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公开(公告)号:US20220238801A1
公开(公告)日:2022-07-28
申请号:US17400912
申请日:2021-08-12
Applicant: Kioxia Corporation
Inventor: Katsuyoshi KOMATSU , Takeshi IWASAKI , Tadaomi DAIBOU , Hiroki KAWAI
Abstract: A semiconductor memory device includes a first electrode and a second electrode, a phase change layer disposed between the first electrode and the second electrode, and a first layer disposed between the first electrode and the phase change layer. The phase change layer contains at least one of germanium (Ge), antimony (Sb), and tellurium (Te). The first layer contains aluminum (Al) and antimony (Sb), or tellurium (Te) and at least one of zinc (Zn), lanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), and lutetium (Lu).
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公开(公告)号:US20240215259A1
公开(公告)日:2024-06-27
申请号:US18478213
申请日:2023-09-29
Applicant: Kioxia Corporation
Inventor: Yuya SATO , Masakazu GOTO , Hiroki KAWAI , Takeshi IWASAKI , Katsuyoshi KOMATSU
IPC: H10B61/00
CPC classification number: H10B61/10
Abstract: A memory device of embodiments includes a memory cell including: a first conductive layer; a second conductive layer; a third conductive layer provided between the first conductive layer and the second conductive layer; a switching layer provided between the first conductive layer and the third conductive layer; and a variable resistance layer provided between the third conductive layer and the second conductive layer. The switching layer contains antimony (Sb), a second element, and an oxide of a first element. The first element is at least one element selected from a group consisting of zirconium (Zr), hafnium (Hf), yttrium (Y), tantalum (Ta), lanthanum (La), cerium (Ce), magnesium (Mg), and titanium (Ti). The second element is at least one element selected from a group consisting of carbon (C), boron (B), nitrogen (N), silicon (Si), and tin (Sn).
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公开(公告)号:US20220013579A1
公开(公告)日:2022-01-13
申请号:US17482865
申请日:2021-09-23
Applicant: Kioxia Corporation
Inventor: Tadaomi DAIBOU , Yasushi NAKASAKI , Tadashi KAI , Hiroki KAWAI , Takamitsu ISHIHARA , Junichi ITO
Abstract: According to one embodiment, a magnetic memory device including a stacked structure including a first magnetic layer having a variable magnetization direction, a second magnetic layer having a fixed magnetization direction, and a nonmagnetic layer provided between the first magnetic layer and the second magnetic layer, and containing magnesium (Mg) and oxygen (O). The nonmagnetic layer further contains a first additive element and a second additive element, the first additive element is at least one element selected from sulfur (S), gallium (Ga), aluminum (Al), titanium (Ti), vanadium (V), hydrogen (H), fluorine (F), manganese (Mg), lithium (Li), nitrogen (N) and magnesium (Mg), and the second additive element is lithium (Li).
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公开(公告)号:US20210296585A1
公开(公告)日:2021-09-23
申请号:US17019664
申请日:2020-09-14
Applicant: Kioxia Corporation
Inventor: Tadaomi DAIBOU , Hiroki KAWAI , Katsuyoshi KOMATSU , Weidong LI , Shogo ITAI , Kouji MATSUO
IPC: H01L45/00
Abstract: A switching device in an embodiment includes: a first electrode; a second electrode, and a switching layer disposed between the first electrode and the second electrode. The switching layer is made of a material containing hafnium nitride. Otherwise, the switching layer is made of a material containing bismuth and at least one selected from the group consisting of silicon oxide, aluminum oxide, zirconium oxide, and gallium oxide, or a material containing at least one selected from the group consisting of bismuth oxide, bismuth nitride, bismuth boride, and bismuth sulfide.
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公开(公告)号:US20230091204A1
公开(公告)日:2023-03-23
申请号:US17681853
申请日:2022-02-28
Applicant: KIOXIA CORPORATION
Inventor: Takao KOSAKA , Hideto HORII , Hiroki TOKUHIRA , Kazuya MATSUZAWA , Hiroki KAWAI
IPC: H01L27/108 , H01L29/786 , G11C11/4091 , H01L29/66
Abstract: A semiconductor device includes a first conductive layer extending along a first direction, a semiconductor layer extending along a second direction crossing the first direction, penetrating the first conductive layer, and including an oxide semiconductor, a first insulating layer between the first conductive layer and the semiconductor layer, a second conductive layer provided on one side of the semiconductor layer in the second direction and electrically connected thereto, a third conductive layer provided on the other side of the semiconductor layer in the second direction and electrically connected thereto, an electric conductor extending from the third conductive layer toward the second conductive layer along the semiconductor layer, and a charge storage film between the semiconductor layer and the electric conductor.
