中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

14 records (took 0.039 seconds)

    PACKAGING MATERIAL AND MOLDED CASE
    1.
    发明申请
    PACKAGING MATERIAL AND MOLDED CASE 有权
    包装材料和模具

    公开(公告)号：US20150030910A1

    公开(公告)日：2015-01-29

    申请号：US14326615

    申请日：2014-07-09

    Applicant: Showa Denko Packaging Co., Ltd.

    Inventor： Yuji MINAMIBORI ,  Honglin WANG

    IPC: H01M2/02 ,  B29C51/08

    CPC classification number: H01M2/0287 ,  B29C51/08 ,  B29C51/14 ,  B29L2031/3468 ,  B32B33/00 ,  B32B37/12 ,  B32B2307/402 ,  B32B2311/00 ,  B32B2457/10 ,  H01M2/026 ,  H01M2/0262 ,  H01M2/1094 ,  Y10T428/25 ,  Y10T428/269 ,  Y10T428/31522 ,  Y10T428/31678

    Abstract: A packaging material 1 includes a heat resistant resin stretched film layer 2 as an outer layer, a thermoplastic resin layer 3 as an inner layer, a metal foil layer 4 arranged between these layers, and a colored ink layer 10 arranged between the metal foil layer 4 and the heat resistant resin stretched film layer 2. As the heat resistant resin stretched film, a heat resistant resin stretched film having a hot water shrinkage rate of 2% to 20% is used, and the heat resistant resin stretched film layer 2 and the colored ink layer 4 are integrally laminated via an easily adhesive layer 30. In this packaging material, at the time of forming and sealing, and even being used in a somewhat severe environment such as high-temperature and humid environment, the colored ink layer will not be detached from the heat resistant resin stretched film layer.

    Abstract translation: 包装材料1包括作为外层的耐热树脂拉伸膜层2，作为内层的热塑性树脂层3，布置在这些层之间的金属箔层4和布置在金属箔层之间的着色油墨层10 作为耐热性树脂拉伸膜，使用热水收缩率为2％〜20％的耐热性树脂拉伸膜，将耐热性树脂拉伸膜层2和 彩色油墨层4通过易粘合层30整体地层压。在该包装材料中，在形成和密封时甚至在诸如高温和潮湿环境的稍恶劣的环境中使用时，着色油墨层 不会与耐热树脂拉伸膜层分离。

    PACKAGING MATERIAL FOR MOLDING
    2.
    发明申请
    PACKAGING MATERIAL FOR MOLDING 有权

    公开(公告)号：US20210214594A1

    公开(公告)日：2021-07-15

    申请号：US17144147

    申请日：2021-01-08

    Applicant: SHOWA DENKO PACKAGING CO., LTD.

    Inventor： Keitaro KAWAKITA ,  Yuji MINAMIBORI

    IPC: C09J175/06 ,  B32B7/12 ,  B32B15/20 ,  B32B27/32 ,  B32B15/085 ,  B32B27/34 ,  B32B15/088 ,  H01M50/133 ,  H01M50/129 ,  H01M50/119 ,  H01M50/121

    Abstract: A packaging material for molding includes a heat resistant resin layer as an outer layer; a thermoplastic resin layer as an inner layer; a metal foil layer disposed between the heat resistant resin layer and the thermoplastic resin layer; a first adhesive layer disposed between the metal foil layer and the heat resistant resin layer; and a second adhesive layer disposed between the metal foil layer and the thermoplastic resin layer. The first adhesive layer is composed of a color adhesive agent composition containing a color pigment and an adhesive agent. The color adhesive agent composition contains a color pigment of 2 mass % or more and less than 5 mass % with respect to a solid component. The first adhesive layer is a coating of the color adhesive agent composition of 5 g/m2 to 10 g/m2. The first adhesive layer contains a color pigment of 0.25 g/m2 to 0.49 g/m2.

    MOLDING MATERIAL FOR PACKAGE
    7.
    发明申请
    MOLDING MATERIAL FOR PACKAGE 有权
    包装材料

    公开(公告)号：US20150104593A1

    公开(公告)日：2015-04-16

    申请号：US14511285

    申请日：2014-10-10

    Applicant: Showa Denko Packaging Co., Ltd.

    Inventor： Yuji MINAMIBORI ,  Honglin WANG

    IPC: H01M2/02

    CPC classification number: H01M2/0292 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/34 ,  B32B27/36 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/518 ,  B32B2307/554 ,  B32B2307/584 ,  B32B2307/714 ,  B32B2307/7242 ,  B32B2439/70 ,  B32B2439/80 ,  H01M2/0287 ,  Y10T428/1352 ,  Y10T428/25 ,  Y10T428/265 ,  Y10T428/3154

    Abstract: The present invention provides a molding material for package including a matte-coating layer having excellent formability, chemical resistance, solvent resistance, electrolytic solution resistance and printing property. The molding material for package (1) includes an outer base material layer (13) comprising a heat-resistant resin; an inner sealant layer (16) comprising a thermoplastic resin; a metal foil layer (11) disposed between the outer base material layer (13) and the inner sealant layer (16); and a matte-coating layer (14) formed on a side opposite to the metal foil layer (11) of the outer base material layer (13), wherein the matte-coating layer (14) is a multilayer including a bottom layer (14a) comprising a resin composition including a main agent resin including a phenoxy resin and a urethane resin, a curing agent, and solid fine particles; and an upper layer (14b) comprising a resin composition including a fluorine-containing resin.

    Abstract translation: 本发明提供一种包装成型材料，其具有优异的成形性，耐化学性，耐溶剂性，耐溶解性和印刷性。 用于包装（1）的成型材料包括包含耐热树脂的外部基材层（13）; 包含热塑性树脂的内部密封剂层（16） 设置在外基材层（13）和内密封层（16）之间的金属箔层（11）; 以及形成在与所述外基材层（13）的所述金属箔层（11）相反的一侧上的锍涂层（14），其中所述锍涂层（14）是包括底层（14a）的多层 ），其包含包含苯氧树脂和聚氨酯树脂的主剂树脂，固化剂和固体微粒的树脂组合物; 和包含含有含氟树脂的树脂组合物的上层（14b）。

    PACKAGING MATERIAL FOR BATTERY
    8.
    发明申请
    PACKAGING MATERIAL FOR BATTERY 有权

    公开(公告)号：US20220059891A1

    公开(公告)日：2022-02-24

    申请号：US17406082

    申请日：2021-08-19

    Applicant: SHOWA DENKO PACKAGING CO., LTD.

    Inventor： Yuji MINAMIBORI

    IPC: H01M50/193 ,  H01M50/122 ,  H01M50/198 ,  H01M50/195 ,  B32B27/08 ,  B32B27/32

    Abstract: A packaging material for a battery includes a base material layer as an outer layer, a sealant layer as an inner layer, and a barrier layer provided between the base material layer and the sealant layer. The sealant layer is composed of a single layer or a multi-layer. The sealant layer includes a first sealant layer serving as an innermost layer made of a propylene-based resin containing an ethylene-propylene copolymer. In the ethylene-propylene copolymer, a ratio Mw/Mn of a weight average molecular weight Mw to a number average molecular weight Mn, measured by a gel permeation chromatography (GPC), is 1 to 7, a melt flow rate measured at 230° C. at a load of 2.16 kg based on JIS K7210 is 5 g/10 min to 30 g/10 min, and a melting point calculated by a differential scanning calorimetry analysis is 120° C. to 135° C.

Patent Agency Ranking