公开(公告)号：US12013089B2

公开(公告)日：2024-06-18

申请号：US18352571

申请日：2023-07-14

Applicant: NICHIA CORPORATION

Inventor： Satoshi Shichijo ,  Tatsuya Hayashi ,  Yusuke Hayashi ,  Masahiro Okazaki

IPC: F21K9/64 ,  F21K9/68 ,  F21S41/176 ,  F21Y115/10

CPC classification number: F21K9/64 ,  F21K9/68 ,  F21S41/176 ,  F21Y2115/10

Abstract: A light-emitting device includes a light-emitting element, a light-transmissive member, and a light adjustment member. The light adjustment member exposes a first upper surface and covers a second upper surface and a first lateral surface of the light-transmissive member. The light-transmissive member has a thickness from a lower surface to the first upper surface larger than a thickness from the lower surface to the second upper surface. In a plan view, first and second light-emitting regions have the first and second upper surfaces of the light-transmissive member, respectively, and an area of the second light-emitting region is in a range from 35% to 95% of an area of a light-emitting region. A boundary between the first and second light-emitting regions includes first and second points on a perimeter of a light-emitting region, and a straight line connecting the first and second points extends across the light-emitting region.

公开(公告)号：US11735688B2

公开(公告)日：2023-08-22

申请号：US17234147

申请日：2021-04-19

Applicant: NICHIA CORPORATION

Inventor： Satoshi Shichijo ,  Harunobu Sagawa

IPC: H01L33/00 ,  H01L33/18 ,  H01L33/50

CPC classification number: H01L33/0095 ,  H01L33/18 ,  H01L33/502 ,  H01L2933/0033 ,  H01L2933/0041

Abstract: A method of manufacturing a light emitting device includes: bonding a light emitting element and a light transmissive member by a surface activated bonding method, which includes: activating a first bonding surface of the light emitting element to which the light transmissive member is to be bonded, by irradiating at least the first bonding surface with an ion beam, activating a second bonding surface of the light transmissive member to which the light emitting element is to be bonded, by irradiating at least the second bonding surface with an ion beam, and joining the light emitting element and the light transmissive member by bringing the activated first bonding surface and the activated second bonding surface into contact.

公开(公告)号：US11024770B2

公开(公告)日：2021-06-01

申请号：US16123274

申请日：2018-09-06

Applicant: NICHIA CORPORATION

Inventor： Satoshi Shichijo ,  Hiroki Fukuta ,  Kunihito Sugimoto ,  Yasuhiro Miki ,  Koichi Takenaga

IPC: H01L33/38 ,  H01L23/532 ,  H01L33/10 ,  H01L33/62 ,  H01L33/40 ,  H01L33/32 ,  H01L33/50 ,  H01L33/54 ,  H01L33/44

Abstract: A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, and first and second external connection parts. The first semiconductor layer is exposed from the light emitting layer and the second semiconductor layer at exposed portions arranged in columns each extending in a first direction. The insulating film defines openings respectively located above the exposed portions. The first electrode is connected to the first semiconductor layer through the openings and covers a part of the second semiconductor layer via the insulating film. The first external connection part is connected to the first electrode and spaced apart from the exposed portions in the plan view. The first external connection part has a shape elongated in the first direction between adjacent ones of the columns of the exposed portions. The second external connection part is connected to the second semiconductor layer via the second electrode.

公开(公告)号：US09947848B2

公开(公告)日：2018-04-17

申请号：US14795892

申请日：2015-07-10

Applicant: NICHIA CORPORATION

Inventor： Masahiro Sakamoto ,  Kazuhide Yanasaka ,  Satoshi Shichijo

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56 ,  H01L33/64

CPC classification number: H01L33/62 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56 ,  H01L33/64 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265

Abstract: A semiconductor light emitting device includes a lead frame 1 covered by a resin package 2. The lead frame 1 includes first and second leads 1A and 1B facing each other. The first and second leads 1A and 1B include inner lead sections 11 and 12 covered with the package 2, respectively. The first and second leads 1A and 1B include outer lead sections 13 protruding from package 2 ends. First and second exposed surfaces 51 and 52 are exposed from the package 2 in the first and second lead lower surfaces, respectively. The first lead 1A is longer than the second lead 1B. An LED 3 is mounted on the first lead upper surface. The second lead 1B includes second end portions 15 extending in the second exposed surface 52 from the both ends of the facing surface toward the first lead 1A.

公开(公告)号：US12078343B2

公开(公告)日：2024-09-03

申请号：US18451215

申请日：2023-08-17

Applicant: NICHIA CORPORATION

Inventor： Yusuke Hayashi ,  Satoshi Shichijo ,  Hiroki Fukuta

IPC: F21V9/30 ,  F21V7/04

CPC classification number: F21V9/30 ,  F21V7/04

Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a first wavelength conversion member disposed on the light emitting element and having a lower surface bonded to the light emitting element, an upper surface opposite the lower surface, and a lateral surface that meets the upper surface; a first light reflecting member disposed on an upper surface of the substrate and covering lateral surfaces of the light emitting element; and a second wavelength conversion member disposed on the first light reflecting member, on the upper surface of the substrate, and on the lateral surface of the first wavelength conversion member without covering the upper surface of the first wavelength conversion member.

