公开(公告)号：US08643155B2

公开(公告)日：2014-02-04

申请号：US13379640

申请日：2011-08-31

申请人： Liang-Chan Liao ,  Po-Shen Lin ,  Yu Wu

发明人： Liang-Chan Liao ,  Po-Shen Lin ,  Yu Wu

IPC分类号： H01L23/34 ,  H01L23/495

CPC分类号： G02F1/13452 ,  H01L23/36 ,  H01L24/32 ,  H01L2224/83447 ,  H01L2924/15788 ,  H01L2924/00

摘要： A chip on film (COF) is disclosed in the present disclosure, which comprises an adhesive base layer, a driving integrated circuit (IC), an adhesive layer and a copper layer. The driving IC is embedded on a surface of the adhesive base layer; the adhesive layer is located under the adhesive base layer; the copper layer is located under the adhesive layer. The adhesive base layer is formed with a heat and pressure spreading structure. A heat and pressure spreading structure is disposed on the adhesive base layer of the COF so that deformation or unevenness of the glass substrate in the bonded area can be avoided when the COF is thermally pressed to the glass substrate of the LCD. These guarantees the consistency between the bonded area and the unbounded area, the bonded area and the unbounded area of the glass substrate will have the same transmissivity and luminance.

摘要翻译： 在本公开内容中公开了一种薄膜（COF），其包括粘合剂基层，驱动集成电路（IC），粘合剂层和铜层。 驱动IC嵌入在粘合剂基层的表面上; 粘合剂层位于粘合剂基层下方; 铜层位于粘合层下方。 粘合剂基层由热压扩散结构形成。 在COF的粘合剂基层上设置有热压扩散结构，使得当COF被热压到LCD的玻璃基板上时，可以避免在接合区域中的玻璃基板的变形或不均匀。 这些保证了接合面积和无界区域的一致性，玻璃基板的接合面积和无界面积将具有相同的透射率和亮度。

公开(公告)号：US20130063912A1

公开(公告)日：2013-03-14

申请号：US13377789

申请日：2011-10-01

申请人： Liang-Chan Liao ,  Po-Shen Lin ,  Yu Wu

发明人： Liang-Chan Liao ,  Po-Shen Lin ,  Yu Wu

IPC分类号： H05K7/06 ,  H05K13/04

CPC分类号： H05K13/0084 ,  B65D73/02 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

摘要： A COF packaging method and structure for LCD driver chips, the packaging structure comprises a substrate tape and a plurality of COF packaging units arranged consecutively along a direction the substrate tape is moved. Each of the packaging units includes a LCD driver chip, and a first lead and a second lead electrically connected to the LCD driver chip and distributed along two sides of the LCD driver chip. The LCD driver chip of each of the packaging units is parallel to the moving direction of the substrate tape, the first lead and the second lead of each of the packaging units are extended along a width of the substrate tape. By the method, the number and intervals of the leads are not limited by the width dimension of the substrate tape, in order to suit the requirements of large-sized liquid crystal panels.

摘要翻译： 一种用于LCD驱动器芯片的COF封装方法和结构，所述封装结构包括基板带和沿着所述基板带移动的方向连续设置的多个COF封装单元。 每个包装单元包括LCD驱动器芯片，以及电连接到LCD驱动器芯片并沿着LCD驱动器芯片的两侧分布的第一引线和第二引线。 每个包装单元的LCD驱动器芯片平行于衬底带的移动方向，每个包装单元的第一引线和第二引线沿着衬底带的宽度延伸。 通过该方法，引线的数量和间隔不受衬底带的宽度尺寸的限制，以适应大尺寸液晶面板的要求。

公开(公告)号：US20120313116A1

公开(公告)日：2012-12-13

申请号：US13379640

申请日：2011-08-31

申请人： Liang-Chan Liao ,  Po-Shen Lin ,  Yu Wu

发明人： Liang-Chan Liao ,  Po-Shen Lin ,  Yu Wu

IPC分类号： H01L33/64 ,  H01L23/48

CPC分类号： G02F1/13452 ,  H01L23/36 ,  H01L24/32 ,  H01L2224/83447 ,  H01L2924/15788 ,  H01L2924/00

摘要： A chip on film (COF) is disclosed in the present disclosure, which comprises an adhesive base layer, a driving integrated circuit (IC), an adhesive layer and a copper layer. The driving IC is embedded on a surface of the adhesive base layer; the adhesive layer is located under the adhesive base layer; the copper layer is located under the adhesive layer. The adhesive base layer is formed with a heat and pressure spreading structure. A heat and pressure spreading structure is disposed on the adhesive base layer of the COF so that deformation or unevenness of the glass substrate in the bonded area can be avoided when the COF is thermally pressed to the glass substrate of the LCD. These guarantees the consistency between the bonded area and the unbounded area, the bonded area and the unbounded area of the glass substrate will have the same transmissivity and luminance.

