公开(公告)号：US20110186901A1

公开(公告)日：2011-08-04

申请号：US12875566

申请日：2010-09-03

申请人： Naoya Ushiyama ,  Kazuhisa Iwashita ,  Tatsuo Tonedachi ,  Teruo Takeuchi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Gen Watari ,  Satoshi Shimizu

发明人： Naoya Ushiyama ,  Kazuhisa Iwashita ,  Tatsuo Tonedachi ,  Teruo Takeuchi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Gen Watari ,  Satoshi Shimizu

IPC分类号： H01L33/48

CPC分类号： H01L33/48 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.

摘要翻译： 根据一个实施例，LED封装包括第一引线框架，第二引线框架，LED芯片，线材和树脂体。 第一引线框架和第二引线框架彼此之间具有空间。 LED芯片设置在第一引线框架和第二引线框架的上方。 LED芯片具有连接到第一引线框架的第一端子和连接到第二引线框架的第二端子。 线将第一端子连接到第一引线框架。 树脂体覆盖LED芯片以及第一引线框架和第二引线框架的每个的顶表面，底表面的一部分和边缘表面的一部分。 每个底表面的剩余部分和每个边缘表面的剩余部分被暴露。 由LED芯片的顶表面形成的芯片侧角和从第一端子拔出线的方向小于由第一引线框架的顶表面形成的框架侧角以及线的方向 从第一引线框架提取。

公开(公告)号：US08497521B2

公开(公告)日：2013-07-30

申请号：US12875566

申请日：2010-09-03

申请人： Naoya Ushiyama ,  Kazuhisa Iwashita ,  Tatsuo Tonedachi ,  Teruo Takeuchi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Gen Watari ,  Satoshi Shimizu

发明人： Naoya Ushiyama ,  Kazuhisa Iwashita ,  Tatsuo Tonedachi ,  Teruo Takeuchi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Gen Watari ,  Satoshi Shimizu

IPC分类号： H01L33/00

CPC分类号： H01L33/48 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.

摘要翻译： 根据一个实施例，LED封装包括第一引线框架，第二引线框架，LED芯片，线材和树脂体。 第一引线框架和第二引线框架彼此之间具有空间。 LED芯片设置在第一引线框架和第二引线框架的上方。 LED芯片具有连接到第一引线框架的第一端子和连接到第二引线框架的第二端子。 线将第一端子连接到第一引线框架。 树脂体覆盖LED芯片以及第一引线框架和第二引线框架的每个的顶表面，底表面的一部分和边缘表面的一部分。 每个底表面的剩余部分和每个边缘表面的剩余部分被暴露。 由LED芯片的顶表面形成的芯片侧角和从第一端子拔出线的方向小于由第一引线框架的顶表面形成的框架侧角以及线的方向 从第一引线框架提取。

公开(公告)号：US20110186868A1

公开(公告)日：2011-08-04

申请号：US12886911

申请日：2010-09-21

申请人： Gen Watari ,  Satoshi Shimizu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi ,  Iwao Matsumoto

发明人： Gen Watari ,  Satoshi Shimizu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi ,  Iwao Matsumoto

IPC分类号： H01L33/50 ,  H01L33/62

CPC分类号： H01L24/49 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/05599 ,  H01L2224/4554

摘要： According to one embodiment, an LED package includes a first and a second lead frame, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and has one terminal connected to the first lead frame and another terminal connected to the second lead frame. The wire connects the one terminal to the first lead frame. The resin body covers the first and second lead frames, the LED chip, and the wire. The first lead frame includes a base portion and a plurality of extending portions. As viewed from above, a bonding position of the wire is located inside one of polygonal regions connecting between roots of the two or more of the extending portions. An appearance of the resin body is a part of an appearance of the LED package.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框彼此分开。 LED芯片设置在第一和第二引线框架的上方，并且具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。 线将一个端子连接到第一引线框架。 树脂体覆盖第一和第二引线框架，LED芯片和导线。 第一引线框架包括基部和多个延伸部分。 从上方观察，线的接合位置位于连接两个或更多个延伸部分的根部的多边形区域之一内。 树脂体的外观是LED封装的外观的一部分。