公开(公告)号：US11417811B2

公开(公告)日：2022-08-16

申请号：US16717305

申请日：2019-12-17

Applicant: NICHIA CORPORATION

Inventor： Koichi Takenaga ,  Takanori Fukumori ,  Satoshi Shichijo ,  Hiroki Fukuta ,  Kunihito Sugimoto

IPC: H01L33/62 ,  H01L33/32 ,  H01L33/44 ,  H01L33/38 ,  H01L33/60 ,  H01L33/00 ,  H01L33/56 ,  H01L33/40 ,  H01L33/64 ,  H01L27/15 ,  H01L33/20 ,  H01L25/075

Abstract: A light emitting element includes a semiconductor stacked body, an insulating film, first and second electrodes, a second external connection portion, and first external connection portions. The first semiconductor layer is exposed at a plurality of exposed portions disposed in a plurality of rows in plan view. The first external connection portions include at least one smaller-size first external connection portion disposed between adjacent ones of the rows other than the outermost one of the rows, and at least one larger-size first external connection portion extending from the end region, in which a spacing between a first outer edge of a second semiconductor layer and the exposed portions in the outermost one of the rows is narrower than a spacing between the exposed portions in adjacent ones of the rows, to at least a position between the outermost one of the rows and an adjacent one of the rows.

公开(公告)号：US09780258B2

公开(公告)日：2017-10-03

申请号：US15216321

申请日：2016-07-21

Applicant: NICHIA CORPORATION

Inventor： Satoshi Shichijo ,  Kunihito Sugimoto ,  Kenji Ozeki ,  Shogo Abe

IPC: H01L33/20 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/20 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/505 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes a base member; a light emitting element mounted on the base member; a light-transmissive member that covers an upper surface of the light emitting element, and is substantially rectangular in a plan view; and a light reflecting member that covers a lateral surface of the light-transmissive member, the light reflecting member having a substantially rectangular frame shape in a plan view. A width of the light reflecting member is smaller along a short side of the light-transmissive member than along a long side of the light-transmissive member. A height of the light reflecting member is smaller along the short side of the light-transmissive member than along the long side of the light-transmissive member at a position separated from an outer edge of the light reflecting member by a predetermined distance.

公开(公告)号：US11767967B2

公开(公告)日：2023-09-26

申请号：US18068175

申请日：2022-12-19

Applicant: NICHIA CORPORATION

Inventor： Yusuke Hayashi ,  Satoshi Shichijo ,  Hiroki Fukuta

IPC: F21V9/30 ,  F21V7/04

CPC classification number: F21V9/30 ,  F21V7/04

Abstract: A light emitting device includes: a light emitting element configured to emit first light; a first wavelength conversion member disposed on the light emitting element and having a lower surface bonded to the light emitting element, an upper surface, and a lateral surface that meets the upper surface, the first wavelength conversion member being configured to emit second light when excited by the first light; a second wavelength conversion member covering the lateral surface of the first wavelength conversion member without covering the upper surface of the first wavelength conversion member, the second wavelength conversion member having an oblique surface extending outward from the lateral surface of the first wavelength conversion member, the second wavelength conversion member being configured to emit third light when excited by at least one of the first light and the second light; and a first light reflecting member covering the oblique surface.

公开(公告)号：US11011671B2

公开(公告)日：2021-05-18

申请号：US16440894

申请日：2019-06-13

Applicant: NICHIA CORPORATION

Inventor： Satoshi Shichijo ,  Harunobu Sagawa

IPC: H01L33/00 ,  H01L33/18 ,  H01L33/50

Abstract: A light emitting device includes: a light emitting element; and a light transmissive member bonded to an emission surface of the light emitting element; wherein the light emitting element and the light transmissive member are bonded via a bonding portion that comprises a portion of the light emitting element and a portion of the light transmissive member; wherein the bonding portion contains at least one rare gas element selected from the group consisting of He, Ne, Ar, and Kr; and wherein a peak of a rare gas element distribution is positioned away from the emission surface in at least one of the light emitting element and the light transmissive member.

公开(公告)号：US10367129B2

公开(公告)日：2019-07-30

申请号：US15620730

申请日：2017-06-12

Applicant: NICHIA CORPORATION

Inventor： Satoshi Shichijo ,  Kunihito Sugimoto

IPC: H01L25/16 ,  H01L27/15 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L25/075

Abstract: A light emitting device includes a mounting board including: a base part, and one or more wiring structures, each of which includes one or more first wiring parts, and one or more second wiring parts, in that order, from a base part side, wherein, in a plan view, an area of each of the one or more second wiring parts is smaller than an area of each of the one or more first wiring parts; one or more light emitting elements bonded to the second wiring parts via bonding members; and a reflective member covering at least a portion of the bonding members and at least a portion of the one or more wiring structures. A reflectance of the one or more first wiring parts is higher than a reflectance of the bonding members. The one or more second wiring parts and the bonding members comprise the same material at their outermost surfaces.