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公开(公告)号：US20190273357A1
公开(公告)日：2019-09-05
申请号：US16286022
申请日：2019-02-26
Applicant: NICHIA CORPORATION
Inventor： Tomohiko HATANO , Daisuke SATO
Abstract: A light emitting module includes a light emitting device including first to sixth electrodes and a holder including first to sixth terminals. An insulator body of the holder at least partially surrounds the light emitting device in a plan view with the light emitting device being interposed between a first inner edge and a second inner edge of the insulator body, and a third inner edge linking the first and second inner edges. The first terminal projects from a third inner edge and is connected to the first electrode. The second and third terminals project from the first inner edge and are connected to the second and third electrodes, respectively. The fourth terminal projects from the third inner edge and connected to the fourth electrode. The fifth and sixth terminals project from the second inner edge and are connected to the fifth and sixth electrodes, respectively.
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公开(公告)号：US20180198038A1
公开(公告)日：2018-07-12
申请号：US15909877
申请日：2018-03-01
Applicant: NICHIA CORPORATION
Inventor： Daisuke SATO , Atsushi HASHIZUME , Toshiki NISHIHAMA , Shimpei MAEDA
Abstract: A method of manufacturing a light emitting device, includes providing a light emitting element having an element upper surface, an element lower surface opposite to the element upper surface in a thickness direction of the light emitting element, and an element side surface between the element upper surface and the element lower surface. A wavelength converter having a converter lower surface is provided. The wavelength converter is joined to the light emitting element using an adhesive so that the converter lower surface faces the element upper surface. The converter lower surface has an exposed region that does not face the element upper surface viewed along the thickness direction. The adhesive covers the element side surface and the exposed region.
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公开(公告)号：US20160093777A1
公开(公告)日：2016-03-31
申请号：US14870009
申请日：2015-09-30
Applicant: NICHIA CORPORATION
Inventor： Daisuke SATO , Atsushi HASHIZUME , Toshiki NISHIHAMA , Shimpei MAEDA
CPC classification number: H01L33/505 , H01L25/167 , H01L33/504 , H01L33/508 , H01L33/52 , H01L33/58 , H01L33/60 , H01L2224/16225 , H01L2224/73253 , H01L2924/0002 , H01L2924/10155 , H01L2924/181 , H01L2933/0041 , H01L2933/0058 , H01L2924/00012 , H01L2924/00
Abstract: The light emitting device includes a light emitting element, a wavelength converter, and a light guider. The light emitting element has an element upper surface, an element lower surface, and an element side surface. The wavelength converter has a converter lower surface. The wavelength is provided to be connected to the light emitting element. The converter lower surface has an exposed region that does not face the element upper surface. The light guider guides light from the light emitting element to the wavelength converter. The light guider covers the element side surface and the exposed region. The wavelength converter includes first and second wavelength converter parts. The first wavelength converter part faces the element upper surface and has a first thickness. The second wavelength converter part does not face the element upper surface and has a second thickness thinner than the first thickness.
Abstract translation: 发光器件包括发光元件，波长转换器和光引导器。 发光元件具有元件上表面，元件下表面和元件侧表面。 波长转换器具有转换器下表面。 提供波长以连接到发光元件。 转换器下表面具有不面向元件上表面的暴露区域。 光导向器将来自发光元件的光引导到波长转换器。 导光板覆盖元件侧表面和暴露区域。 波长转换器包括第一和第二波长转换器部分。 第一波长转换器部分面向元件上表面并具有第一厚度。 第二波长转换器部分不面对元件上表面，并且具有比第一厚度薄的第二厚度。
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公开(公告)号：US20240021771A1
公开(公告)日：2024-01-18
申请号：US18350619
申请日：2023-07-11
Applicant: NICHIA CORPORATION
Inventor： Daisuke SATO
CPC classification number: H01L33/62 , H01L33/502 , H01L33/486 , H01L33/08 , H01L2933/0033
Abstract: A light-emitting device includes a base member, a frame member and a light-emitting element. The frame member is fixed to the base member and has one or more inner lateral surfaces and one or more outer lateral surfaces. The frame member includes a first part containing a wavelength conversion material and defining one part of the one or more inner lateral surfaces and one part of the one or more outer lateral surfaces, and a second part connected with the first part and defining another part of the one or more inner lateral surfaces and another part of the one or more outer lateral surfaces. The light emitting element has a light-emitting surface, and is configured to emit, from the light-emitting surface, light to be incident on the one part of the one or more inner lateral surfaces defined by the first part of the frame member.
