公开(公告)号：US20240192163A1

公开(公告)日：2024-06-13

申请号：US18517365

申请日：2023-11-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER

IPC: B01L3/00 ,  G01N27/414

CPC classification number: B01L3/502715 ,  G01N27/4148 ,  B01L2200/12 ,  B01L2200/16 ,  B01L2300/0645 ,  B01L2300/0663 ,  B01L2300/161

Abstract: In examples, an integrated circuit comprises a semiconductor die including a semiconductor substrate, a dielectric layer on the semiconductor substrate, and a metallization structure in the dielectric layer, in which the semiconductor substrate includes sensor circuitry coupled to the metallization structure, the dielectric layer having a sensing side facing away from the semiconductor substrate. The IC includes an insulation layer on the sensing side and a sensor terminal on the sensing side and coupled to the metallization structure. The IC device includes a restriction structure including an opening, in which the restriction structure encapsulates a fluid cavity on the sensing side and the sensor terminal is in the fluid cavity. The fluid cavity contains a functionalization material, configured to interact with a fluid in the fluid cavity to produce a signal detectable by the sensor circuitry via the sensor terminal.

公开(公告)号：US20210020528A1

公开(公告)日：2021-01-21

申请号：US16932128

申请日：2020-07-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Bernhard Peter LANGE

IPC: H01L23/10 ,  H01L23/053 ,  H01L23/16 ,  H01L23/00 ,  H01L21/56 ,  G01N27/28 ,  G01N27/416

Abstract: In some examples, a device comprises a substrate including a notch formed in a surface of the substrate and a semiconductor die positioned in the notch and including an electrochemical sensor on an active surface of the semiconductor die. The device also comprises a chemically inert member abutting the surface of the substrate and including an orifice in vertical alignment with the electrochemical sensor as a result of the semiconductor die being positioned in the notch. The device also comprises a compressed o-ring seal positioned between the chemically inert member and the active surface of the semiconductor die, the compressed o-ring seal circumscribing the electrochemical sensor.

公开(公告)号：US20250076093A1

公开(公告)日：2025-03-06

申请号：US18459056

申请日：2023-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Rujuta MUNJE ,  Tobias Bernhard FRITZ ,  Sreenivasan Kalyani KODURI

IPC: G01F1/64 ,  G01F1/002

Abstract: In examples, a sensing device comprises a semiconductor die including a device side and a fluid sensor in the device side. The device comprises a metal ring forming an opening over the fluid sensor, the metal ring having a top surface, a bottom surface, and an inner surface extending between the top surface and the bottom surface, and the bottom surface being on the device side. At least a portion of the inner surface abuts the device side being plated with a noble metal. The device includes a mold compound covering the semiconductor die and a first portion of the metal ring, in which a second portion of the metal ring having the top surface protrudes out of the mold compound and provides at least one of a cartridge interface or a tube interface.

公开(公告)号：US20230187390A1

公开(公告)日：2023-06-15

申请号：US17957352

申请日：2022-09-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Bernhard ZIEGLTRUM ,  Helmut RINCK

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/32 ,  H01L24/16 ,  H01L24/73 ,  H01L24/08 ,  H01L2224/73204 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16257 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/05657 ,  H01L2224/05111 ,  H01L2224/05169 ,  H01L2224/05541 ,  H01L2224/08502 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2924/1461

Abstract: In one example, a semiconductor die comprises: a semiconductor substrate having a circuit formed therein; one or more metal layers on the semiconductor substrate, the one or more metal layers coupled to the circuit; a metal interface structure on the one or more metal layers, in which the metal interface structure has opposite first and second surfaces, and the first surface faces the one or more metal layers; and a dissolvable metal layer on the second surface.

公开(公告)号：US20250083142A1

公开(公告)日：2025-03-13

申请号：US18428825

申请日：2024-01-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Ernst MUELLNER

IPC: B01L3/00 ,  G01N27/22

Abstract: Example packaged integrated circuit (IC) sensors comprise a semiconductor substrate; a back end of line (BEOL) structure on the semiconductor substrate, the BEOL structure including multiple microfluidic channels, each microfluidic channel including a flow control device configured to selectively permit and restrict flow of fluids; multiple fluid sensors including first and second fluid sensors in the BEOL structure; a main reaction reservoir on the BEOL structure configured to store a reagent, in which the reagent is operable to replicate a nucleic strand in a biological sample to cause a pH change, and the first fluid sensor is exposed in the main reaction reservoir; an auxiliary reservoir on the BEOL structure and coupled to the main reaction reservoir via a microfluid channel of the multiple microfluidic channels, in which the second fluid sensor is exposed in the auxiliary reaction reservoir; and a controller coupled to the first and second fluid sensors.