公开(公告)号：US20110186900A1

公开(公告)日：2011-08-04

申请号：US12849102

申请日：2010-08-03

申请人： Gen Watari ,  Satoshi Shimizu ,  Mami Yamamoto ,  Hidenori Egoshi ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi

发明人： Gen Watari ,  Satoshi Shimizu ,  Mami Yamamoto ,  Hidenori Egoshi ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi

IPC分类号： H01L33/52 ,  H01L33/62

CPC分类号： H01L24/97 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，并且LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。 此外，树脂体覆盖第一和第二引线框架和LED芯片，并且具有表面粗糙度为0.15μm以上的上表面和具有高于上表面的表面粗糙度的表面粗糙度的侧表面。

公开(公告)号：US08525202B2

公开(公告)日：2013-09-03

申请号：US12849102

申请日：2010-08-03

申请人： Gen Watari ,  Satoshi Shimizu ,  Mami Yamamoto ,  Hidenori Egoshi ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi

发明人： Gen Watari ,  Satoshi Shimizu ,  Mami Yamamoto ,  Hidenori Egoshi ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi

IPC分类号： H01L33/00

CPC分类号： H01L24/97 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框架彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，并且LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。 此外，树脂体覆盖第一和第二引线框架和LED芯片，并且具有表面粗糙度为0.15μm或更高的上表面和具有高于上表面的表面粗糙度的表面粗糙度的侧表面。

公开(公告)号：US08338845B2

公开(公告)日：2012-12-25

申请号：US12868107

申请日：2010-08-25

申请人： Gen Watari ,  Satoshi Shimizu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi

发明人： Gen Watari ,  Satoshi Shimizu ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi

IPC分类号： H01L33/00 ,  H01L27/15 ,  H01L31/12 ,  H01L29/04 ,  H01L31/036

CPC分类号： H01L33/48 ,  H01L24/97 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are made of a metal material, and disposed to be apart from each other. The LED chip is provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame. The resin body is made of a resin material having a shore D hardness of 25 or higher. In addition, the resin body covers the first and second lead frames and the LED chip. And, an appearance of the resin body is an appearance of the LED package.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一引线框架和第二引线框架由金属材料制成，并且彼此分开设置。 LED芯片设置在第一引线框架和第二引线框架之上，LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。 树脂体由肖氏D硬度为25以上的树脂材料制成。 此外，树脂体覆盖第一和第二引线框架和LED芯片。 并且，树脂体的外观是LED封装的外观。

公开(公告)号：US08319320B2

公开(公告)日：2012-11-27

申请号：US12874406

申请日：2010-09-02

申请人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Tatsuo Tonedachi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Naoya Ushiyama

发明人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Tatsuo Tonedachi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Naoya Ushiyama

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package.

摘要翻译： 根据一个实施例，LED模块包括板，互连和LED封装。 互连形成在板的上表面上。 LED封装安装在电路板上。 LED封装包括彼此分开布置的第一和第二引线框架，并且连接到彼此绝缘的互连部分。 LED封装包括设置在第一引线框架和第二引线框架之上的LED芯片。 LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一端子。 此外，LED封装包括覆盖第一引线框架和第二引线框架中的每一个的上表面，下表面和边缘表面的树脂体，还覆盖LED芯片，但是暴露下表面的剩余部分和 边缘表面。 并且，树脂体的外观是LED封装的外观。

公开(公告)号：US20110193112A1

公开(公告)日：2011-08-11

申请号：US12874406

申请日：2010-09-02

申请人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Tatsuo Tonedachi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Naoya Ushiyama

发明人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Tatsuo Tonedachi ,  Hiroaki Oshio ,  Tetsuro Komatsu ,  Naoya Ushiyama

IPC分类号： H01L33/62

CPC分类号： H01L24/97 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package.

