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公开(公告)号:US11960236B2
公开(公告)日:2024-04-16
申请号:US18084381
申请日:2022-12-19
Applicant: SEMES CO., LTD.
Inventor: Young Jun Son , Tae Hoon Lee , Hyun Yoon , Do Yeon Kim
CPC classification number: G03G21/1842 , G03G15/0233 , G03G15/60 , G03G15/80 , G03G2215/0872 , G03G2221/0084 , G03G2221/1651
Abstract: Proposed are a home port and a substrate processing apparatus using the same. The home port is installed in the substrate processing apparatus to temporarily mount a nozzle for discharging a process liquid to a substrate, and includes a main body having a space therein, a nozzle holder provided at an upper portion of the main body and configured to mount the nozzle, an inclined surface formed below the nozzle holder in the space, a first supply pipe configured to discharge a rinse liquid to a tip of the nozzle, a second supply pipe configured to inject the rinse liquid into the main body, a conductive wire configured to electrically connect the inclined surface and the first supply pipe, and a first switch installed on the conductive wire.
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公开(公告)号:US11887883B2
公开(公告)日:2024-01-30
申请号:US17341696
申请日:2021-06-08
Applicant: SEMES CO., LTD.
Inventor: Do Yeon Kim , Pil Kyun Heo , Ho Jong Hwang , Hyun Yoon , Jong Min Lee , Chul Gyun Baik
IPC: B32B3/00 , H01L21/687 , B29C45/00 , B29C45/16 , B29K507/04 , B29K27/18
CPC classification number: H01L21/68757 , B29C45/0001 , B29C45/0055 , B29C45/16 , H01L21/68721 , B29K2027/18 , B29K2507/04
Abstract: A heterogeneous composite material and a method for manufacturing the heterogeneous composite material are provided. The heterogeneous composite material includes a first compression structure formed by compressing a first material, and a second compression structure formed by compressing a second material different from the first material, and disposed in close contact with the first compression structure, wherein at least a portion of the first compression structure and at least a portion of the second compression structure are disposed on both sides of a boundary surface existing in a circular shape with a predetermined radius with respect to a central axis in a state in contact with each other at the boundary surface.
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公开(公告)号:US20230205103A1
公开(公告)日:2023-06-29
申请号:US18145480
申请日:2022-12-22
Applicant: SEMES CO., LTD.
Inventor: Ho Jong HWANG , Do Yeon Kim
CPC classification number: G03F7/70975 , B05C5/02 , B08B3/02
Abstract: The present invention provides a home pot. The home pot comprising: a housing having a cylindrical accommodation space of which the upper part is open and in which a nozzle tip can be accommodated, and has n injection flow paths formed on a sidewall in contact with the accommodation space; and a cleaning liquid supply portion provided in the housing and configured to supply a cleaning liquid to the n injection flow paths, and the n injection flow paths are disposed to be inclined with respect to the center of the accommodation space such that a high-speed swirling flow is generated in the accommodation space.
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公开(公告)号:US10964557B2
公开(公告)日:2021-03-30
申请号:US16051059
申请日:2018-07-31
Applicant: SEMES CO., LTD.
Inventor: Do Yeon Kim , Jin Kyu Kim , Yoon Jong Ju , Min Sung Han , Joon Ho Won , Yong Tak Hyun
IPC: H01L21/67 , H01L21/687
Abstract: The present disclosure relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus according to the exemplary embodiment of the present disclosure may include: a processing liquid supply tube; a nozzle unit which is supplied with a processing liquid from the processing liquid supply tube and discharges the processing liquid to the substrate; and a light source unit which is provided to irradiate the processing liquid discharged from the nozzle unit with ultraviolet rays. According to the present disclosure, the processing liquid, which is electrified while passing the processing liquid supply tube, is irradiated with ultraviolet rays, such that electricity is eliminated from the electrified processing liquid, and as a result, it is possible to minimize a problem that the substrate is contaminated by peripheral particles or arcing occurs on the substrate.
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公开(公告)号:US12237181B2
公开(公告)日:2025-02-25
申请号:US17703255
申请日:2022-03-24
Applicant: SEMES CO., LTD.