摘要翻译： 在本公开内容中公开了一种薄膜（COF），其包括粘合剂基层，驱动集成电路（IC），粘合剂层和铜层。 驱动IC嵌入在粘合剂基层的表面上; 粘合剂层位于粘合剂基层下方; 铜层位于粘合层下方。 粘合剂基层由热压扩散结构形成。 在COF的粘合剂基层上设置有热压扩散结构，使得当COF被热压到LCD的玻璃基板上时，可以避免在接合区域中的玻璃基板的变形或不均匀。 这些保证了接合面积和无界区域的一致性，玻璃基板的接合面积和无界面积将具有相同的透射率和亮度。

公开(公告)号：US08780577B2

公开(公告)日：2014-07-15

申请号：US13378566

申请日：2011-11-08

申请人： Liang-Chan Liao ,  Po-Shen Lin ,  Yuxin Bi

发明人： Liang-Chan Liao ,  Po-Shen Lin ,  Yuxin Bi

IPC分类号： H05K7/00 ,  H05K1/16 ,  H01L23/498 ,  G02F1/13

CPC分类号： H01L23/4985 ,  G02F1/13 ,  H01L24/97 ,  H01L2924/14 ,  H01L2924/00

摘要： The invention discloses a COF packaging unit and a COF packaging tape. The COF packaging unit comprises COF baseband(s), IC Die(s) packaged on the COF baseband(s), and input end wires and output end wires connected with the IC Die(s); the input end wires and the output end wires are respectively provided with input terminals and output terminals at two edges of the COF baseband. In the invention, because the input terminals and the output terminals are pitched along the edges of the COF baseband, the length of the single COF packaging unit is set in accordance with the pitching requirement of the input end wires and the output end wires, so that the COF baseband can have sufficient area for wiring, to adapt to the requirement of large LCD panels. Thus, resources are reasonably integrated and used, equipment utilization rate is increased, material purchasing cost is saved, and economic benefits are increased.

摘要翻译： 本发明公开了一种COF包装单元和COF包装带。 COF封装单元包括COF基带，封装在COF基带上的IC芯片，以及与IC芯片连接的输入端线和输出端线; 输入端线和输出端线分别在COF基带的两个边缘处设置有输入端子和输出端子。 在本发明中，由于输入端子和输出端子沿着COF基带的边缘倾斜，所以单个COF封装单元的长度根据输入端线和输出端线的俯仰要求而设定，因此 COF基带可以有足够的布线面积，以适应大型液晶面板的需求。 资源合理整合利用，设备利用率提高，物资采购成本节省，经济效益提高。

公开(公告)号：US08547026B2

公开(公告)日：2013-10-01

申请号：US13381366

申请日：2011-11-03

申请人： Po-Shen Lin ,  Liang-Chan Liao ,  Xin-Ming Gao

发明人： Po-Shen Lin ,  Liang-Chan Liao ,  Xin-Ming Gao

IPC分类号： H05B37/02

CPC分类号： G09G3/34 ,  G09G3/3406 ,  H05B33/086

摘要： The present invention provides a display device and an LED backlight driving circuit thereof. The LED backlight driving circuit includes a plurality of LED light strings connected in parallel; a switch module including switches; a power module, and a switching control module. The switching control module includes: a driving unit connected to the switches; a current detection unit connected to the switches; an ON time detection unit connected to the driving unit; a reference unit, the reference unit supplying a reference value; multipliers, each of which has two input terminals respectively connected to the ON time detection unit and the current detection unit to receive a ON time value of a corresponding one of the switches and a voltage signal indicating the current of the switch; and comparison units, each of which has two input terminals respectively connected to the reference unit and an output terminal of a corresponding one of the multipliers. Each of the comparison units has an output terminal connected to the driving unit. The driving unit controls the ON time of the switch corresponding to the comparison unit according to an output result of the comparison unit.