摘要翻译： 根据一个实施例，LED模块包括板，互连和LED封装。 互连形成在板的上表面上。 LED封装安装在电路板上。 LED封装包括彼此分开布置的第一和第二引线框架，并且连接到彼此绝缘的互连部分。 LED封装包括设置在第一引线框架和第二引线框架之上的LED芯片。 LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一端子。 此外，LED封装包括覆盖第一引线框架和第二引线框架中的每一个的上表面，下表面和边缘表面的树脂体，还覆盖LED芯片，但是暴露下表面的剩余部分和 边缘表面。 并且，树脂体的外观是LED封装的外观。

公开(公告)号：US08686464B2

公开(公告)日：2014-04-01

申请号：US13053525

申请日：2011-03-22

申请人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Gen Watari ,  Tetsuro Komatsu ,  Tatsuo Tonedachi

发明人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Gen Watari ,  Tetsuro Komatsu ,  Tatsuo Tonedachi

IPC分类号： H01L33/48

CPC分类号： H01L33/486 ,  H01L24/73 ,  H01L24/97 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： According to one embodiment, an LED module includes a substrate, an interconnect layer, a light emitting diode (LED) package, and a reflection member. The interconnect layer is provided on the substrate. The LED package is mounted on the interconnect layer. The reflection member is provided on a region in the substrate where the LED package is not mounted and has a property of reflecting light emitted from the LED package. The LED package includes a first lead frame, a second lead frame, an LED chip, and a resin body. The first lead frame and the second lead frame are arranged apart from each other on the same plane. The LED chip is provided above the first lead frame and the second lead frame, with one terminal connected to the first lead frame and one other terminal connected to the second lead frame. The resin body covers the LED chip, covers an upper surface, a part of a lower surface, and a part of an end surface of each of the first lead frame and the second lead frame, and exposes a remaining part of the lower surface and a remaining part of the end surface.

摘要翻译： 根据一个实施例，LED模块包括衬底，互连层，发光二极管（LED）封装和反射构件。 互连层设置在基板上。 LED封装安装在互连层上。 反射构件设置在基板中未安装LED封装的区域上，具有反射从LED封装件发出的光的性质。 LED封装包括第一引线框架，第二引线框架，LED芯片和树脂体。 第一引线框架和第二引线框架在同一平面上彼此分开布置。 LED芯片设置在第一引线框架和第二引线框架的上方，其中一个端子连接到第一引线框架，另一个端子连接到第二引线框架。 所述树脂体覆盖所述LED芯片，覆盖所述第一引线框架和所述第二引线框架的上表面，下表面的一部分和端面的一部分，并且暴露所述下表面的剩余部分， 端面的剩余部分。

公开(公告)号：US20120132931A1

公开(公告)日：2012-05-31

申请号：US13053525

申请日：2011-03-22

申请人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Gen Watari ,  Tetsuro Komatsu ,  Tatsuo Tonedachi

发明人： Kazuhiro Inoue ,  Kazuhisa Iwashita ,  Teruo Takeuchi ,  Gen Watari ,  Tetsuro Komatsu ,  Tatsuo Tonedachi

IPC分类号： H01L33/08 ,  H01L33/60

CPC分类号： H01L33/486 ,  H01L24/73 ,  H01L24/97 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： According to one embodiment, an LED module includes a substrate, an interconnect layer, a light emitting diode (LED) package, and a reflection member. The interconnect layer is provided on the substrate. The LED package is mounted on the interconnect layer. The reflection member is provided on a region in the substrate where the LED package is not mounted and has a property of reflecting light emitted from the LED package. The LED package includes a first lead frame, a second lead frame, an LED chip, and a resin body. The first lead frame and the second lead frame are arranged apart from each other on the same plane. The LED chip is provided above the first lead frame and the second lead frame, with one terminal connected to the first lead frame and one other terminal connected to the second lead frame. The resin body covers the LED chip, covers an upper surface, a part of a lower surface, and a part of an end surface of each of the first lead frame and the second lead frame, and exposes a remaining part of the lower surface and a remaining part of the end surface.

摘要翻译： 根据一个实施例，LED模块包括衬底，互连层，发光二极管（LED）封装和反射构件。 互连层设置在基板上。 LED封装安装在互连层上。 反射构件设置在基板中未安装LED封装的区域上，具有反射从LED封装件发出的光的性质。 LED封装包括第一引线框架，第二引线框架，LED芯片和树脂体。 第一引线框架和第二引线框架在同一平面上彼此分开布置。 LED芯片设置在第一引线框架和第二引线框架的上方，其中一个端子连接到第一引线框架，另一个端子连接到第二引线框架。 所述树脂体覆盖所述LED芯片，覆盖所述第一引线框架和所述第二引线框架的上表面，下表面的一部分和端面的一部分，并且暴露所述下表面的剩余部分， 端面的剩余部分。