公开(公告)号：US20190333859A1

公开(公告)日：2019-10-31

申请号：US16390889

申请日：2019-04-22

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Eric SAUGIER

IPC: H01L23/538 ,  H01L23/498 ,  H01L21/768

Abstract: The disclosure concerns a semiconductor chip, which may be an interposer, having conductive through vias having a parallelepipedal shape.

公开(公告)号：US20210043780A1

公开(公告)日：2021-02-11

申请号：US17081299

申请日：2020-10-27

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Alexandre MAS ,  Eric SAUGIER ,  Gaetan LOBASCIO ,  Benoit BESANCON

IPC: H01L31/0203 ,  H01L31/12 ,  H01L33/48 ,  H01L31/18 ,  B29C45/14 ,  H01L31/02 ,  H01L31/0232 ,  B29L31/34

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US20190316959A1

公开(公告)日：2019-10-17

申请号：US16377498

申请日：2019-04-08

Applicant: STMicroelectronics (Research & Development) Limited ,  STMicroelectronics (Grenoble 2) SAS

Inventor： William HALLIDAY ,  Eric SAUGIER ,  Roy DUFFY

IPC: G01J1/42 ,  G01J1/44 ,  G01S17/02 ,  G01S7/481 ,  H04N5/225

Abstract: An electronic module includes an ambient light sensor and a proximity sensor. The ambient light sensor includes an ambient light photodetector. The proximity sensor includes an infrared photoemitter, a reference infrared photodetector and another infrared photodetector. The ambient light sensor is arranged in a stack over the proximity sensor with a position that allows infrared photons transmitted by the infrared photoemitter to be received by the reference infrared photodetector.

公开(公告)号：US20230223277A1

公开(公告)日：2023-07-13

申请号：US18094775

申请日：2023-01-09

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Fanny LAPORTE ,  Ludovic FOURNEAUD ,  Eric SAUGIER

IPC: H01L21/48 ,  H01L23/13 ,  H01L23/498

CPC classification number: H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49838 ,  H01L24/48

Abstract: An integrated circuit chip carrier includes a wall surrounding a cavity. The wall includes one or more levels where each level is formed from a layer of a resin around a block. The block is made of a material different from the resin. The block is removed to open the cavity.

公开(公告)号：US20200020815A1

公开(公告)日：2020-01-16

申请号：US16581978

申请日：2019-09-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Alexandre MAS ,  Eric SAUGIER ,  Gaetan LOBASCIO ,  Benoit BESANCON

IPC: H01L31/0203 ,  B29C45/14 ,  H01L31/12 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/18

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US20190067180A1

公开(公告)日：2019-02-28

申请号：US16110121

申请日：2018-08-23

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

Inventor： David AUCHERE ,  Laurent SCHWARZ ,  Deborah COGONI ,  Eric SAUGIER

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/13 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L21/561 ,  H01L21/78 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/00 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/16235 ,  H05K1/185 ,  H05K2201/10621 ,  H05K2201/10636

Abstract: An electronic device includes a support wafer, an electronic chip and an encapsulating block for the electronic chip above the support wafer. The support wafer is provided with a first network of electrical connections and a second network of electrical connections formed solely by tracks. First electrical connection elements are interposed between first front electrical contacts of the electronic chip and rear electrical contacts of the first network. Second electrical connection elements are interposed between second front electrical contacts of the electronic chip and internal electrical contact zones of the tracks of the second network. The first network includes front external electrical contacts and the tracks exhibiting external electrical contact zones.

公开(公告)号：US20160284920A1

公开(公告)日：2016-09-29

申请号：US14671707

申请日：2015-03-27

Applicant: STMICROELECTRONICS PTE LTD ,  STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Eric SAUGIER ,  Wing Shenq WONG ,  David GANI

IPC: H01L31/167 ,  H01L31/18 ,  H01S5/022 ,  H01S5/183 ,  H01L31/02 ,  H01L25/16

CPC classification number: H01L31/167 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/18 ,  H01L2224/18 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01S5/02248 ,  H01S5/0226 ,  H01S5/02276 ,  H01S5/183 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A proximity sensor having a relatively small footprint includes a substrate, a semiconductor die, a light emitting device, and a cap. The light emitting device overlies the semiconductor die. The semiconductor die is secured to the substrate and includes a sensor area capable of detecting light from by the light emitting device. The cap also is secured to the substrate and includes a light barrier that prevents some of the light emitted by the light emitting device from reaching the sensor area. In one embodiment, the light emitting device and the semiconductor die are positioned on the same side of the substrate, wherein the light emitting device is positioned on the semiconductor die. In another embodiment, the light emitting device is positioned on one side of the substrate and the semiconductor die is positioned on an opposing side of the substrate.

Abstract translation: 具有相对较小占地面积的接近传感器包括衬底，半导体管芯，发光器件和帽。 发光器件覆盖半导体管芯。 半导体管芯被固定到基板上并且包括能够检测来自发光器件的光的传感器区域。 盖子也被固定到基板上并且包括防止由发光装置发射的一些光到达传感器区域的光栅。 在一个实施例中，发光器件和半导体管芯位于衬底的相同侧上，其中发光器件位于半导体管芯上。 在另一个实施例中，发光器件位于衬底的一侧，并且半导体管芯位于衬底的相对侧上。