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公开(公告)号：US20220367213A1
公开(公告)日：2022-11-17
申请号：US17745074
申请日：2022-05-16
Applicant: SEMES CO., LTD.
Inventor： Mi So PARK , Young Hun LEE , Young Seop CHOI , Jin Woo JUNG
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having an inner space therein; a fluid supply unit having a supply line configured to supply a treating fluid to the inner space and a fluid supply source configured to supply the treating fluid to the supply line; a first exhaust unit configured to exhaust the inner space; a second exhaust unit configured to exhaust the supply line; and a controller configured to control the fluid supply unit, the first exhaust unit, and the second exhaust unit, and wherein the controller controls the fluid supply unit and the second exhaust unit so a pressure of the supply line is maintained at a critical pressure of the treating fluid or above during at least a part of a standby step for keeping a substrate outside the inner space before introducing thereof into the inner space.
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公开(公告)号：US20220305530A1
公开(公告)日：2022-09-29
申请号：US17702127
申请日：2022-03-23
Applicant: SEMES CO., LTD.
Inventor： Jin Woo JUNG , Do Hyeon YOON , Young Hun LEE
Abstract: The inventive concept provides a substrate treating method. The substrate treating method comprising: a liquid treating step for cleaning a substrate by supplying a treating liquid to the substrate in a first process chamber; a transfer step for transferring the substrate to a second process chamber after the liquid treating step; and a drying step for removing the treating liquid remaining on the substrate in the second process chamber, and wherein the method further comprises a standby step of a liquid treated substrate to standby in the first process chamber when the liquid treated substrate of the liquid treating step cannot be transferred to the second process chamber, and at the standby step the treating liquid is discharged until the substrate can be transferred to the second process chamber.
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公开(公告)号：US20230201884A1
公开(公告)日：2023-06-29
申请号：US18068917
申请日：2022-12-20
Applicant: SEMES CO, LTD.
Inventor： Yong Hyun CHOI , Young Hun LEE , Seung Hoon OH , Mi So PARK , Tae Jong CHOI , Yong Sun KO , Jin Woo JUNG
CPC classification number: B08B3/022 , F26B5/005 , H01L21/02057
Abstract: The present invention provides a method for treating a substrate. The method for treating a substrate comprises: treating the substrate with liquid; and drying the liquid-treated substrate, and the liquid treatment step includes: a first liquid supply step of supplying a first liquid to an upper surface of the rotating substrate; and a second liquid supply step of supplying a second liquid to an upper surface of the rotating substrate, and in the second liquid supply step, a rotation speed of the substrate is adjusted such that the second liquid supplied on the substrate flows from a central region of the substrate to an edge region of the substrate.
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公开(公告)号：US20210202271A1
公开(公告)日：2021-07-01
申请号：US17137181
申请日：2020-12-29
Applicant: SEMES CO., LTD.
Inventor： Youngseop CHOI , Young Hun LEE , Jinwoo JUNG , Miso PARK
Abstract: Embodiments of the inventive concept provide an apparatus for treating a substrate. According to an exemplary embodiment, an apparatus for treating a substrate comprises a first valve and a second valve sequentially installed along a direction from a fluid supplying source to a high-pressure chamber in the supply line; a branch line branching from the supply line between the first valve and the second valve and connected to an exhaust line; a third valve installed on the branch line; an exhaust unit exhausting the process fluid inside the high-pressure chamber; and a controller, wherein the controller is configured to perform, before a transfer robot transfers the substrate to the high-pressure chamber for treating the substrate, a first operating of opening the first valve and closing the second valve and a third valve, and a second operating of closing the first valve and the second valve, and opening the third valve.
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公开(公告)号：US20250046631A1
公开(公告)日：2025-02-06
申请号：US18792709
申请日：2024-08-02
Applicant: SEMES CO., LTD.
Inventor： Young Hun LEE , Do Hyeon YOON , Eun Seok KIM
IPC: H01L21/67 , H01L21/677
Abstract: Disclosed is a substrate treating apparatus including: a treating chamber for treating a substrate; a transfer unit for loading and unloading the substrate into and from a treatment space in which the substrate is treated in the treating chamber; and a heating unit provided to be loaded into and unloaded from the treatment space, and for cleaning the treatment space by heating, in which the treating chamber includes: a chamber body providing the treatment space; and a support unit for supporting the substrate within the treatment space; and a fluid supply unit for supplying a fluid, which treats the substrate, into the treatment space, and the heating unit includes: a base; and a heater installed on the base.