摘要翻译： 本发明提供一种显示装置及其LED背光驱动电路。 LED背光驱动电路包括并联连接的多个LED灯串; 包括开关的开关模块; 电源模块和开关控制模块。 开关控制模块包括：连接到开关的驱动单元; 连接到开关的电流检测单元; 连接到驱动单元的ON时间检测单元; 参考单元，所述参考单元提供参考值; 乘法器，其中每个具有分别连接到接通时间检测单元的两个输入端子和用于接收相应一个开关的接通时间值的电流检测单元和指示开关电流的电压信号; 以及比较单元，每个比较单元具有分别连接到参考单元的两个输入端子和相应的一个乘法器的输出端子。 每个比较单元具有连接到驱动单元的输出端子。 驱动单元根据比较单元的输出结果控制对应于比较单元的开关的接通时间。

公开(公告)号：US20130107165A1

公开(公告)日：2013-05-02

申请号：US13381366

申请日：2011-11-03

申请人： Po-Shen Lin ,  Liang-Chan Liao ,  Xin-Ming Gao

发明人： Po-Shen Lin ,  Liang-Chan Liao ,  Xin-Ming Gao

IPC分类号： G02F1/13357 ,  H05B37/00

CPC分类号： G09G3/34 ,  G09G3/3406 ,  H05B33/086

摘要： The present invention provides a display device and an LED backlight driving circuit thereof. The LED backlight driving circuit includes a plurality of LED light strings connected in parallel; a switch module including switches; a power module, and a switching control module. The switching control module includes: a driving unit connected to the switches; a current detection unit connected to the switches; an ON time detection unit connected to the driving unit; a reference unit, the reference unit supplying a reference value; multipliers, each of which has two input terminals respectively connected to the ON time detection unit and the current detection unit to receive a ON time value of a corresponding one of the switches and a voltage signal indicating the current of the switch; and comparison units, each of which has two input terminals respectively connected to the reference unit and an output terminal of a corresponding one of the multipliers. Each of the comparison units has an output terminal connected to the driving unit. The driving unit controls the ON time of the switch corresponding to the comparison unit according to an output result of the comparison unit.

摘要翻译： 本发明提供一种显示装置及其LED背光驱动电路。 LED背光驱动电路包括并联连接的多个LED灯串; 包括开关的开关模块; 电源模块和开关控制模块。 开关控制模块包括：连接到开关的驱动单元; 连接到开关的电流检测单元; 连接到驱动单元的ON时间检测单元; 参考单元，所述参考单元提供参考值; 乘法器，其中每个具有分别连接到接通时间检测单元的两个输入端子和用于接收相应一个开关的接通时间值的电流检测单元和指示开关电流的电压信号; 以及比较单元，每个比较单元具有分别连接到参考单元的两个输入端子和相应的一个乘法器的输出端子。 每个比较单元具有连接到驱动单元的输出端子。 驱动单元根据比较单元的输出结果控制对应于比较单元的开关的接通时间。

公开(公告)号：US20130114226A1

公开(公告)日：2013-05-09

申请号：US13378566

申请日：2011-11-08

申请人： Liang-Chan Liao ,  Po-Shen Lin ,  Yuxin Bi

发明人： Liang-Chan Liao ,  Po-Shen Lin ,  Yuxin Bi

IPC分类号： H05K7/06

CPC分类号： H01L23/4985 ,  G02F1/13 ,  H01L24/97 ,  H01L2924/14 ,  H01L2924/00

摘要： The invention discloses a COF packaging unit and a COF packaging tape. The COF packaging unit comprises COF baseband(s), IC Die(s) packaged on the COF baseband(s), and input end wires and output end wires connected with the IC Die(s); the input end wires and the output end wires are respectively provided with input terminals and output terminals at two edges of the COF baseband. In the invention, because the input terminals and the output terminals are pitched along the edges of the COF baseband, the length of the single COF packaging unit is set in accordance with the pitching requirement of the input end wires and the output end wires, so that the COF baseband can have sufficient area for wiring, to adapt to the requirement of large LCD panels. Thus, resources are reasonably integrated and used, equipment utilization rate is increased, material purchasing cost is saved, and economic benefits are increased.

摘要翻译： 本发明公开了一种COF包装单元和COF包装带。 COF封装单元包括COF基带，封装在COF基带上的IC芯片，以及与IC芯片连接的输入端线和输出端线; 输入端线和输出端线分别在COF基带的两个边缘处设置有输入端子和输出端子。 在本发明中，由于输入端子和输出端子沿着COF基带的边缘倾斜，所以单个COF封装单元的长度根据输入端线和输出端线的俯仰要求而设定，因此 COF基带可以有足够的布线面积，以适应大型液晶面板的需求。 资源合理整合利用，设备利用率提高，物资采购成本节省，经济效益提高。

公开(公告)号：US20120125668A1

公开(公告)日：2012-05-24

申请号：US13300392

申请日：2011-11-18

申请人： Yi-Ming CHANG ,  I-Min Lin ,  Po-Shen Lin

发明人： Yi-Ming CHANG ,  I-Min Lin ,  Po-Shen Lin

IPC分类号： H05K1/09 ,  H05K3/06

CPC分类号： H05K3/06 ,  H01L21/4853 ,  H01L21/7685 ,  H01L21/76852 ,  H01L21/76885 ,  H01L23/53238 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02317 ,  H01L2224/02319 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/1148 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/14 ,  H05K3/244 ,  H05K3/4007 ,  H05K2201/0367 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/00

