gate dielectric layer over the semiconductor fin, the conductive layer comprising titanium, nitrogen and oxygen. A P-type metal gate layer is over the conductive layer over the semiconductor fin.

公开(公告)号：US20200335603A1

公开(公告)日：2020-10-22

申请号：US16918816

申请日：2020-07-01

Applicant: Intel Corporation

Inventor： Jeffrey S. LEIB ,  Jenny HU ,  Anindya DASGUPTA ,  Michael L. HATTENDORF ,  Christopher P. AUTH

IPC: H01L29/66 ,  H01L29/78 ,  H01L27/088 ,  H01L21/762 ,  H01L29/06 ,  H01L21/8234 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01L29/165 ,  H01L29/417 ,  H01L21/033 ,  H01L21/28 ,  H01L21/285 ,  H01L21/308 ,  H01L21/311 ,  H01L21/8238 ,  H01L23/528 ,  H01L27/092 ,  H01L27/11 ,  H01L49/02 ,  H01L29/08 ,  H01L29/51 ,  H01L27/02 ,  H01L21/02 ,  H01L29/167

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. A gate dielectric layer is over a top of the fin and laterally adjacent sidewalls of the fin. An N-type gate electrode is over the gate dielectric layer over the top of the fin and laterally adjacent the sidewalls of the fin, the N-type gate electrode comprising a P-type metal layer on the gate dielectric layer, and an N-type metal layer on the P-type metal layer. A first N-type source or drain region is adjacent a first side of the gate electrode. A second N-type source or drain region is adjacent a second side of the gate electrode, the second side opposite the first side.

公开(公告)号：US20210091206A1

公开(公告)日：2021-03-25

申请号：US17100689

申请日：2020-11-20

Applicant: Intel Corporation

Inventor： Byron HO ,  Steven JALOVIAR ,  Jeffrey S. LEIB ,  Michael L. HATTENDORF ,  Christopher P. AUTH

IPC: H01L29/66 ,  H01L29/78 ,  H01L27/088 ,  H01L21/762 ,  H01L29/06 ,  H01L21/8234 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01L29/165 ,  H01L29/417 ,  H01L21/033 ,  H01L21/28 ,  H01L21/285 ,  H01L21/308 ,  H01L21/311 ,  H01L21/8238 ,  H01L23/528 ,  H01L27/092 ,  H01L27/11 ,  H01L49/02 ,  H01L29/08 ,  H01L29/51 ,  H01L27/02 ,  H01L21/02 ,  H01L29/167

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. An isolation structure surrounds a lower fin portion, the isolation structure comprising an insulating material having a top surface, and a semiconductor material on a portion of the top surface of the insulating material, wherein the semiconductor material is separated from the fin. A gate dielectric layer is over the top of an upper fin portion and laterally adjacent the sidewalls of the upper fin portion, the gate dielectric layer further on the semiconductor material on the portion of the top surface of the insulating material. A gate electrode is over the gate dielectric layer.

公开(公告)号：US20200066645A1

公开(公告)日：2020-02-27

申请号：US16324087

申请日：2016-09-30

Applicant: INTEL CORPORATION

Inventor： Jason A. FARMER ,  Jeffrey S. LEIB ,  Michael L. MCSWINEY ,  Harsono S. SIMKA ,  Daniel B. BERGSTROM

IPC: H01L23/532 ,  H01L21/285 ,  H01L21/768 ,  H01L23/522

Abstract: Embodiments of the invention include a microelectronic device that includes a substrate having a layer of dielectric material that includes a feature with a depression, a Tungsten containing barrier liner layer formed in the depression of the feature, and a Cobalt conductive layer deposited on the Tungsten containing barrier liner layer in the depression of the feature. The Tungsten containing barrier liner layer provides adhesion for the Cobalt conductive layer.

公开(公告)号：US20200027965A1

公开(公告)日：2020-01-23

申请号：US16509395

申请日：2019-07-11

Applicant: Intel Corporation

Inventor： Subhash M. JOSHI ,  Jeffrey S. LEIB ,  Michael L. HATTENDORF

IPC: H01L29/66 ,  H01L21/768 ,  H01L29/78 ,  H01L29/417 ,  H01L27/088 ,  H01L21/762 ,  H01L29/06 ,  H01L21/8234 ,  H01L23/522 ,  H01L23/532 ,  H01L29/165 ,  H01L21/033 ,  H01L21/28 ,  H01L21/285 ,  H01L21/308 ,  H01L21/311 ,  H01L21/8238 ,  H01L23/528 ,  H01L27/092 ,  H01L27/11 ,  H01L49/02 ,  H01L29/08 ,  H01L29/51 ,  H01L27/02 ,  H01L21/02 ,  H01L29/167