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Patent Agency Ranking
公开(公告)号：US20230129923A1
公开(公告)日：2023-04-27
申请号：US17971734
申请日：2022-10-24
Applicant: SEMES CO., LTD.
Inventor： Jin Woo JUNG , Jin Mo JAE , Sang Min LEE , Young Hun LEE , Yong Hyun CHOI , Yong Joon IM , Seung Hoon OH
IPC: H01L21/687 , H01L21/67 , B08B3/04 , B08B13/00
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing for providing a treating space for treating a substrate within; a support unit for supporting the substrate in the treating space; a bottom supply port for supplying a process fluid to the treating space; and a filler member positioned below the substrate supported on the support unit in the treating space, and wherein the filler member forms a buffer space facing the bottom supply port, and a passage is formed between the filler member and an inner wall of the housing and flows the process fluid which is introduced to the buffer space in a direction of the substrate.
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7.发明申请公开(公告)号：US20180323064A1
公开(公告)日：2018-11-08
申请号：US15965000
申请日：2018-04-27
Applicant: SEMES CO., LTD.
Inventor： Jinwoo JUNG , Young Hun LEE
CPC classification number: H01L21/02101 , B08B3/08 , B08B7/0021 , B08B9/08 , H01L21/67051
Abstract: An apparatus and a method for cleaning a chamber are provided. A method for cleaning a chamber having a treatment space for treating a substrate includes cleaning the chamber by supplying a cleaning medium into the treatment space. The cleaning medium includes a supercritical fluid having a non-polar property and an organic solvent having a polar property. The cleaning efficiency of the chamber is improved with respect to a non-polar contaminant and a polar contaminant.
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8.发明申请公开(公告)号：US20250046597A1
公开(公告)日：2025-02-06
申请号：US18735356
申请日：2024-06-06
Applicant: SEMES CO., LTD.
Inventor： Hee Hwan KIM , Bok Kyu LEE , Young Hun LEE
Abstract: Disclosed is a method of treating a substrate, the method including: a first pre-wet operation of supplying a first pre-wet liquid to a rotating substrate; a second pre-wet operation of supplying a second pre-wet liquid having a temperature different from the first pre-wet liquid to the rotating substrate, the second pre-wet operation being performed after the first pre-wet operation; and a chemical treatment operation of supplying a chemical that is a liquid of a different type from the first pre-wet liquid and the second pre-wet liquid to the rotating substrate, the chemical treatment operation being performed after the second pre-wet operation.
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公开(公告)号：US20240145261A1
公开(公告)日：2024-05-02
申请号：US18407848
申请日：2024-01-09
Applicant: SEMES CO., LTD.
Inventor： Eui Sang LIM , Young Hun LEE , Jinwoo JUNG , Miso PARK , Byongwook AHN , Yong Hee LEE
CPC classification number: H01L21/67017 , H01J37/32449 , H01J37/32467 , H01J37/32715 , H01J37/32834 , H01J2237/334
Abstract: The apparatus includes a support unit to support the substrate in a treatment space of a process chamber, a first fluid supply unit to supply a supercritical fluid having an organic solvent dissolved in the supercritical fluid, to the treatment space, a second fluid supply unit to supply the supercritical fluid having no organic solvent dissolved in the supercritical fluid, to the treatment space, an exhaust unit to exhaust the treatment space, a controller to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit. The controller controls the first and second fluid supply units such that the supercritical fluid having no organic solvent dissolved in the supercritical fluid is supplied to the treatment space through the second fluid supply unit, after the supercritical fluid mixed with the organic solvent is supplied to the treatment space through the first fluid supply unit.
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公开(公告)号：US20240142171A1
公开(公告)日：2024-05-02
申请号：US18099388
申请日：2023-01-20
Applicant: SEMES CO., LTD.
Inventor： Seung Hoon OH , Ji Hyeong LEE , Jin Se PARK , Yong Joon IM , Young Hun LEE , Yong Sun KO
CPC classification number: F26B5/005 , F26B21/10 , F26B25/003 , F26B25/16 , G03F7/168
Abstract: A substrate treating apparatus of the present disclosure comprises: a chamber member having an accommodation space configured to accommodate a vessel part where a substrate treatment region constituting a supercritical treatment space are formed, and an opening configured to move the substrate inside or outside; a shutter configured to open or close the chamber member; and a first exhaust part configured to discharge an internal air from the accommodation space to the outside, wherein the temperature of the substrate treatment region is increased.
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