公开(公告)号：US20210351330A1

公开(公告)日：2021-11-11

申请号：US17385193

申请日：2021-07-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hyun SIM ,  Yong II KIM ,  Ha Nul YOO ,  Ji Hye YEON ,  Jun Bu YOUN ,  Ji Hoon YUN ,  Su Hyun JO

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/60

Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.

公开(公告)号：US20180269360A1

公开(公告)日：2018-09-20

申请号：US15984959

申请日：2018-05-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Hye YEON ,  Han Kyu SEONG ,  Yong II KIM ,  Jung Sub KIM

IPC: H01L33/50 ,  F21K9/233 ,  H01L25/075 ,  F21Y113/00 ,  F21V23/00 ,  F21Y115/10 ,  F21Y105/10 ,  F21Y113/13 ,  H05B33/08 ,  F21W131/103

Abstract: A light emitting apparatus includes at least one first light source and at least one second light source. The at least one first light source and at least one second light source may be configured to emit white light and cyan light, respectively, such that a ratio of luminous flux of the white light to luminous flux of the cyan light ranges from 19:1 to 370:1, based on a common magnitude of electrical current being applied to each of the at least one first light source and the at least one second light source.

公开(公告)号：US20170148771A1

公开(公告)日：2017-05-25

申请号：US15226209

申请日：2016-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam Goo CHA ,  Yong II KIM ,  Wan tae LIM

IPC: H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/20 ,  H01L33/38 ,  H01L33/505 ,  H01L33/62 ,  H05K1/00 ,  H05K1/181 ,  H05K1/183 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/10106 ,  H05K2201/10674 ,  H05K2201/209 ,  H05K2203/104 ,  H05K2203/168 ,  Y02P70/611

Abstract: A light source module includes a circuit board having a plurality of chip mounting regions, the plurality of chip mounting regions respectively having at least one connection pad; at least one alignment component respectively disposed on the plurality of chip mounting regions, and having a convex or concave shape; and a plurality of LED chips respectively mounted on the plurality of chip mounting regions, respectively having at least one electrode electrically connected to the at least one connection pad, and respectively coupled to the at least one alignment component.

公开(公告)号：US20180374738A1

公开(公告)日：2018-12-27

申请号：US15869405

申请日：2018-01-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin Sub LEE ,  Han Kyu SEONG ,  Yong II KIM ,  Sung Hyun SIM ,  Dong gun LEE

IPC: H01L21/683 ,  H01L21/66 ,  H01L23/00 ,  H01L21/67 ,  H01L33/00 ,  H01L33/62 ,  H01L25/075

Abstract: A chip mounting method includes providing a first substrate including a light transmissive substrate having first and second surfaces, a sacrificial layer provided on the first surface, and a plurality of chips bonded to the sacrificial layer, obtaining first mapping data by testing the chips, the first mapping data defining coordinates of normal chips and defective chips among the chips, disposing a second substrate below the first surface, disposing the normal chips on the second substrate by radiating a first laser beam to positions of the sacrificial layer corresponding to the coordinates of the normal chips, based on the first mapping data, to remove portions of the sacrificial layer thereby separating the normal chips from the light transmissive substrate, and mounting the normal chips on the second substrate by radiating a second laser beam to a solder layer of the second substrate.

公开(公告)号：US20180261738A1

公开(公告)日：2018-09-13

申请号：US15973977

申请日：2018-05-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Nam Goo CHA ,  Wan Tae LIM ,  Yong II KIM ,  Hye Seok NOH ,  Eun Joo SHIN ,  Sung Hyun SIM ,  Hanul YOO

IPC: H01L33/58 ,  H01L33/50 ,  H01L33/44 ,  H01L33/00 ,  F21K9/275 ,  F21S8/02 ,  F21K9/237 ,  F21Y115/10 ,  F21Y103/10 ,  F21V23/00

CPC classification number: H01L33/58 ,  F21K9/237 ,  F21K9/275 ,  F21S8/026 ,  F21V23/005 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/0079 ,  H01L33/44 ,  H01L33/505 ,  H01L2224/11

Abstract: A semiconductor light emitting device includes: a light emitting structure including a first conductivity-type semiconductor layer and a second conductivity-type semiconductor layer respectively providing a first surface and a second surface, opposite to each other, of the light emitting structure, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, a region of the first conductivity-type semiconductor layer being open toward the second surface, and the first surface having a concavo-convex portion disposed thereon; a first electrode and a second electrode disposed on the region of the first conductivity-type semiconductor layer and a region of the second conductivity-type semiconductor layer, respectively; a transparent support substrate disposed on the first surface of the light emitting structure; and a transparent adhesive layer disposed between the first surface of the light emitting structure and the transparent support substrate.

公开(公告)号：US20200328329A1

公开(公告)日：2020-10-15

申请号：US16913201

申请日：2020-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hyun SIM ,  Yong II KIM ,  Ha Nul YOO ,  Ji Hye YEON ,  Jun Bu YOUN ,  Ji Hoon YUN ,  Su Hyun JO

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/60

Abstract: A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.