Inventor: Ho Jong Hwang , Do Yeon Kim , Hyun Yoon
IPC: H01L21/67 , B08B3/02 , B08B3/04 , B08B3/08 , H01L21/687
Abstract: The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a cup having a treatment space therein; a support unit configured to support a substrate within the treatment space, and including a rotatable support plate; and a liquid discharge unit configured to discharge a chemical liquid to the substrate supported by the support unit, in which the support unit includes: a plurality of pin members provided to the support plate to support the substrate placed on the support plate; and a discharge member coupled to the pin member to discharge charges to the air according to a rotation of the support plate, and the discharge member is provided as a conductive member.
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公开(公告)号:US12142493B2
公开(公告)日:2024-11-12
申请号:US17986894
申请日:2022-11-15
Applicant: SEMES CO., LTD.
Inventor: Young Jun Son , Tae Hoon Lee , Sung Gyu Lee , Hyun Yoon , Do Yeon Kim
Abstract: A substrate processing apparatus includes: a nozzle unit configured to discharge a processing liquid to a substrate; a pipe connected to the nozzle unit and a processing liquid supply unit supplying the processing liquid; a charge amount control unit disposed at the pipe, including a filter unit charged with positive charges or negative charges, and including at least one of a control valve, controlling a flow rate of the processing liquid passing through an inside of the filter unit, and a power supply unit, applying a voltage to the filter unit, to control a charge amount of the processing liquid; and a control unit connected to the charge amount control unit.
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公开(公告)号:US11804371B2
公开(公告)日:2023-10-31
申请号:US16920418
申请日:2020-07-02
Applicant: SEMES CO., LTD.
Inventor: Do Yeon Kim , Se Hoon Oh , Won Geun Kim , Ju Mi Lee , Ho Jong Hwang , Pil Kyun Heo , Hyun Yoon , Choong Hyun Lee , Hyun Goo Park
CPC classification number: H01L21/02057 , H01L21/6715 , B05C11/08 , G03F7/162 , H01L21/02282 , H01L21/67051
Abstract: Provided is a substrate treatment apparatus including a treatment container equipped with a conductive member. The conductive member is made of a material having a lower resistivity than that of the treatment container. The conductive member prevents a rise of an electric potential of the treatment container, which is caused by charging during treatment of a substrate, thereby preventing the substrate from being contaminated and damaged by particles and electrostatic arcing.
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公开(公告)号:US11495467B2
公开(公告)日:2022-11-08
申请号:US17115313
申请日:2020-12-08
Applicant: SEMES CO., LTD.
Inventor: Jung Suk Goh , Jae Seong Lee , Do Youn Lim , Kuk Saeng Kim , Young Dae Chung , Tae Shin Kim , Jee Young Lee , Won Geun Kim , Ji Hoon Jeong , Kwang Sup Kim , Pil Kyun Heo , Yoon Ki Sa , Ye Rim Yeon , Hyun Yoon , Do Yeon Kim , Yong Jun Seo , Byeong Geun Kim , Young Je Um
IPC: H01L21/26 , H01L21/311 , H01L21/67 , H01L21/66
Abstract: Method and apparatus for etching a thin layer including silicon nitride formed on a substrate are disclosed. Etchant including phosphoric acid and water is supplied on the substrate so that a liquid layer is formed on the substrate. The thin layer is etched by reaction between the thin layer and the etchant. Thickness of the liquid layer is measured to detect variation in the thickness of the liquid layer while etching the thin layer. Variation in the concentration of the phosphoric acid and the water is calculated based on the variation in the thickness of the liquid layer. Water is supplied on the substrate based on the variation in the concentration of the phosphoric acid and the water so that the concentration of the phosphoric acid and the water becomes a predetermined value.
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公开(公告)号:US20210384064A1
公开(公告)日:2021-12-09
申请号:US17341696
申请日:2021-06-08
Applicant: SEMES CO., LTD.
Inventor: Do Yeon Kim , Pil Kyun Heo , Ho Jong Hwang , Hyun Yoon , Jong Min Lee , Chul Gyun Baik
IPC: H01L21/687 , B29C45/00 , B29C45/16
Abstract: A heterogeneous composite material and a method for manufacturing the heterogeneous composite material are provided. The heterogeneous composite material includes a first compression structure formed by compressing a first material, and a second compression structure formed by compressing a second material different from the first material, and disposed in close contact with the first compression structure, wherein at least a portion of the first compression structure and at least a portion of the second compression structure are disposed on both sides of a boundary surface existing in a circular shape with a predetermined radius with respect to a central axis in a state in contact with each other at the boundary surface.
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