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    Semiconductor package including an image sensor and a holder with stoppers
    2.
    发明授权
    Semiconductor package including an image sensor and a holder with stoppers 有权
    半导体封装包括图像传感器和具有止动器的保持器

    公开(公告)号：US09324748B2

    公开(公告)日：2016-04-26

    申请号：US14152421

    申请日：2014-01-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hansung Ryu ,  Seungkon Mok

    IPC: H01L27/146 ,  H01L31/0203

    CPC classification number: H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A semiconductor package includes a substrate, an image sensor chip mounted on the substrate, a holder disposed on the substrate and surrounding the image sensor chip, and the holder has an inner surface facing the image sensor chip and an outer surface opposite to the inner surface. The semiconductor package further includes a transparent cover combined with the holder, and the transparent cover is spaced apart from and faces the substrate. The holder includes: a hole penetrating the holder from the inner surface to the outer surface. In addition, the semiconductor package further includes a first stopper disposed in the hole and a second stopper disposed at a position corresponding to the hole on the outer surface of the holder.

    Abstract translation: 半导体封装包括基板，安装在基板上的图像传感器芯片，设置在基板上并围绕图像传感器芯片的保持器，并且保持器具有面向图像传感器芯片的内表面和与内表面相对的外表面 。 半导体封装还包括与保持器组合的透明盖，并且透明盖与衬底间隔开并面对衬底。 保持器包括：从内表面到外表面穿过保持器的孔。 此外，半导体封装还包括设置在孔中的第一止动件和设置在与保持器的外表面上的孔对应的位置处的第二止动件。

    SEMICONDUCTOR PACKAGE
    3.
    发明申请
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20200350288A1

    公开(公告)日：2020-11-05

    申请号：US16680657

    申请日：2019-11-12

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jongho PARK ,  Kyungsuk Oh ,  Hyunki Kim ,  Yongkwan Lee ,  Sangsoo Kim ,  Seungkon Mok ,  Junyoung Oh ,  Changyoung Yoo

    IPC: H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L23/16

    Abstract: A semiconductor package including a circuit substrate including a plurality of interconnections; a first chip on the circuit substrate; a second chip stacked on the first chip; a plurality of first pads on the circuit substrate, the plurality of first pads overlapping the first chip; a plurality of bumps between the circuit substrate and the first chip; a plurality of second pads on an edge portion of a first side of the circuit substrate, the plurality of second pads electrically connected to the second chip through a conductive wire; an underfill that fills a space between the circuit substrate and the first chip; and a first dam on the circuit substrate, the first dam overlapping the first chip. The first dam includes a conductive material and overlaps at least one of the plurality of interconnections.

    Semiconductor package
    4.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US11101243B2

    公开(公告)日：2021-08-24

    申请号：US16680657

    申请日：2019-11-12

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jongho Park ,  Kyungsuk Oh ,  Hyunki Kim ,  Yongkwan Lee ,  Sangsoo Kim ,  Seungkon Mok ,  Junyoung Oh ,  Changyoung Yoo

    IPC: H01L25/065 ,  H01L23/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

    Abstract: A semiconductor package including a circuit substrate including a plurality of interconnections; a first chip on the circuit substrate; a second chip stacked on the first chip; a plurality of first pads on the circuit substrate, the plurality of first pads overlapping the first chip; a plurality of bumps between the circuit substrate and the first chip; a plurality of second pads on an edge portion of a first side of the circuit substrate, the plurality of second pads electrically connected to the second chip through a conductive wire; an underfill that fills a space between the circuit substrate and the first chip; and a first dam on the circuit substrate, the first dam overlapping the first chip. The first dam includes a conductive material and overlaps at least one of the plurality of interconnections.

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