公开(公告)号：US20240127999A1

公开(公告)日：2024-04-18

申请号：US18195343

申请日：2023-05-09

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young Byun ,  Kwang-Deok Choi ,  Soyeon Lee

IPC: H01F1/24 ,  H01F3/08

CPC classification number: H01F1/24 ,  H01F3/08

Abstract: The present exemplary embodiments may provide soft magnetic powder including metal powder and an oxide insulation film coating a surface of metal powder particles, in which the metal powder particles may include one or more selected from pure iron or an iron-based alloy and the oxide insulation film may include an oxide of a component constituting the metal powder particles.

公开(公告)号：US11753725B2

公开(公告)日：2023-09-12

申请号：US17017892

申请日：2020-09-11

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young Byun ,  Kwang-deok Choi ,  In Uk Baek

IPC: B32B15/04 ,  C23C28/00 ,  H01L21/02 ,  B32B15/08 ,  B32B15/10 ,  B82Y40/00 ,  B82Y30/00

CPC classification number: C23C28/345 ,  C23C28/32 ,  H01L21/0228 ,  B82Y30/00 ,  B82Y40/00

Abstract: According to one aspect of the present invention, a non-metal member having a colored surface is provided. The non-metal member having a colored surface includes a non-metal substrate; a metal coating layer disposed on the non-metal substrate; a light-transmissive dielectric layer disposed on the metal coating layer; and a color pattern structure disposed on the light-transmissive dielectric layer.

公开(公告)号：US11520091B2

公开(公告)日：2022-12-06

申请号：US16684016

申请日：2019-11-14

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young Byun ,  So Hye Cho ,  Seung Yong Lee ,  Kwang-Deok Choi ,  In Uk Baek ,  Yun Hee Kim

IPC: C23C14/00 ,  G02B5/28 ,  C23C14/08 ,  C23C14/06 ,  B32B15/00 ,  B32B3/10 ,  B32B3/12

Abstract: Provided is a coloring pattern structure. The coloring pattern structure includes: a substrate; a light-transmitting dielectric layer formed on at least one surface of the substrate; and a composite material layer disposed on an upper surface of the light-transmitting dielectric layer and formed of a metal and a first material not having a thermodynamic solid solubility in the metal, wherein the metal included in the composite material layer has a pattern coated only on portions of the upper surface of the light-transmitting dielectric layer, and the first material is coated on the remaining area where the metal is not coated.

公开(公告)号：US11154849B2

公开(公告)日：2021-10-26

申请号：US16255662

申请日：2019-01-23

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young Byun ,  Sang Hoon Kim ,  Jong Sik Kim

IPC: B01J35/04 ,  B01J23/86 ,  B01J37/08 ,  B01J37/02 ,  B01J21/02 ,  B01J35/00 ,  F01N3/00

Abstract: A method of manufacturing a honeycomb metal structure includes providing a substrate comprising iron (Fe) and a container containing water; coating at least a part of the substrate with a viscid material whose viscidity is increased by moisture; attaching metal powder onto the viscid material; adhering the metal powder to the substrate due to an increase in viscidity of the viscid material by evaporating a portion of the water in the container and supplying moisture to the viscid material; and generating an uneven structure made of the metal powder bonded to the substrate by performing a heat treatment on the substrate to which the metal powder is adhered. The heat treatment may include performing a first heat treatment on the substrate to generate an intermetallic layer at an interface between the substrate and the metal powder; and performing a second heat treatment to dissolve the intermetallic compound layer.

公开(公告)号：US11770903B2

公开(公告)日：2023-09-26

申请号：US17511572

申请日：2021-10-27

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young Byun ,  Kwang-Deok Choi ,  Honguk Cheon

IPC: H05K3/38 ,  C23C18/18 ,  C23C18/31 ,  C23C28/02 ,  C23F1/02 ,  C23F17/00 ,  C25D5/34 ,  C25D5/48 ,  H05K3/06 ,  H05K3/10 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/388 ,  C23C18/1817 ,  C23C18/31 ,  C23C28/023 ,  C23F1/02 ,  C23F17/00 ,  C25D5/34 ,  C25D5/48 ,  H05K3/06 ,  H05K3/108 ,  H05K3/382 ,  H05K1/0306 ,  H05K1/09 ,  H05K2201/083 ,  H05K2203/072 ,  H05K2203/0723

Abstract: Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

公开(公告)号：US20210115550A1

公开(公告)日：2021-04-22

申请号：US17017892

申请日：2020-09-11

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Ji Young Byun ,  Kwang-deok Choi ,  In Uk Baek

IPC: C23C14/08 ,  C23C16/455 ,  C23C16/01 ,  H01L21/02 ,  C23C16/00 ,  C23C16/04 ,  C23C14/00 ,  C23C28/02

Abstract: According to one aspect of the present invention, a non-metal member having a colored surface is provided. The non-metal member having a colored surface includes a non-metal substrate; a metal coating layer disposed on the non-metal substrate; a light-transmissive dielectric layer disposed on the metal coating layer; and a color pattern structure disposed on the light-transmissive dielectric layer.