公开(公告)号：US20150155210A1

公开(公告)日：2015-06-04

申请号：US14337571

申请日：2014-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Joon LEE ,  Masato KAJINAMI ,  Yoshiaki YUKIMORI ,  Sang-Yoon KIM ,  Hui-Jae KIM ,  Byeong-Kuk PARK ,  Seung Dae SEOK ,  Jae Bong SHIN ,  Byeong Kap CHOI

IPC: H01L21/66 ,  H01L21/67 ,  H01L23/00

CPC classification number: H01L21/67259 ,  H01L21/67109 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/73204 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/7598 ,  H01L2224/81127 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/83127 ,  H01L2224/83204 ,  H01L2224/8385 ,  H01L2224/92125 ,  H05K13/046 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.

Abstract translation: 半导体制造装置可以包括：拾取单元，被配置为拾取半导体制造装置的第一区域中的芯片; 接合头，被配置为接收所拾取的芯片并且被配置为在所述半导体制造装置的第二区域中从所述第一区域移动到电路板的顶部; 和/或配置成在从第一区域移动到第二区域时检测电路板上的接合位置的光学单元。 半导体制造装置可以包括：接合头，包括用于加热芯片并将芯片接合到电路板上的加热器; 和/或与加热器相邻的冷却块，冷却液通过该冷却块流动。 当加热器产生热量时，冷却液体可从冷却块移除。 冷却液可以在加热器被冷却时供应到冷却块。

公开(公告)号：US20150129135A1

公开(公告)日：2015-05-14

申请号：US14532190

申请日：2014-11-04

Applicant: SEMES CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hang Lim LEE ,  Jong Jin WEON ,  Soon Hyun KIM ,  Seung Dae SEOK

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/75301 ,  H01L2224/75305 ,  H01L2224/75312 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/759 ,  H01L2224/81048 ,  H01L2224/81203 ,  H01L2224/83048 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/00014

Abstract: A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.

Abstract translation: 公开了具有该键合头的接合头和芯片接合装置。 接合头包括连接到用于传送模具的驱动部分的主体，安装到主体的下表面的板加热器和安装到板加热器的下表面并被构造成使用真空压力保持模具的夹头。 冷却通道形成在主体的下表面，并且冷却通道通过主体形成并与冷却通道连接，以将冷却流体供应到冷却通道中并从冷却通道回收冷却流体，从而冷却板 加热器。

公开(公告)号：US20230115922A1

公开(公告)日：2023-04-13

申请号：US17749436

申请日：2022-05-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong In LEE ,  In Hwa BAEK ,  Se-Hoon JANG ,  Dong Gap SHIN ,  Young Ho KIM ,  Seung Dae SEOK ,  Si Woong WOO ,  Jun Gyu LEE

IPC: H01J37/32

Abstract: A method for fabricating a semiconductor device includes loading a substrate into a process chamber, processing the substrate in the process chamber, using a plasma generated inside the process chamber, receiving a plasma light emitted from the plasma, selecting a target light from the plasma light, such that the target light is related to a surface condition of the substrate, and analyzing an intensity of the target light over time to monitor the surface condition of the substrate.

公开(公告)号：US20130248114A1

公开(公告)日：2013-09-26

申请号：US13826446

申请日：2013-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung Dae SEOK ,  Kyoungran KIM ,  Jae Bong SHIN ,  Hyung Sok YEO ,  Byung Joon LEE ,  Il Young HAN

IPC: H01L21/683

CPC classification number: H01L21/6838 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/75101 ,  H01L2224/75264 ,  H01L2224/75501 ,  H01L2224/75744 ,  H01L2224/81075 ,  H01L2224/81203 ,  H01L2224/81222 ,  H01L2224/81815 ,  H01L2924/01007

Abstract: A bonding apparatus includes at least one stage unit to support a circuit board having a chip thereon and a bonding unit coupled to the stage unit to define a chamber. The bonding unit has at least one inductive heater to heat to bond the chip to the circuit board, and the stage unit includes a vacuum generator configured to generate a vacuum between the stage unit and the circuit board. The vacuum is used to hold the circuit board on the stage unit during bonding of the chip to the circuit board. The induction heater may include one or more induction heating antennas, and the chamber may include one or more stage units.

Abstract translation: 接合装置包括至少一个级单元，用于支撑其上具有芯片的电路板和耦合到级单元的接合单元以限定腔室。 接合单元具有至少一个感应加热器以加热以将芯片结合到电路板，并且平台单元包括配置成在平台单元和电路板之间产生真空的真空发生器。 在将芯片接合到电路板时，真空用于将电路板保持在平台单元上。 感应加热器可以包括一个或多个感应加热天线，并且腔室可以包括一个或多个平台单元。

公开(公告)号：US20130139380A1

公开(公告)日：2013-06-06

申请号：US13690374

申请日：2012-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Joon LEE ,  Kyoungran KIM ,  Sang Yun KIM ,  Young Bum KIM ,  Seung Dae SEOK ,  Jae-Bong SHIN ,  Il-Young HAN ,  Min-Gyu KOH ,  Dong-Gil SHIM ,  Dong-soo LEE ,  Sang-Jean JEON

IPC: H05K3/32

CPC classification number: H05K3/32 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/751 ,  H01L2224/7525 ,  H01L2224/75264 ,  H01L2224/75266 ,  H01L2224/75501 ,  H01L2224/7565 ,  H01L2224/75804 ,  H01L2224/7598 ,  H01L2224/81011 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81222 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K3/3494 ,  H05K2201/10674 ,  H05K2203/101 ,  Y10T29/53174 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/48

Abstract: A chip bonding apparatus configured to bond chips to a circuit board using induction heating generated by an AC magnetic field may be provided. In particular, the chip bonding apparatus includes at least one stage unit configured to support a circuit board on which a chip is placed, a rotating unit configured to rotatively move the at least one stage unit at a desired angle, and a bonding unit including an induction heating antenna configured to perform induction heating such the chip is bonded to the circuit board.

Abstract translation: 可以提供一种芯片接合装置，其被配置为使用由AC磁场产生的感应加热将芯片接合到电路板。 特别地，芯片接合装置包括：至少一个级单元，被配置为支撑其上放置有芯片的电路板;旋转单元，被配置为使所述至少一个级单元以期望的角度旋转移动;以及接合单元， 感应加热天线被配置为执行感应加热，使得芯片被接合到电路板。