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公开(公告)号：US20230011141A1
公开(公告)日：2023-01-12
申请号：US17689026
申请日：2022-03-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junghun Lee , Kyoungjun Kim , Sun Kim , Seolyoung Choi
Abstract: A semiconductor light emitting device package includes a circuit board with an upper pad, a light emitting diode chip on the circuit board and having a first surface facing the circuit board and a second surface opposing the first surface, and the light emitting diode chip including a substrate, a semiconductor stack structure on the substrate that emits ultraviolet light, and electrodes connected to the semiconductor stack structure, connection bumps between the circuit board and the light emitting diode chip, the connection bumps connecting the upper pad and the electrodes, an underfill resin on the upper pad of the circuit board and covering at least a portion of a side surface of the light emitting diode chip, and a passivation layer on the light emitting diode chip and the underfill resin, the passivation layer covering the underfill resin and being spaced apart from the semiconductor stack structure.
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公开(公告)号：US12125954B2
公开(公告)日：2024-10-22
申请号：US17689026
申请日：2022-03-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junghun Lee , Kyoungjun Kim , Sun Kim , Seolyoung Choi
CPC classification number: H01L33/56 , H01L25/13 , H01L33/06 , H01L33/32 , H01L33/44 , H01L33/486 , H01L33/62 , H01L2933/0025 , H01L2933/005
Abstract: A semiconductor light emitting device package includes a circuit board with an upper pad, a light emitting diode chip on the circuit board and having a first surface facing the circuit board and a second surface opposing the first surface, and the light emitting diode chip including a substrate, a semiconductor stack structure on the substrate that emits ultraviolet light, and electrodes connected to the semiconductor stack structure, connection bumps between the circuit board and the light emitting diode chip, the connection bumps connecting the upper pad and the electrodes, an underfill resin on the upper pad of the circuit board and covering at least a portion of a side surface of the light emitting diode chip, and a passivation layer on the light emitting diode chip and the underfill resin, the passivation layer covering the underfill resin and being spaced apart from the semiconductor stack structure.
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公开(公告)号：US11688835B2
公开(公告)日：2023-06-27
申请号：US17142435
申请日：2021-01-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyoungjun Kim , Jaeyoo Jeong
CPC classification number: H01L33/504 , H01L27/156 , H01L33/60 , H01L33/62 , H05B45/28
Abstract: A flash LED package includes a substrate; a flash LED device in a first region of an upper surface of the substrate, and including first to fourth LED light sources that emit white light, blue light, green light, and red light, respectively; an optical sensor in a second region of the upper surface of the substrate, and having a light receiving region that detects a correlated color temperature; and a lens cover on the substrate to cover the flash LED device and the optical sensor, and having a lens unit in a region overlapping the first to fourth LED light sources.
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公开(公告)号：US11120735B2
公开(公告)日：2021-09-14
申请号：US16800023
申请日：2020-02-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyoungjun Kim , Dongsoo Lim
Abstract: A light emitting device package includes a first light emitting diode pixel, the first light emitting diode pixel including first light emitting diode chips that each emit light, and a first pixel driving integrated circuit under the first light emitting diode chips of the first light emitting diode pixel, the first pixel driving integrated circuit configured to drive the first light emitting diode chips based on an active matrix scheme, in which each of the first light emitting diode chips is driven using an entire one frame interval, and based on a pulse width modulation scheme, in which a time during which each of first driving currents is applied to a respective one of the first light emitting diode chips is controlled within the entire one frame interval.
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公开(公告)号：US11645971B2
公开(公告)日：2023-05-09
申请号：US17189635
申请日：2021-03-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyoungjun Kim
CPC classification number: G09G3/32 , H01L25/162 , H01L25/167 , G09G2300/08 , G09G2310/08 , G09G2320/0233 , G09G2320/064 , G09G2330/04 , G09G2330/12 , G09G2360/12 , H01L24/08 , H01L24/16 , H01L24/48 , H01L2224/08145 , H01L2224/08225 , H01L2224/16225 , H01L2224/48145 , H01L2224/48227 , H01L2924/12041 , H01L2924/14335
Abstract: A light-emitting diode (LED) package includes a first LED pixel including a plurality of first LED chips and a first pixel driving integrated circuit to drive the first LED chips according to an active matrix (AM) mode using entirety of a first frame period, wherein the first pixel driving integrated circuit includes a first storage area configured to store first frame data of each first LED chip, a second storage area configured to store duty ratio compensation data of each first LED chip, a pulse width modulation (PWM) data calculator configured to perform an arithmetic operation on the first frame data and the duty ratio compensation data to generate PWM data, and a PWM data generator configured to adjust an emission duty ratio based on the PWM data.