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公开(公告)号:US20230085635A1
公开(公告)日:2023-03-23
申请号:US17687944
申请日:2022-03-07
Applicant: Kioxia Corporation
Inventor: Hiroki KAWAI , Kasumi YASUDA , Hiroki TOKUHIRA , Kazuhiro KATONO , Akifumi GAWASE , Katsuyoshi KOMATSU , Tadaomi DAIBOU
Abstract: A resistance change device of an embodiment includes a first electrode, a second electrode, and a layer disposed between the first electrode and the second electrode and containing a resistance change material. In the resistance change device of the embodiment, the resistance change material contains: a first element including Sb and Te; a second element including at least one element selected from the group consisting of Ge and In; a third element including at least one element selected from the group consisting of Si, N, B, C, Al, and Ti; and a fourth element including at least one element selected from the group consisting of Sc, Y, La, Gd, Zr, and Hf.
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公开(公告)号:US20240215467A1
公开(公告)日:2024-06-27
申请号:US18476635
申请日:2023-09-28
Applicant: Kioxia Corporation
Inventor: Hiroki KAWAI , Takeshi IWASAKI , Katsuyoshi KOMATSU , Rina NOMOTO , Zhu QI , Takayuki SASAKI
CPC classification number: H10N70/8828 , G11C5/06 , H10B63/80 , H10N70/883
Abstract: A memory device of embodiments includes a memory cell including: a first conductive layer; a second conductive layer; a third conductive layer provided between the first conductive layer and the second conductive layer; a variable resistance layer provided between the first conductive layer and the third conductive layer; and a switching layer provided between the third conductive layer and the second conductive layer. The switching layer contains antimony (Sb), a second element, adn an oxide of a first element. The first element is at least one element selected from a group consisting of zirconium (Zr), hafnium (Hf), yttrium (Y), tantalum (Ta), lanthanum (La), cerium (Ce), magnesium (Mg), and titanium (Ti). The second element is at least one element selected from a group consisting of aluminum (Al), zinc (Zn), and gallium (Ga).
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公开(公告)号:US20240215459A1
公开(公告)日:2024-06-27
申请号:US18476628
申请日:2023-09-28
Applicant: Kioxia Corporation
Inventor: Takeshi IWASAKI , Yosuke MATSUSHIMA , Makoto ONIZAKI , Katsuyoshi KOMATSU , Masakazu GOTO , Hiroki KAWAI , Rina NOMOTO , Kenta CHOKAWA , Zhu QI , Tadaomi DAIBOU
Abstract: A memory device of embodiments includes a memory cell including: a first conductive layer; a second conductive layer; a third conductive layer provided between the first conductive layer and the second conductive layer; a variable resistance layer provided between the first conductive layer and the third conductive layer; and a switching layer provided between the third conductive layer and the second conductive layer. The switching layer contains an oxide of a first element, which is at least one element selected from a group consisting of zirconium, yttrium, tantalum, lanthanum, cerium, titanium, hafnium, and magnesium, and a compound of a second element that is at least one element selected from a group consisting of zinc, tin, gallium, indium, and bismuth and a third element that is at least one element selected from a group consisting of tellurium, sulfur, and selenium.
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公开(公告)号:US20210202838A1
公开(公告)日:2021-07-01
申请号:US17014587
申请日:2020-09-08
Applicant: Kioxia Corporation
Inventor: Hiroki KAWAI , Katsuyoshi KOMATSU , Tadaomi DAIBOU , Hiroki TOKUHIRA , Masatoshi YOSHIKAWA , Yuichi ITO
IPC: H01L45/00
Abstract: A resistance variable device of an embodiment includes a stack arranged between a first electrode and a second electrode and including a resistance variable layer and a chalcogen-containing layer. The chalcogen-containing layer contains a material having a composition represented by a general formula: C1xC2yAz, where C1 is at least one element selected from Sc, Y, Zr, and Hf, C2 is at least one element selected from C, Si, Ge, B, Al, Ga, and In, A is at least one element selected from S, Se, and Te, and x, y, and z are numbers representing atomic ratios satisfying 0
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公开(公告)号:US20210083007A1
公开(公告)日:2021-03-18
申请号:US16803933
申请日:2020-02-27
Applicant: KIOXIA CORPORATION
Inventor: Hiroki KAWAI , Daisuke WATANABE , Toshihiko NAGASE
Abstract: According to one embodiment, a variable resistance element includes a first electrode, a second electrode, and a variable resistance layer and a tellurium-containing compound layer disposed between the first electrode and the second electrode. The tellurium-containing compound layer contains tellurium, oxygen, and at least one element selected from tin, copper, and bismuth. In some examples, the tellurium-containing compound layer can function as a switching layer in a memory cell structure.
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