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. A gate dielectric layer is over the top of the fin and laterally adjacent the sidewalls of the fin. A gate electrode is over the gate dielectric layer over the top of the fin and laterally adjacent the sidewalls of the fin. First and second semiconductor source or drain regions are adjacent the first and second sides of the gate electrode, respectively. First and second trench contact structures are over the first and second semiconductor source or drain regions, respectively, the first and second trench contact structures both comprising a U-shaped metal layer and a T-shaped metal layer on and over the entirety of the U-shaped metal layer.

公开(公告)号：US20190165146A1

公开(公告)日：2019-05-30

申请号：US16170600

申请日：2018-10-25

Applicant: Intel Corporation

Inventor： Byron HO ,  Steven JALOVIAR ,  Jeffrey S. LEIB ,  Michael L. HATTENDORF ,  Christopher P. AUTH

IPC: H01L29/66 ,  H01L29/06 ,  H01L29/78 ,  H01L27/088 ,  H01L21/8234 ,  H01L21/762

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. An isolation structure surrounds a lower fin portion, the isolation structure comprising an insulating material having a top surface, and a semiconductor material on a portion of the top surface of the insulating material, wherein the semiconductor material is separated from the fin. A gate dielectric layer is over the top of an upper fin portion and laterally adjacent the sidewalls of the upper fin portion, the gate dielectric layer further on the semiconductor material on the portion of the top surface of the insulating material. A gate electrode is over the gate dielectric layer.

公开(公告)号：US20240162332A1

公开(公告)日：2024-05-16

申请号：US18416508

申请日：2024-01-18

Applicant: Intel Corporation

Inventor： Subhash M. JOSHI ,  Jeffrey S. LEIB ,  Michael L. HATTENDORF

IPC: H01L29/66 ,  H01L21/02 ,  H01L21/033 ,  H01L21/28 ,  H01L21/285 ,  H01L21/308 ,  H01L21/311 ,  H01L21/762 ,  H01L21/768 ,  H01L21/8234 ,  H01L21/8238 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532 ,  H01L27/02 ,  H01L27/088 ,  H01L27/092 ,  H01L29/06 ,  H01L29/08 ,  H01L29/165 ,  H01L29/167 ,  H01L29/417 ,  H01L29/51 ,  H01L29/78 ,  H10B10/00

CPC classification number: H01L29/66545 ,  H01L21/02532 ,  H01L21/02636 ,  H01L21/0337 ,  H01L21/28247 ,  H01L21/28518 ,  H01L21/28568 ,  H01L21/3086 ,  H01L21/31105 ,  H01L21/31144 ,  H01L21/76224 ,  H01L21/76232 ,  H01L21/76801 ,  H01L21/76802 ,  H01L21/76816 ,  H01L21/76834 ,  H01L21/76846 ,  H01L21/76849 ,  H01L21/76877 ,  H01L21/76897 ,  H01L21/823431 ,  H01L21/823481 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823821 ,  H01L21/823828 ,  H01L21/823842 ,  H01L21/823857 ,  H01L21/823871 ,  H01L21/823878 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/5283 ,  H01L23/53209 ,  H01L23/53238 ,  H01L23/53266 ,  H01L23/5329 ,  H01L27/0207 ,  H01L27/0886 ,  H01L27/0922 ,  H01L27/0924 ,  H01L28/20 ,  H01L28/24 ,  H01L29/0649 ,  H01L29/0653 ,  H01L29/0847 ,  H01L29/165 ,  H01L29/167 ,  H01L29/41783 ,  H01L29/41791 ,  H01L29/516 ,  H01L29/6653 ,  H01L29/6656 ,  H01L29/66636 ,  H01L29/66795 ,  H01L29/66818 ,  H01L29/7843 ,  H01L29/7845 ,  H01L29/7846 ,  H01L29/7848 ,  H01L29/785 ,  H01L29/7851 ,  H01L29/7854 ,  H10B10/12 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/0332 ,  H01L21/76883 ,  H01L21/76885 ,  H01L21/823437 ,  H01L21/823475 ,  H01L24/16 ,  H01L29/665

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. A gate dielectric layer is over the top of the fin and laterally adjacent the sidewalls of the fin. A gate electrode is over the gate dielectric layer over the top of the fin and laterally adjacent the sidewalls of the fin. First and second semiconductor source or drain regions are adjacent the first and second sides of the gate electrode, respectively. First and second trench contact structures are over the first and second semiconductor source or drain regions, respectively, the first and second trench contact structures both comprising a U-shaped metal layer and a T-shaped metal layer on and over the entirety of the U-shaped metal layer.