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Patent Agency Ranking
公开(公告)号：US20230039410A1
公开(公告)日：2023-02-09
申请号：US17730336
申请日：2022-04-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junghun Lee , Kyoungjun Kim , Sun Kim , Seolyoung Choi
Abstract: A semiconductor ultraviolet light emitting device package is provided. The semiconductor ultraviolet light emitting device package includes: a semiconductor ultraviolet light emitting device mounted on the first surface of the package substrate and configured to emit deep ultraviolet light including a wavelength in a range of 250 nm to 285 nm; a reflector disposed on the first surface of the package substrate to surround the semiconductor ultraviolet light emitting device, and including an inclined sidewall that defines an opening of the reflector, the semiconductor ultraviolet light emitting device disposed within the opening; and a light transmitting cover including a lower surface covering the opening and an upper surface opposite to the lower surface, wherein an antireflective layer is disposed on at least one from among the lower surface and the upper surface.
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公开(公告)号：US12288837B2
公开(公告)日：2025-04-29
申请号：US17569323
申请日：2022-01-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghun Lee , Kyoungjun Kim , Seolyoung Choi
Abstract: A semiconductor light emitting device package, includes: a ceramic substrate having first and second electrode structures; a light emitting diode chip mounted on the ceramic substrate, electrically connected to the first and second electrode structures, and configured to emit ultraviolet light; a sidewall structure disposed on the ceramic substrate, providing a cavity surrounding the light emitting diode chip, and including an alloy having a thermal expansion coefficient in a range of 2 to 10 ppm/° C. and a Young's modulus in a range of 100 to 300 Gpa; and a glass cover disposed on the sidewall structure to seal the cavity.
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公开(公告)号：US12144597B2
公开(公告)日：2024-11-19
申请号：US17471862
申请日：2021-09-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yongjoo Kwon , Kyoungjun Kim , Joonhyung Lee , Yeolho Lee , Seolyoung Choi
IPC: A61B5/024 , A61B5/00 , A61B5/026 , G01J1/42 , H05B47/155
Abstract: Provided is an apparatus configured to detect a light signal, the apparatus including a light source configured to radiate light toward an object, a light receiver configured to receive an ambient light and a transmitted light corresponding to the light radiated toward the object from the light source, at least one processor configured to control the light source to be turned off such that a first output signal is generated by the light receiver and control the light source to be turned on such that a second output signal is generated by the light receiver, and an operator configured to generate a transmitted light signal from which noise is removed by differentially operating the second output signal from the first output signal.
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公开(公告)号：US20220346657A1
公开(公告)日：2022-11-03
申请号：US17471862
申请日：2021-09-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yongjoo Kwon , Kyoungjun Kim , Joonhyung Lee , Yeolho Lee , Seolyoung Choi
IPC: A61B5/024 , H05B47/155 , G01J1/42 , A61B5/026 , A61B5/00
Abstract: Provided is an apparatus configured to detect a light signal, the apparatus including a light source configured to radiate light toward an object, a light receiver configured to receive an ambient light and a transmitted light corresponding to the light radiated toward the object from the light source, at least one processor configured to control the light source to be turned off such that a first output signal is generated by the light receiver and control the light source to be turned on such that a second output signal is generated by the light receiver, and an operator configured to generate a transmitted light signal from which noise is removed by differentially operating the second output signal from the first output signal.
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公开(公告)号：US20220320397A1
公开(公告)日：2022-10-06
申请号：US17569323
申请日：2022-01-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghun Lee , Kyoungjun Kim , Seolyoung Choi
Abstract: A semiconductor light emitting device package, includes: a ceramic substrate having first and second electrode structures; a light emitting diode chip mounted on the ceramic substrate, electrically connected to the first and second electrode structures, and configured to emit ultraviolet light; a sidewall structure disposed on the ceramic substrate, providing a cavity surrounding the light emitting diode chip, and including an alloy having a thermal expansion coefficient in a range of 2 to 10 ppm/° C. and a Young's modulus in a range of 100 to 300 Gpa; and a glass cover disposed on the sidewall structure to seal the cavity.
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