公开(公告)号：US09159652B2

公开(公告)日：2015-10-13

申请号：US14183156

申请日：2014-02-18

Applicant: STMicroelectronics S.r.l.

Inventor： Concetto Privitera

IPC: H01L29/267 ,  H01L33/00 ,  H01L29/40 ,  H01L23/48 ,  H01L21/56 ,  H01L21/768 ,  H01L23/28 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/481 ,  H01L21/56 ,  H01L21/76877 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05009 ,  H01L2224/05572 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/29009 ,  H01L2224/29025 ,  H01L2224/29034 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/3003 ,  H01L2224/30051 ,  H01L2224/32058 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/81121 ,  H01L2224/81192 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/81855 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/9201 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05552

Abstract: An electronic device is described comprising at least one chip enclosed in a package, in turn provided with a metallic structure or leadframe having a plurality of connection pins, this chip having at least one first contact realized on a first face and at least one second contact realized on a second and opposite face of this chip. The chip comprises at least one through via crossing the whole section of the chip as well as a metallic layer extending from the second contact arranged on the first face, along walls of the at least one through via up to the second and opposite face in correspondence with an additional pad. The electronic device comprises at least one interconnection layer for the electrical and mechanical connection between the chip and the metallic structure having at least one portion realized in correspondence with the at least one through via so as to bring the second contact placed on the second face of the chip back on its first face. An assembly process of such an electronic device is also described.

Abstract translation: 描述了一种电子设备，其包括封装在封装中的至少一个芯片，其又设置有具有多个连接引脚的金属结构或引线框架，该芯片具有在第一面上实现的至少一个第一触点和至少一个第二触点 在该芯片的第二个相对面上实现。 芯片包括穿过芯片的整个部分的至少一个通孔以及从布置在第一面上的第二触点延伸的金属层，沿着至少一个通孔的壁延伸到对应的第二和相对面 附加一个垫。 电子设备包括用于芯片和金属结构之间的电气和机械连接的至少一个互连层，其具有与至少一个通孔相对应地实现的至少一个部分，以便将第二接触件放置在第二面 芯片回到了第一张脸上。 还描述了这种电子设备的组装过程。

公开(公告)号：US10964627B2

公开(公告)日：2021-03-30

申请号：US16696698

申请日：2019-11-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Concetto Privitera ,  Maurizio Maria Ferrara ,  Fabio Vito Coppone

IPC: H01L21/44 ,  H01L21/48 ,  H01L23/495 ,  H01L23/34 ,  H01L23/00

Abstract: Packaged semiconductor device having a frame, of conductive material; a body of semiconductor material, fixed to the frame through a first adhesive layer; a heatsink element, fixed to the body through a second adhesive layer; and a packaging mass surrounding the body and, at least partially, the frame and the heatsink element. The heatsink element is formed by a heatsink die facing, and coplanar to, a main face of the device and by a spacer structure, which includes a pair of pedestals projecting from the perimeter of the heatsink die towards the body and rest on the body.

公开(公告)号：US10535587B2

公开(公告)日：2020-01-14

申请号：US14961586

申请日：2015-12-07

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Concetto Privitera ,  Maurizio Maria Ferrara ,  Fabio Vito Coppone

IPC: H01L23/495 ,  H01L23/34 ,  H01L23/00

Abstract: Packaged semiconductor device having a frame, of conductive material; a body of semiconductor material, fixed to the frame through a first adhesive layer; a heat-sink element, fixed to the body through a second adhesive layer; and a packaging mass surrounding the body and, at least partially, the frame and the heat-sink element. The heat-sink element is formed by a heat-sink die facing, and coplanar to, a main face of the device and by a spacer structure, which includes a pair of pedestals projecting from the perimeter of the heat-sink die towards the body and rest on the body.

公开(公告)号：US08453917B1

公开(公告)日：2013-06-04

申请号：US13655555

申请日：2012-10-19

Applicant: STMicroelectronics S.r.l.

Inventor： Concetto Privitera ,  Cristiano Gianluca Stella

IPC: B23K31/02

CPC classification number: H05K3/3468 ,  H05K1/0206 ,  H05K1/112 ,  H05K3/303 ,  H05K3/3431 ,  H05K2201/09836 ,  H05K2201/10166 ,  H05K2203/044 ,  Y02P70/613

Abstract: A system includes a device of the surface-mounting type having an insulating package provided with a mounting surface and a contact pin exposed on the mounting surface. The device is attached to an insulating board including a gluing surface and an opposite surface. The process for manufacturing the system includes forming through holes a contact region on the gluing surface. The mounting surface is glued to the gluing surface with the contact pin aligned with the contact region. Wave soldering is performed to electrically join the device to the board by hitting the opposite surface with a wave of soldering paste to form, by capillary action with the soldering paste ascending in the through holes up to the overflow on the gluing surface, a conductive contact electrically connecting the contact pin of the electronic device through a solder connection to the contact region of the electronic board.