公开(公告)号：US20210249524A1

公开(公告)日：2021-08-12

申请号：US17243476

申请日：2021-04-28

Applicant: Intel Corporation

Inventor： Subhash M. JOSHI ,  Jeffrey S. LEIB ,  Michael L. HATTENDORF

IPC: H01L29/66 ,  H01L21/768 ,  H01L29/78 ,  H01L29/51 ,  H01L21/311 ,  H01L21/762 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/165 ,  H01L29/167 ,  H01L21/02 ,  H01L21/033 ,  H01L21/8234 ,  H01L27/088 ,  H01L23/528 ,  H01L23/532 ,  H01L29/417 ,  H01L21/285 ,  H01L27/02 ,  H01L49/02 ,  H01L29/06 ,  H01L29/08 ,  H01L21/28 ,  H01L21/308 ,  H01L23/522 ,  H01L27/11 ,  H01L23/00

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. A gate dielectric layer is over the top of the fin and laterally adjacent the sidewalls of the fin. A gate electrode is over the gate dielectric layer over the top of the fin and laterally adjacent the sidewalls of the fin. First and second semiconductor source or drain regions are adjacent the first and second sides of the gate electrode, respectively. First and second trench contact structures are over the first and second semiconductor source or drain regions, respectively, the first and second trench contact structures both comprising a U-shaped metal layer and a T-shaped metal layer on and over the entirety of the U-shaped metal layer.

公开(公告)号：US20210043520A1

公开(公告)日：2021-02-11

申请号：US17068121

申请日：2020-10-12

Applicant: Intel Corporation

Inventor： Jeffrey S. LEIB ,  Srijit MUKHERJEE ,  Vinay BHAGWAT ,  Michael L. HATTENDORF ,  Christopher P. AUTH

IPC: H01L21/8238 ,  H01L49/02 ,  H01L21/762 ,  H01L21/8234 ,  H01L21/311 ,  H01L29/08 ,  H01L27/11 ,  H01L29/78 ,  H01L29/66 ,  H01L21/308 ,  H01L27/092 ,  H01L29/51 ,  H01L21/285 ,  H01L21/28 ,  H01L21/033 ,  H01L21/768 ,  H01L23/532 ,  H01L23/522 ,  H01L23/528 ,  H01L29/417

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a P-type semiconductor device above a substrate and including first and second semiconductor source or drain regions adjacent first and second sides of a first gate electrode. A first metal silicide layer is directly on the first and second semiconductor source or drain regions. An N-type semiconductor device includes third and fourth semiconductor source or drain regions adjacent first and second sides of a second gate electrode. A second metal silicide layer is directly on the third and fourth semiconductor source or drain regions, respectively. The first metal silicide layer comprises at least one metal species not included in the second metal silicide layer.

公开(公告)号：US20200321449A1

公开(公告)日：2020-10-08

申请号：US16908468

申请日：2020-06-22

Applicant: Intel Corporation

Inventor： Jeffrey S. LEIB ,  Jenny HU ,  Anindya DASGUPTA ,  Michael L. HATTENDORF ,  Christopher P. AUTH

IPC: H01L29/66 ,  H01L29/78 ,  H01L27/088 ,  H01L21/762 ,  H01L29/06 ,  H01L21/8234 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01L29/165 ,  H01L29/417 ,  H01L21/033 ,  H01L21/28 ,  H01L21/285 ,  H01L21/308 ,  H01L21/311 ,  H01L21/8238 ,  H01L23/528 ,  H01L27/092 ,  H01L27/11 ,  H01L49/02 ,  H01L29/08 ,  H01L29/51 ,  H01L27/02 ,  H01L21/02 ,  H01L29/167

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a semiconductor substrate comprising an N well region having a semiconductor fin protruding therefrom. A trench isolation layer is on the semiconductor substrate around the semiconductor fin, wherein the semiconductor fin extends above the trench isolation layer. A gate dielectric layer is over the semiconductor fin. A conductive layer is over the gate dielectric layer over the semiconductor fin, the conductive layer comprising titanium, nitrogen and oxygen. A P-type metal gate layer is over the conductive layer over the semiconductor fin.