摘要:
A rotor resin assembly of a rotor of an electric motor includes a rotor magnet including a substantially cylindrical yoke molded from thermoplastic resin containing a soft magnetic material or ferrite and a resin magnet integrally formed in the outer circumference of the yoke, a position detection magnet arranged at one end in the axial direction of the rotor magnet, and a substantially doughnut-like rotor core arranged in the inner circumference of the rotor magnet and formed by laminating a predetermined number of electromagnetic steel plates. The rotor magnet, the position detection magnet, and the rotor core are integrally formed by resin. A shaft is inserted into an inner diameter section of the rotor core, and the rotor resin assembly is caulked by a jig to form a recess in the vicinity of the inner diameter sections of both end faces of the rotor core and assembled to the shaft.
摘要:
A rotor resin assembly of a rotor of an electric motor includes a rotor magnet including a substantially cylindrical yoke molded from thermoplastic resin containing a soft magnetic material or ferrite and a resin magnet integrally formed in the outer circumference of the yoke, a position detection magnet arranged at one end in the axial direction of the rotor magnet, and a substantially doughnut-like rotor core arranged in the inner circumference of the rotor magnet and formed by laminating a predetermined number of electromagnetic steel plates. The rotor magnet, the position detection magnet, and the rotor core are integrally formed by resin. A shaft is inserted into an inner diameter section of the rotor core, and the rotor resin assembly is caulked by a jig to form a recess in the vicinity of the inner diameter sections of both end faces of the rotor core and assembled to the shaft.
摘要:
A highly efficient and long-life pump is provided through improvement of pump efficiency by extending an effective length of a blade of an impeller and through reduction of friction loss of a thrust bearing. In a pump 110, a suction direction X and a discharge direction Y of a liquid are approximately perpendicular to each other. The pump 100 includes a shaft 27 positioned downstream of a suction inlet 22; an impeller 25 configured in a disk shape that rotates around the shaft 27, the impeller 25 having a plurality of blades 25c formed radially in a radial direction from a center area located at a center portion of the disk shape as seen in the suction direction X, the plurality of blades 25c being positioned at an approximately same longitudinal position as a longitudinal position of a discharge outlet 23; and a bearing (18-1) that receives the shaft 27, the bearing (18-1) being positioned at the center area of the impeller 25 and having a through hole (18-1c) as a guide portion for guiding the liquid drawn in from the suction inlet 22 to the discharge outlet 23.
摘要:
A manufacturing method of a water circulating pump including a shaft, a pump part having a first casing in which a first concavity is formed for receiving one end portion of the shaft to restrain rotation of the shaft. A stator part has a second casing in which a second concavity is formed for receiving another end portion of the shaft to restrain rotation of the shaft and a stator for rotating a rotor by electromagnetic interaction. The method includes inserting the another end portion of the shaft into a position corresponding to the second concavity of a mold for molding the second casing, and molding the second casing by injecting a thermoplastic resin into the mold for molding the second casing into which the another end portion of the shaft has been inserted.
摘要:
A method for manufacturing a semiconductor device includes forming an insulating film including silicon, oxygen, carbon and hydrogen above a semiconductor substrate, forming a wiring trench in the insulating film, forming a metal film to be a metal wiring on the insulating film such that the metal film is provided in the wiring trench, forming the metal wiring by removing the metal film outside the wiring trench, performing a hydrophobic treatment to the surface of the insulating film after the forming the metal wiring, and forming a metal cap selectively on an upper surface of the metal wiring by plating after the performing the hydrophobic treatment.
摘要:
A method for fabricating a semiconductor device, includes forming a dielectric film above a substrate; forming an opening in the dielectric film; forming a first film containing a metal whose energy for forming silicide thereof is lower than that of Cu silicide inside the opening; forming a second film that is conductive and contains copper (Cu) in the opening in which the first film containing the metal is formed; and forming a compound film containing Cu and silicon (Si) selectively on the second film in an atmosphere in which a temperature of the substrate is below 300° C.
摘要:
Disclosed is a low dielectric constant insulating film formed of a polymer containing Si atoms, O atoms, C atoms, and H atoms, which includes straight chain molecules in which a plurality of basic molecules with an SiO structure are linked in a straight chain, binder molecules with an SiO structure linking a plurality of the straight chain molecules. The area ratio of a signal indicating a linear type SiO structure is 49% or more, and the signal amount of the signal indicating Si(CH3) is 66% or more.
摘要:
According to one embodiment, a semiconductor device includes an interlayer insulation film provided on a substrate including a Cu wiring, a via hole formed in the interlayer insulation film on the Cu wiring, a first metal film selectively formed on the Cu wiring in the via hole, functioning as a barrier to the Cu wiring, and functioning as a promoter of carbon nanotube growth, a second metal film formed at least on the first metal film in the via hole, and functioning as a catalyst of the carbon nanotube growth, and carbon nanotubes buried in the via hole in which the first metal film and the second metal film are formed.
摘要:
A semiconductor device according to an embodiment of the present invention has: a semiconductor substrate; an interlayer insulating film formed above the semiconductor substrate; a protective film formed on the interlayer insulating film, the protective film having a higher density than that of the interlayer insulating film; at least one of a wiring and a dummy wiring formed in the interlayer insulating film and the protective film; and a separation wall formed within the interlayer insulating film so as to surround a low density region to separate the low density region from other regions, a sum of covering densities of the wiring and the dummy wiring being lower than a predetermined prescribed value in the low density region.
摘要:
A semiconductor device is provided with a first insulating film, a first wiring layer formed in the first insulating film, a second insulating film formed above the first wiring layer and the first insulating film, the second insulating film including a low dielectric constant film, a second wiring layer formed in the second insulating film and coupled to the first wiring layer through a first connection section, and a third insulating film formed above the second wiring layer and the second insulating film and serving as one of an interlayer insulating film and a passivation film, and at least one of the first and third insulating films being one of a film formed mainly of SiON, a film formed mainly of SiN, and a laminated film being the films formed mainly of SiON or SiN respectively.