Abstract translation: 一种系统包括表面安装型的装置，其具有设置有安装表面的绝缘封套和暴露在安装表面上的接触销。 该装置附接到包括胶合表面和相对表面的绝缘板。 制造该系统的方法包括在胶合表面上形成通孔的接触区域。 安装表面胶合到胶合表面，接触销与接触区域对准。 进行波峰焊接以通过用焊膏波撞击相对表面来将该装置电连接到板上，通过毛细作用形成通过在通孔中上升至焊接表面上的溢流的焊膏的导电接触 通过焊接连接将电子设备的接触针电连接到电子板的接触区域。

公开(公告)号：US20140239502A1

公开(公告)日：2014-08-28

申请号：US14183156

申请日：2014-02-18

Applicant: STMicroelectronics S.r.l.

Inventor： Concetto Privitera

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/28 ,  H01L21/56

CPC classification number: H01L23/481 ,  H01L21/56 ,  H01L21/76877 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05009 ,  H01L2224/05572 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/29009 ,  H01L2224/29025 ,  H01L2224/29034 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/3003 ,  H01L2224/30051 ,  H01L2224/32058 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/81121 ,  H01L2224/81192 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/81855 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/9201 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05552

Abstract: An electronic device is described comprising at least one chip enclosed in a package, in turn provided with a metallic structure or leadframe having a plurality of connection pins, this chip having at least one first contact realized on a first face and at least one second contact realized on a second and opposite face of this chip. The chip comprises at least one through via crossing the whole section of the chip as well as a metallic layer extending from the second contact arranged on the first face, along walls of the at least one through via up to the second and opposite face in correspondence with an additional pad. The electronic device comprises at least one interconnection layer for the electrical and mechanical connection between the chip and the metallic structure having at least one portion realized in correspondence with the at least one through via so as to bring the second contact placed on the second face of the chip back on its first face. An assembly process of such an electronic device is also described.

Abstract translation: 描述了一种电子设备，其包括封装在封装中的至少一个芯片，其又设置有具有多个连接引脚的金属结构或引线框架，该芯片具有在第一面上实现的至少一个第一触点和至少一个第二触点 在该芯片的第二个相对面上实现。 芯片包括穿过芯片的整个部分的至少一个通孔以及从布置在第一面上的第二触点延伸的金属层，沿着至少一个通孔的壁延伸到对应的第二和相对面 附加一个垫。 电子设备包括用于芯片和金属结构之间的电气和机械连接的至少一个互连层，具有至少一个部分，其与至少一个通孔对应地实现，以使第二接触件位于第二面 芯片回到了第一张脸上。 还描述了这种电子设备的组装过程。

公开(公告)号：US20130126590A1

公开(公告)日：2013-05-23

申请号：US13655555

申请日：2012-10-19

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Concetto Privitera ,  Cristiano Gianluca Stella

IPC: B23K31/02

CPC classification number: H05K3/3468 ,  H05K1/0206 ,  H05K1/112 ,  H05K3/303 ,  H05K3/3431 ,  H05K2201/09836 ,  H05K2201/10166 ,  H05K2203/044 ,  Y02P70/613

Abstract: A system includes a device of the surface-mounting type having an insulating package provided with a mounting surface and a contact pin exposed on the mounting surface. The device is attached to an insulating board including a gluing surface and an opposite surface. The process for manufacturing the system includes forming through holes a contact region on the gluing surface. The mounting surface is glued to the gluing surface with the contact pin aligned with the contact region. Wave soldering is performed to electrically join the device to the board by hitting the opposite surface with a wave of soldering paste to form, by capillary action with the soldering paste ascending in the through holes up to the overflow on the gluing surface, a conductive contact electrically connecting the contact pin of the electronic device through a solder connection to the contact region of the electronic board.

Abstract translation: 一种系统包括表面安装型的装置，其具有设置有安装表面的绝缘封套和暴露在安装表面上的接触销。 该装置附接到包括胶合表面和相对表面的绝缘板。 制造该系统的方法包括在胶合表面上形成通孔的接触区域。 安装表面胶合到胶合表面，接触销与接触区域对准。 进行波峰焊接以通过用焊膏波撞击相对表面来将该装置电连接到板上，通过毛细作用形成通过在通孔中上升至焊接表面上的溢流的焊膏的导电接触 通过焊接连接将电子设备的接触针电连接到电子板的接触区域。