HOME POT AND APPARATUS FOR TREATING SUBSTRATE

    公开(公告)号:US20230205103A1

    公开(公告)日:2023-06-29

    申请号:US18145480

    申请日:2022-12-22

    CPC classification number: G03F7/70975 B05C5/02 B08B3/02

    Abstract: The present invention provides a home pot. The home pot comprising: a housing having a cylindrical accommodation space of which the upper part is open and in which a nozzle tip can be accommodated, and has n injection flow paths formed on a sidewall in contact with the accommodation space; and a cleaning liquid supply portion provided in the housing and configured to supply a cleaning liquid to the n injection flow paths, and the n injection flow paths are disposed to be inclined with respect to the center of the accommodation space such that a high-speed swirling flow is generated in the accommodation space.

    Substrate processing apparatus and substrate processing method

    公开(公告)号:US10964557B2

    公开(公告)日:2021-03-30

    申请号:US16051059

    申请日:2018-07-31

    Abstract: The present disclosure relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus according to the exemplary embodiment of the present disclosure may include: a processing liquid supply tube; a nozzle unit which is supplied with a processing liquid from the processing liquid supply tube and discharges the processing liquid to the substrate; and a light source unit which is provided to irradiate the processing liquid discharged from the nozzle unit with ultraviolet rays. According to the present disclosure, the processing liquid, which is electrified while passing the processing liquid supply tube, is irradiated with ultraviolet rays, such that electricity is eliminated from the electrified processing liquid, and as a result, it is possible to minimize a problem that the substrate is contaminated by peripheral particles or arcing occurs on the substrate.

    Support unit and substrate treating apparatus

    公开(公告)号:US12237181B2

    公开(公告)日:2025-02-25

    申请号:US17703255

    申请日:2022-03-24

    Abstract: The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a cup having a treatment space therein; a support unit configured to support a substrate within the treatment space, and including a rotatable support plate; and a liquid discharge unit configured to discharge a chemical liquid to the substrate supported by the support unit, in which the support unit includes: a plurality of pin members provided to the support plate to support the substrate placed on the support plate; and a discharge member coupled to the pin member to discharge charges to the air according to a rotation of the support plate, and the discharge member is provided as a conductive member.

    Substrate processing apparatus and substrate processing method

    公开(公告)号:US12142493B2

    公开(公告)日:2024-11-12

    申请号:US17986894

    申请日:2022-11-15

    Abstract: A substrate processing apparatus includes: a nozzle unit configured to discharge a processing liquid to a substrate; a pipe connected to the nozzle unit and a processing liquid supply unit supplying the processing liquid; a charge amount control unit disposed at the pipe, including a filter unit charged with positive charges or negative charges, and including at least one of a control valve, controlling a flow rate of the processing liquid passing through an inside of the filter unit, and a power supply unit, applying a voltage to the filter unit, to control a charge amount of the processing liquid; and a control unit connected to the charge amount control unit.

    HETEROGENEOUS COMPOSITE MATERIAL AND METHOD FOR PRODUCING THE SAME

    公开(公告)号:US20210384064A1

    公开(公告)日:2021-12-09

    申请号:US17341696

    申请日:2021-06-08

    Abstract: A heterogeneous composite material and a method for manufacturing the heterogeneous composite material are provided. The heterogeneous composite material includes a first compression structure formed by compressing a first material, and a second compression structure formed by compressing a second material different from the first material, and disposed in close contact with the first compression structure, wherein at least a portion of the first compression structure and at least a portion of the second compression structure are disposed on both sides of a boundary surface existing in a circular shape with a predetermined radius with respect to a central axis in a state in contact with each other at the boundary surface.

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