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公开(公告)号：US20220102936A1
公开(公告)日：2022-03-31
申请号：US17483375
申请日：2021-09-23
Applicant: NICHIA CORPORATION
Inventor： Daisuke SATO
IPC: H01S5/02208 , H01S5/40 , F21K9/68 , F21K9/64
Abstract: A light emitting device includes: a base portion comprising: an upward-facing surface, and a frame defining an inner lateral surface; a plurality of semiconductor laser elements arranged on the upward-facing surface and surrounded by the frame; a cover portion supported by the frame and disposed above the plurality of semiconductor laser elements; and a protrusion extending from a lower surface of the cover portion toward the upward-facing surface. Light emitted from each of the plurality of semiconductor laser elements is incident on a lateral surface of the protrusion, passes through the protrusion, is reflected at the boundary surface, and is transmitted through the cover portion.
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Patent Agency Ranking
公开(公告)号：US20170125649A1
公开(公告)日：2017-05-04
申请号：US15403179
申请日：2017-01-11
Applicant: NICHIA CORPORATION
Inventor： Daisuke SATO , Atsushi HASHIZUME , Toshiki NISHIHAMA , Shimpei MAEDA
CPC classification number: H01L33/505 , H01L25/167 , H01L33/504 , H01L33/508 , H01L33/52 , H01L33/58 , H01L33/60 , H01L2224/16225 , H01L2224/73253 , H01L2924/0002 , H01L2924/10155 , H01L2924/181 , H01L2933/0041 , H01L2933/0058 , H01L2924/00012 , H01L2924/00
Abstract: A light emitting device includes a light emitting element, a wavelength converter, a light transmissive member, a light guider, and a light transmitting layer. The light emitting element has an element upper surface, an element lower surface, and an element side surface. The wavelength converter has a converter lower surface. The wavelength is provided to be connected to the light emitting element such that the converter lower surface faces the element upper surface. The converter lower surface has an exposed region that does not face the element upper surface. The light guider guides light from the light emitting element to the wavelength converter. The light guider covers the element side surface and the exposed region. The wavelength converter has a converter upper surface. The light transmitting layer has a layer lower surface facing the converter upper surface. The converter upper surface is smaller than the layer lower surface.
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公开(公告)号：US20140131753A1
公开(公告)日：2014-05-15
申请号：US14074084
申请日：2013-11-07
Applicant: NICHIA CORPORATION
Inventor： Masashi ISHIDA , Daisuke SATO , Tadayuki KITAJIMA
IPC: H01L33/60
CPC classification number: H01L23/31 , H01L23/28 , H01L23/3135 , H01L24/97 , H01L25/0753 , H01L33/48 , H01L33/483 , H01L33/502 , H01L33/505 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/60 , H01L2224/16225 , H01L2224/73253 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/00
Abstract: A manufacturing method of a light emitting device includes a light emitting element disposed over a substrate and a reflective resin disposed along the side surface of the light emitting element. The method includes disposing light emitting elements in a matrix over an aggregate substrate, and disposing a semiconductor element between the adjacent light emitting elements in one direction of column and row directions of the light emitting elements in the matrix. A reflective resin is disposed to cover the semiconductor elements along the side surfaces of the light emitting elements and the side surfaces of the phosphor layers. The reflective resin and the substrate disposed in between the adjacent light emitting elements is cut in the column or row direction and between the light emitting element and the adjacent semiconductor element in the other direction, to include a light emitting element or a semiconductor element.
