公开(公告)号：US20240072239A1

公开(公告)日：2024-02-29

申请号：US18268394

申请日：2021-12-13

Applicant: TDK CORPORATION

Inventor： Yuhei HORIKAWA ,  Makoto ENDO ,  Takuya KAKIUCHI ,  Miyuki YANAGIDA ,  Yuki NAITO ,  Takahiro TASHIRO

IPC: H01M4/134 ,  H01M4/66 ,  H01M10/0525

CPC classification number: H01M4/134 ,  H01M4/661 ,  H01M10/0525

Abstract: A laminated body contains a first metal layer containing copper and a second metal layer containing nickel and directly laminated on the first metal layer. A full width at half maximum of an X-ray diffraction peak having the maximum intensity among at least one X-ray diffraction peak derived from a nickel-containing crystal in the second metal layer is 0.3° or more and 1.2° or less.

公开(公告)号：US20130130059A1

公开(公告)日：2013-05-23

申请号：US13677509

申请日：2012-11-15

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hideyuki SEIKE

IPC: H01B1/02 ,  C22C5/04

CPC classification number: H01B1/026 ,  C22C5/04 ,  C23C18/1651 ,  C23C18/34 ,  C23C18/44 ,  C23C18/54 ,  H01B1/02 ,  Y10T428/12701 ,  Y10T428/12722 ,  Y10T428/12778 ,  Y10T428/12861 ,  Y10T428/12889 ,  Y10T428/12903

Abstract: A coating is provided to a conductor, and has a layered structure of a palladium layer. The palladium layer has a crystal plane whose orientation rate is 65% or more.

Abstract translation: 向导体提供涂层，并且具有钯层的层状结构。 钯层具有取向率为65％以上的晶面。

公开(公告)号：US20200211951A1

公开(公告)日：2020-07-02

申请号：US16811018

申请日：2020-03-06

Applicant: TDK CORPORATION

Inventor： Takashi DAITOKU ,  Susumu TANIGUCHI ,  Akiko SEKI ,  Atsushi SATO ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hisayuki ABE

IPC: H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H01L21/48 ,  H05K3/40 ,  G06F3/044

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US20190035719A1

公开(公告)日：2019-01-31

申请号：US16038491

申请日：2018-07-18

Applicant: TDK CORPORATION

Inventor： Takashi DAITOKU ,  Susumu TANIGUCHI ,  Akiko SEKI ,  Atsushi SATO ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hisayuki ABE

IPC: H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H05K3/40 ,  H01L21/48

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US20190032219A1

公开(公告)日：2019-01-31

申请号：US16046359

申请日：2018-07-26

Applicant: TDK CORPORATION

Inventor： Makoto ORIKASA ,  Yuhei HORIKAWA ,  Yoshihiro KANBAYASHI ,  Hisayuki ABE

IPC: C23C18/16 ,  C23C18/32 ,  C23C18/38 ,  B32B27/08 ,  B32B27/36 ,  B32B27/18 ,  B32B15/09 ,  B32B15/20 ,  B32B3/30 ,  H01L23/52 ,  H01L27/15

Abstract: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.

公开(公告)号：US20140054768A1

公开(公告)日：2014-02-27

申请号：US13960228

申请日：2013-08-06

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Makoto ORIKASA ,  Hideyuki SEIKE ,  Yuhei HORIKAWA ,  Hisayuki ABE

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/05655 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13006 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/207 ,  H01L2224/05552

Abstract: The present invention relates to a terminal structure comprising: a base material 10; an external electrode 20 formed on the base material; an insulating coating layer 30 formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under-bump metal layer 70 filling the opening and covering part of the insulating coating layer; and a dome-shaped bump 85 covering the under-bump metal layer, wherein in a cross section along a lamination direction, a height Hbm at which the bump has a maximum diameter (Lbm) is lower than a maximum height Hu of the under-bump metal layer.

Abstract translation: 本发明涉及一种端子结构，包括：基材10; 形成在基材上的外部电极20; 绝缘涂层30，形成在基材和电极上，并具有露出电极的至少一部分的开口; 填充绝缘涂层的开口和覆盖部分的凸块下金属层70; 以及覆盖凸块下金属层的圆顶状凸起85，其中在沿着层叠方向的截面中，所述凸块具有最大直径（Lbm）的高度Hbm低于所述凸块下凸块的最大高度Hu， 凸块金属层。

公开(公告)号：US20210265256A1

公开(公告)日：2021-08-26

申请号：US17314187

申请日：2021-05-07

Applicant: TDK CORPORATION

Inventor： Takashi DAITOKU ,  Susumu TANIGUCHI ,  Akiko SEKI ,  Atsushi SATO ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hisayuki ABE

IPC: H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H01L21/48 ,  H05K3/40 ,  G06F3/044

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US20190043736A1

公开(公告)日：2019-02-07

申请号：US16038711

申请日：2018-07-18

Applicant: TDK CORPORATION

Inventor： Takashi DAITOKU ,  Susumu TANIGUCHI ,  Akiko SEKI ,  Atsushi SATO ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hisayuki ABE

IPC: H01L21/48 ,  H01L33/62 ,  H01L25/075

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

公开(公告)号：US20180114759A1

公开(公告)日：2018-04-26

申请号：US15791888

申请日：2017-10-24

Applicant: TDK Corporation

Inventor： Makoto ORIKASA ,  Yuhei HORIKAWA ,  Hisayuki ABE ,  Yoshihiro KANBAYASHI

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L21/3205

CPC classification number: H01L23/552 ,  H01L21/288 ,  H01L21/32051 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00

Abstract: Disclosed herein is an electronic component module that includes, an electronic component, a mold resin that seals the electronic component, a conductive film that covers the mold resin, and a protective film that covers the conductive film. The protective film includes a protective layer and a low reflective layer, and the low reflective layer is free from contacting the conductive film.

公开(公告)号：US20170130337A1

公开(公告)日：2017-05-11

申请号：US15415493

申请日：2017-01-25

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Yuhei HORIKAWA ,  Atsushi SATO ,  Hisayuki ABE

IPC: C23C18/16 ,  H01L23/00 ,  C23C18/54 ,  C23C28/02 ,  C23C18/42

CPC classification number: C23C18/1655 ,  C23C18/1637 ,  C23C18/1651 ,  C23C18/32 ,  C23C18/42 ,  C23C18/54 ,  C23C28/02 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05644 ,  H01L2924/01015 ,  H01L2924/14 ,  H01L2924/00

Abstract: A method of providing a coating on a conductor. The coating has a first layer containing palladium and a second layer containing gold from the conductor side. The first layer has an inner layer on the conductor side and an outer layer arranged nearer to the second layer than the inner layer, and the outer layer has a higher phosphorus concentration than the inner layer.