公开(公告)号：US20230183880A1

公开(公告)日：2023-06-15

申请号：US18081637

申请日：2022-12-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Bernhard ZIEGLTRUM

IPC: C25D7/00 ,  G01M3/16 ,  C25D3/46 ,  C25D3/48 ,  C25D5/48

CPC classification number: C25D7/00 ,  C25D3/46 ,  C25D3/48 ,  C25D5/48 ,  G01M3/16

Abstract: In examples, an apparatus comprises a substrate having opposite first and second surfaces. The substrate includes a first opening through the substrate. The substrate includes a first sealing layer covering an inner surface of the first opening, with the inner surface extending between the first and second surfaces. The substrate includes contact pads on the second surface. The apparatus also comprises a fluid sensor having a sensor surface facing the second surface and the first opening. The apparatus further includes metal interconnects coupled between the sensor surface and the contact pads. The apparatus also includes a second sealing layer between the second surface and the sensor surface, in which the second sealing layer surrounds the metal interconnects and includes a second opening below the first opening, and at least part of the sensor surface is exposed through the first and second openings.

公开(公告)号：US20180204767A1

公开(公告)日：2018-07-19

申请号：US15658039

申请日：2017-07-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Helmut RINCK ,  Kai-Alexander SCHACHTSCHNEIDER ,  Fromund METZ ,  Mario SCHMIDPETER ,  Javier Gustavo MOREIRA

IPC: H01L21/768 ,  H01L21/285 ,  H01L21/311 ,  H01L21/3213

CPC classification number: H01L21/76865 ,  H01L21/2855 ,  H01L21/31111 ,  H01L21/32139

Abstract: In accordance with at least one embodiment of the disclosure, a method of patterning platinum on a substrate is disclosed. In an embodiment, an adhesive layer is deposited over the substrate, a sacrificial layer is deposited over the adhesive layer, and a patterned photoresist layer is formed over the sacrificial layer. Then, the sacrificial layer is patterned utilizing the photoresist layer as a mask such that at least a portion of the adhesive layer is exposed. Subsequently, the top and sidewall surfaces of the patterned sacrificial layer and the first portion of the adhesive layer are covered by a platinum layer. Finally, the sacrificial layer and a portion of the platinum layer covering the top and sidewall surfaces of the sacrificial layer are etched, thereby leaving a remaining portion of the platinum layer to form a patterned platinum layer on the substrate.

公开(公告)号：US20230182141A1

公开(公告)日：2023-06-15

申请号：US17877610

申请日：2022-07-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Bernhard ZIEGLTRUM ,  Marcus ZIMNIK ,  Bernhard WOLF

IPC: B01L3/00

CPC classification number: B01L3/50855 ,  B01L3/50857 ,  B01L2300/0663 ,  B01L2300/0829

Abstract: A modular titer plate assembly includes a multi-well plate, a sensor assembly, and a mainboard. The multi-well plate includes a two-dimensional array of wells. The sensor assembly is detachably mounted to the multi-well plate. The sensor assembly includes a two-dimensional array of sensors aligned with the two-dimensional array of wells. The mainboard is detachably mounted to the sensor assembly.

公开(公告)号：US20200185282A1

公开(公告)日：2020-06-11

申请号：US16572303

申请日：2019-09-16

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Heinrich WACHINGER ,  Bernhard Peter LANGE

IPC: H01L21/66 ,  H01L23/00 ,  H01L21/67 ,  G01N33/18 ,  G01N27/07

Abstract: In examples, a method of manufacturing a fluid sensing package comprises coupling a semiconductor die to a first set of conductive terminals; positioning the semiconductor die within a socket, a fluid probe extending through a probe orifice in a lid of the socket; positioning a ring of the fluid probe on a fluid sensing portion of the semiconductor die by closing the lid of the socket; and using the fluid probe to apply fluid to an area of the fluid sensing portion circumscribed by the ring.