摘要： A wiring structure for improving a crown-like defect and a fabrication method thereof are provided. The method includes the following steps. A substrate, on which a seed layer and a patterned photoresist layer with an opening are formed, is provided. A copper layer, having a bottom covering the seed layer, is formed in the opening. A barrier layer covering at least one top portion of the copper layer is formed on the copper layer. An oxidation potential of the barrier layer is greater than that of the copper layer. The patterned photoresist layer is removed to perform an etching process, wherein the copper layer and a portion of the seed layer exposed are etched to form a wiring layer. An immersion process is performed to form an anti-oxidation layer comprehensively on exposed surfaces of the barrier layer and the wiring layer.

摘要翻译： 提供了一种用于改善冠状缺陷的布线结构及其制造方法。 该方法包括以下步骤。 提供了其上形成有种子层和具有开口的图案化光致抗蚀剂层的衬底。 在开口中形成有覆盖种子层的底部的铜层。 覆盖铜层的至少一个顶部的阻挡层形成在铜层上。 阻挡层的氧化电位大于铜层的氧化电位。 去除图案化的光致抗蚀剂层以进行蚀刻工艺，其中铜层和暴露的种子层的一部分被蚀刻以形成布线层。 进行浸渍处理以在阻挡层和布线层的暴露表面上综合地形成抗氧化层。

公开(公告)号：US08836134B2

公开(公告)日：2014-09-16

申请号：US13738082

申请日：2013-01-10

申请人： Po-Shen Lin ,  Chuan-Jin Shiu ,  Bing-Siang Chen ,  Chen-Han Chiang ,  Chien-Hui Chen ,  Hsi-Chien Lin ,  Yen-Shih Ho

发明人： Po-Shen Lin ,  Chuan-Jin Shiu ,  Bing-Siang Chen ,  Chen-Han Chiang ,  Chien-Hui Chen ,  Hsi-Chien Lin ,  Yen-Shih Ho

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L21/78 ,  B81C1/00888 ,  H01L21/561 ,  H01L23/12 ,  H01L23/3114 ,  H01L23/562 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/1461 ,  H01L2924/16235 ,  H01L2924/00

摘要： A method of fabricating a semiconductor stacked package is provided. A singulation process is performed on a wafer and a substrate, on which the wafer is stacked. A portion of the wafer on a cutting region is removed, to form a stress concentrated region on an edge of a chip of the wafer. The wafer and the substrate are then cut, and a stress is forced to be concentrated on the edge of the chip of the wafer. As a result, the edge of the chip is warpaged. Therefore, the stress is prevented from extending to the inside of the chip. A semiconductor stacked package is also provided.

摘要翻译： 提供一种制造半导体堆叠封装的方法。 在晶片和基板上进行单晶化处理，晶片和晶片被堆叠在其上。 去除切割区域上的晶片的一部分，以在晶片的芯片的边缘上形成应力集中区域。 然后切割晶片和基板，并且迫使应力集中在晶片的芯片的边缘上。 结果，芯片的边缘变形。 因此，防止了应力延伸到芯片的内部。 还提供半导体堆叠封装。

公开(公告)号：US08575634B2

公开(公告)日：2013-11-05

申请号：US12981600

申请日：2010-12-30

申请人： Tsang-Yu Liu ,  Yu-Lin Yen ,  Chuan-Jin Shiu ,  Po-Shen Lin

发明人： Tsang-Yu Liu ,  Yu-Lin Yen ,  Chuan-Jin Shiu ,  Po-Shen Lin

IPC分类号： H01L33/60 ,  H01L33/48

CPC分类号： H01L27/14618 ,  H01L21/76898 ,  H01L23/055 ,  H01L23/16 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a chip package, including: a chip having a semiconductor device thereon; a cap layer over the semiconductor device; a spacer layer between the chip and the cap layer, wherein the spacer layer surrounds the semiconductor device and forms a cavity between the chip and the cap layer; and an anti-reflective layer between the cap layer and the chip, wherein the anti-reflective layer has a overlapping region with the spacer layer and extends into the cavity. Furthermore, a method for fabricating a chip package is also provided.

摘要翻译： 本发明提供了一种芯片封装，包括：其上具有半导体器件的芯片; 半导体器件上的覆盖层; 在所述芯片和所述盖层之间的间隔层，其中所述间隔层围绕所述半导体器件并且在所述芯片和所述盖层之间形成空腔; 以及在所述盖层和所述芯片之间的抗反射层，其中所述抗反射层具有与所述间隔层的重叠区域并延伸到所述空腔中。 此外，还提供了一种用于制造芯片封装的方法。