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    Thermoplastic resin composition
    5.
    发明授权
    Thermoplastic resin composition 失效
    热塑性树脂组合物

    公开(公告)号：US4885334A

    公开(公告)日：1989-12-05

    申请号：US120836

    申请日：1987-11-16

    申请人： Junji Mayumi ,  Hiroshi Omori

    发明人： Junji Mayumi ,  Hiroshi Omori

    IPC分类号： C08L51/00 ,  C08L63/00 ,  C08L67/00 ,  C08L71/12 ,  C08L77/00 ,  C08L101/00

    CPC分类号： C08L71/123 ,  C08L63/00 ,  C08L67/00 ,  C08L77/00 ,  Y10S525/905

    摘要： A thermoplastic resin composition is described, comprising (a) a polyphenylene ether resin, (b) a polar thermoplastic resin having a polar functional group, and (c) a modified block copolymer obtained by subjecting a hydrogenated block copolymer comprising an aromatic vinyl compound polymer block (A) and a conjugated diene compound polymer block (B) to graft polymerization in the presence of a monomer having an epoxy group. The resin composition is excellent in impact resistance, solvent resistance, and compatibility among the resinous components thereof.

    摘要翻译： 描述了一种热塑性树脂组合物，其包含（a）聚苯醚树脂，（b）具有极性官能团的极性热塑性树脂，和（c）通过将含有芳族乙烯基化合物聚合物的氢化嵌段共聚物 嵌段（A）和共轭二烯化合物聚合物嵌段（B）在具有环氧基的单体存在下接枝聚合。 树脂组合物的树脂成分的耐冲击性，耐溶剂性和相容性优异。

    Process for producing ethylene polymers
    6.
    发明授权
    Process for producing ethylene polymers 失效
    生产乙烯聚合物的方法

    公开(公告)号：US5214114A

    公开(公告)日：1993-05-25

    申请号：US827012

    申请日：1992-01-28

    申请人： Tadashi Takahashi ,  Junji Mayumi ,  Yoichi Maeda

    发明人： Tadashi Takahashi ,  Junji Mayumi ,  Yoichi Maeda

    IPC分类号： C08F4/658 ,  C08F2/06 ,  C08F4/60 ,  C08F10/00 ,  C08F10/02 ,  C12N5/06 ,  C12N5/10

    CPC分类号： C08F10/02

    摘要： A process for preparing an ethylene polymer which comprises polymerization of ethylene or ethylene and an .alpha.-olefin having 3 to 10 carbon atoms over a catalyst comprising the following components (A) and (B): (A) which is a solid component for a Ziegler catalyst obtained by bringing (2) into contact with (1) and bringing the contact product into contact with (3) and (4) wherein (1) is a solid catalyst component comprising (i)-(iii) where (i): MgX.sub.2, (ii): titanium tetraalkoxide and/or a polytitanate ester, (iii): a polymeric silicon compound, having a formula of ##STR1## R.sup.1 being a hydrocarbyl group, (2) is a halogenated Si compound; (3) is a halohydrocarbon; (4) is an organo-Al compound; and (B) is an organo-Al compound.An ethylene polymer having a moderately broad molecular weight distribution can be prepared in a high activity by use of the catalyst. The ethylene polymer is suited for the production of fibers or tapes.

    Olefin resin-based articles having gas barrier properties
    7.
    发明授权
    Olefin resin-based articles having gas barrier properties 失效
    具有阻气性的烯烃树脂基制品

    公开(公告)号：US5763088A

    公开(公告)日：1998-06-09

    申请号：US583859

    申请日：1996-01-11

    申请人： Tomomi Nakano ,  Masayuki Egami ,  Masafumi Hattori ,  Akira Mizuno ,  Junji Mayumi

    发明人： Tomomi Nakano ,  Masayuki Egami ,  Masafumi Hattori ,  Akira Mizuno ,  Junji Mayumi

    IPC分类号： C08J7/06 ,  B32B27/06 ,  B32B27/32

    CPC分类号： C08J7/06 ,  C08J2351/06 ,  Y10T428/31551 ,  Y10T428/31573 ,  Y10T428/31587 ,  Y10T428/31598 ,  Y10T428/31667 ,  Y10T428/31797

    摘要： An olefin resin-based article having good gas barrier properties is disclosed, comprising an .alpha.,.beta.-ethylenically unsaturated carboxylic acid-grafted polyolefin (e.g., maleic anhydride-grafted polypropylene) having formed thereon an inorganic oxide deposite film, wherein the grafted polyolefin has an unsaturated carboxylic acid unit concentration of from 0.01 to 10% by weight, with or without an anchor coat being provided between the grafted polyolefin and the inorganic oxide film. The article suffers from no reduction in gas barrier properties even when heat or stress is applied thereto and is therefore useful as a wrapping or packaging material in the production of pouch-packed foods and IC packages.

    摘要翻译： 公开了一种具有良好阻气性的基于烯烃树脂的制品，其包含在其上形成有无机氧化物沉积膜的α，β-烯属不饱和羧酸接枝聚烯烃（例如马来酸酐接枝聚丙烯），其中接枝聚烯烃具有 在接枝聚烯烃和无机氧化物膜之间提供了0.01至10重量％的不饱和羧酸单元浓度，具有或不具有锚固涂层。 该制品即使在施加热量或应力时也不会降低阻气性，因此在生产袋装食品和IC包装时可用作包装或包装材料。