Abstract translation: 发光器件的制造方法包括设置在基板上的发光元件和沿着发光元件的侧表面设置的反射树脂。 该方法包括将矩阵中的发光元件设置在聚集衬底上，并且在矩阵中的发光元件的列和行方向的一个方向上在相邻的发光元件之间设置半导体元件。 反射树脂设置成沿着发光元件的侧表面和荧光体层的侧表面覆盖半导体元件。 设置在相邻的发光元件之间的反射树脂和基板在列或行方向上以及在另一方向上在发光元件和相邻的半导体元件之间被切割以包括发光元件或半导体元件。
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公开(公告)号：US20190195440A1
公开(公告)日：2019-06-27
申请号：US16201707
申请日：2018-11-27
Applicant: NICHIA CORPORATION
Inventor： Daisuke SATO
IPC: F21K9/64 , H01S5/0683 , H01S5/042 , H01S5/06
CPC classification number: F21K9/64 , F21Y2115/30 , H01S5/0428 , H01S5/0609 , H01S5/0683
Abstract: A method for detecting abnormality in a light emitting device including a semiconductor laser element that is pulse-driven by pulse-control to emit excitation light, a wavelength conversion member including a phosphor and that emits fluorescent light by being irradiated with the excitation light, and a light receiving element disposed on a light extraction side of the wavelength conversion member and that detects the excitation light, the method includes: pulse-controlling an applied voltage with a pulse width shorter than a time from a start of voltage application until an optical intensity of light extracted from the wavelength conversion member reaches a maximum intensity, thereby pulse-driving the semiconductor laser element to achieve laser oscillation; measuring an optical intensity of the excitation light, or optical intensities of both the excitation light and the fluorescent light; and determining whether or not the optical intensity or the optical intensities falls within a prescribed range.
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9.发明申请公开(公告)号：US20150340577A1
公开(公告)日：2015-11-26
申请号：US14815742
申请日：2015-07-31
Applicant: NICHIA CORPORATION
Inventor： Masashi ISHIDA , Daisuke SATO , Tadayuki KITAJIMA
CPC classification number: H01L23/31 , H01L23/28 , H01L23/3135 , H01L24/97 , H01L25/0753 , H01L33/48 , H01L33/483 , H01L33/502 , H01L33/505 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/60 , H01L2224/16225 , H01L2224/73253 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/00
Abstract: A manufacturing method of a light emitting device includes a light emitting element disposed over a substrate and a reflective resin disposed along the side surface of the light emitting element. The method includes disposing light emitting elements in a matrix over an aggregate substrate, and disposing a semiconductor element between the adjacent light emitting elements in one direction of column and row directions of the light emitting elements in the matrix. A reflective resin is disposed to cover the semiconductor elements along the side surfaces of the light emitting elements and the side surfaces of the phosphor layers. The reflective resin and the substrate disposed in between the adjacent light emitting elements is cut in the column or row direction and between the light emitting element and the adjacent semiconductor element in the other direction, to include a light emitting element or a semiconductor element.
Abstract translation: 发光器件的制造方法包括设置在基板上的发光元件和沿着发光元件的侧表面设置的反射树脂。 该方法包括将矩阵中的发光元件设置在聚集衬底上，并且在矩阵中的发光元件的列和行方向的一个方向上在相邻的发光元件之间设置半导体元件。 反射树脂设置成沿着发光元件的侧表面和荧光体层的侧表面覆盖半导体元件。 设置在相邻的发光元件之间的反射树脂和基板在列或行方向上以及在另一方向上在发光元件和相邻的半导体元件之间被切割以包括发光元件或半导体元件。
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公开(公告)号：US20200161828A1
公开(公告)日：2020-05-21
申请号：US16748318
申请日：2020-01-21
Applicant: NICHIA CORPORATION
Inventor： Tomohiko HATANO , Daisuke SATO
Abstract: A light emitting module includes a light emitting device, a heat dissipating plate, and a holder. The light emitting device has a light extraction window and a plurality of electrodes. The light emitting device is secured to the heat dissipating plate. The heat dissipating plate is secured to the holder. The holder includes a plurality of terminals respectively connected to the electrodes of the light emitting device. The heat dissipating plate includes an exposed portion exposed from the holder when viewed from a side of the light emitting module on which the light extraction window of the light emitting device is provided.
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